Nexperia USA Inc. BC846BQCZ

Overview

BC846BQCZ from Nexperia is an AEC-Q101 qualified NPN general-purpose transistor in a DFN1412D-3 (SOT8009) leadless package, rated for 65 V V_CEO, 100 mA continuous collector current, and 200 mA peak pulse current. It delivers DC current gain (h_FE) of 200–450 at V_CE = 5 V and I_C = 2 mA, with low 0.48 mm profile and side-wettable flanks for AOI-compatible solder joint inspection. It serves as a compact, automotive-grade switching and amplification device in space-constrained PCBs.

For engineers reviewing the BC846BQCZ datasheet, BC846BQCZ pinout, BC846BQCZ application, or BC846BQCZ equivalent, this page provides verified package dimensions, thermal derating curves, saturation voltage behavior across temperature, h_FE vs. collector current plots, and AEC-Q101 qualification evidence - all critical for automotive signal conditioning, LED driver biasing, and low-power logic-level interface design.

Technical Context

This transistor operates as a discrete NPN switch or small-signal amplifier with fixed polarity and no internal biasing network. Its junction-to-ambient thermal resistance is 278 K/W on 70 µm copper FR4, enabling stable operation up to 150 °C junction temperature under defined PCB layout conditions.

The device exhibits V_BE ≈ 650–770 mV at I_C = 10 mA and V_CE = 5 V, with V_CE(sat) ≤ 400 mV at I_C = 100 mA / I_B = 5 mA (forced β = 20), and transition frequency f_T ≥ 100 MHz at V_CE = 5 V, I_C = 10 mA - confirming suitability for low-speed digital switching and audio-frequency amplification.

Key Specifications

Pinout & Package

DFN1412D-3 (SOT8009) is a 3-terminal, leadless, ultra-thin surface-mount package measuring 1.4 mm × 1.2 mm × 0.48 mm with side-wettable flanks for automated optical inspection. Its low 0.5 mm height enables stacking and high-density routing in portable and automotive modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN general-purpose transistor applications.

Compared with BC846B,315 and MMBT3904LT1G, BC846BQCZ uniquely combines AEC-Q101 qualification, side-wettable flanks for AOI, and 65 V rating in a 1.4 mm × 1.2 mm footprint - making it the only drop-in solution for production automotive PCBs requiring zero-defect solder joint verification.

Availability

BC846BQCZ is available at Aetrix Electronics and suitable for automotive interior lighting, industrial sensor signal conditioning, consumer portable audio biasing, and smart home relay driver stage applications requiring stable component supply and full traceability.

Supply support for BC846BQCZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, high-reliability discrete and logic devices for automotive, industrial, and mobile markets.

The BC846xQC series targets space-constrained, high-reliability applications demanding AEC-Q101 qualification, AOI compatibility, and consistent parametric performance - especially in automotive body electronics and industrial control modules.

FAQ

Is BC846BQCZ pin-compatible with standard SOT23 NPN transistors?

No - BC846BQCZ uses the DFN1412D-3 (SOT8009) leadless package with bottom-side terminals, while SOT23 has gull-wing leads. The pin numbering (1-B, 2-E, 3-C) matches electrically, but physical layout, soldering process, and PCB footprint are incompatible without redesign.

What is the maximum allowable PCB copper thickness for achieving the 450 mW P_tot rating?

The 450 mW total power dissipation rating assumes mounting on FR4 PCB with single-sided 70 µm (2 oz) copper, tin-plated, and standard footprint per Figure 1. Using thinner copper (e.g., 35 µm) reduces P_tot to 360 mW at 25 °C ambient.

Does BC846BQCZ support reflow soldering per JEDEC J-STD-020?

Yes - the DFN1412D-3 package is qualified for standard lead-free reflow profiles (peak 260 °C, 20–40 sec above 217 °C). Figure 13 provides recommended stencil and land pattern dimensions for reliable solder joint formation with side-wettable flank inspection.

How does h_FE vary across temperature for BC846BQCZ?

Per Figure 8, h_FE decreases by ~25% at −55 °C and increases by ~30% at 150 °C relative to 25 °C values (200–450). At I_C = 2 mA, typical h_FE is ~320 at 25 °C, ~240 at −55 °C, and ~420 at 150 °C - requiring bias network review for wide-temperature linear applications.