Nexperia USA Inc. BC846BQBZ

Overview

BC846BQBZ from Nexperia is an NPN general-purpose transistor in a leadless DFN1110D-3 (SOT8015) package, rated for 65 V V_CEO, 100 mA continuous collector current, and DC current gain (h_FE) of 200–450 at V_CE = 5 V and I_C = 2 mA. It serves as a compact switching or amplification element in space-constrained PCBs, especially where AOI-compatible solder joints and ultra-low profile (<0.5 mm height) are required.

For engineers reviewing the BC846BQBZ datasheet, BC846BQBZ pinout, BC846BQBZ application, or BC846BQBZ equivalent, this page delivers verified package mapping, validated terminal roles, confirmed thermal derating curves, and real-world use cases in low-voltage logic interfacing, LED driver stages, and signal conditioning circuits - all grounded in Nexperia's Rev. 1 (2021) product data sheet.

Technical Context

This transistor operates as a discrete NPN bipolar junction device with base-controlled current amplification. Its design supports linear amplification and saturated switching modes, with V_BE(sat) ≤ 900 mV at I_C = 100 mA / I_B = 5 mA and f_T = 100 MHz at V_CE = 5 V / I_C = 10 mA - enabling stable performance up to mid-frequency signal paths.

The DFN1110D-3 package features side-wettable flanks for automated optical inspection of solder joints, and its thermal resistance R_th(j-a) is 298 K/W on 70 µm FR4 copper - confirming suitability for thermally constrained consumer and industrial PCB layouts without forced airflow.

Key Specifications

Pinout & Package

BC846BQBZ uses the DFN1110D-3 (SOT8015) ultra-thin leadless package: 1.1 mm × 1.0 mm × 0.48 mm body, 0.65 mm pitch, side-wettable flanks, and 0.5 mm max height - optimized for high-density routing and AOI-enabled assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN general-purpose transistor applications.

Compared with BC846BW and MMBT3904LT1G, BC846BQBZ offers superior board-area efficiency, AOI compatibility, and 65 V/420 mW capability - making it the preferred choice for next-gen space- and reliability-critical embedded systems.

Availability

BC846BQBZ is available at Aetrix Electronics and suitable for LED driver stages, logic-level signal inverters, low-voltage relay drivers, and audio preamp stages requiring stable component supply, consistent parametric performance, and long-term production continuity.

Supply support for BC846BQBZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors - delivering discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.

The BC846xQB series targets space-constrained, AOI-driven SMT manufacturing environments, emphasizing ultra-small packaging, thermal efficiency, and consistent h_FE binning for predictable analog and switching behavior.

FAQ

Is BC846BQBZ pin-compatible with BC846BW or MMBT3904?

No - BC846BQBZ uses DFN1110D-3 (SOT8015) with side-wettable flanks and 0.65 mm pitch, while BC846BW uses SOT323 (2.1 mm × 1.3 mm, 0.65 mm pitch but no SWF) and MMBT3904LT1G uses SOT23-3 (3.0 mm × 1.4 mm, 0.95 mm pitch). Physical layout and solder stencil requirements differ significantly; direct replacement requires PCB redesign.

What is the maximum allowable ambient temperature for continuous 100 mA operation?

At 100 mA I_C, power dissipation is ~40 mW in saturation (V_CE(sat) ≈ 400 mV). With R_th(j-a) = 298 K/W on 70 µm FR4, junction rise is ~12 K - allowing continuous operation up to 138 °C ambient before reaching T_j = 150 °C limit. However, derating per Fig. 1 shows usable ambient range up to 75 °C at full 420 mW P_tot.

Does BC846BQBZ require a thermal pad connection to PCB ground?

Yes - the DFN1110D-3 package exposes the emitter (Pin 2) on the bottom thermal pad. Per Nexperia's layout guidance, this pad must be soldered to a minimum 10 mm² copper pour tied to system ground or low-impedance return to achieve rated P_tot = 420 mW and ensure reliable thermal conduction away from the die.

Can BC846BQBZ be used in linear amplifier configurations?

Yes - its h_FE stability over I_C (Fig. 8), low noise figure (NF = 10 dB at 1 kHz), and V_BE predictability (Fig. 9) support Class-A and emitter-follower linear operation. Bias networks must maintain V_CE > 1 V and I_C < 50 mA to avoid thermal runaway and stay within safe SOA boundaries defined in the datasheet.