Infineon Technologies BC 847B B5003

Overview

BC847B from Nexperia is an NPN silicon general-purpose bipolar junction transistor designed for audio-frequency input stages and driver applications. It delivers high DC current gain (h_FE = 200–450 at I_C = 2 mA), low V_CE(sat) (max 200 mV at I_C = 10 mA / I_B = 0.5 mA), and low noise (F = 1.2–4 dB at 1 kHz), making it suitable for low-noise preamplifier and switching buffer circuits in automotive and industrial signal conditioning.

For engineers reviewing the BC847B datasheet, BC847B pinout, BC847B application, or BC847B equivalent, key selection criteria include its AEC-Q101 qualification, SOT23 package thermal resistance (R_thJS ≤ 240 K/W), 45 V V_CEO rating, 100 mA I_C, and group-B h_FE binning-critical for consistent biasing in multi-stage amplifiers and discrete logic interfaces.

Technical Context

The BC847B operates as a medium-speed, low-power NPN BJT optimized for linear amplification and saturated switching below 100 MHz. Its f_T of 250 MHz (typ) supports stable gain up to audio and low-RF frequencies, while its C_cb = 0.95 pF and C_eb = 9 pF enable predictable frequency response in common-emitter configurations.

It features complementary PNP counterparts (BC856–BC860 series), RoHS-compliant Pb-free construction, and junction temperature rating up to 150 °C-enabling use in thermally constrained PCB layouts without derating below 71 °C ambient.

Key Specifications

Pinout & Package

SOT23-3 plastic surface-mount package with standard JEDEC MO-215 outline, 1.3 mm × 2.9 mm footprint, and 0.95 mm height. Pin 1 = Emitter, Pin 2 = Base, Pin 3 = Collector.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN general-purpose transistor applications.

Compared with BC847BW and MMBT3904LT1G, the BC847B offers superior h_FE consistency for analog gain stability and optimal thermal resistance in standard SOT23 layouts-making it preferred for automotive and industrial linear applications requiring predictable DC behavior.

Availability

BC847B is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor interfaces, and consumer audio signal conditioning requiring stable component supply and long-term lifecycle assurance.

Supply support for BC847B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-grade components and energy-efficient solutions.

The BC846–BC850 family was engineered for cost-sensitive, high-yield AF amplification and switching-delivering AEC-Q101 compliance, tight h_FE binning, and low-noise performance in standardized SOT packages.

FAQ

Is BC847B pin-compatible with BC847A or BC847C?

Yes-BC847A, BC847B, and BC847C share identical SOT23-3 pinout (E-B-C) and mechanical footprint. Only DC current gain (h_FE) differs: Group A (110–220), Group B (200–450), Group C (420–800). No layout change is required when substituting within the same package variant.

What is the maximum allowable continuous collector current at 100 °C ambient?

At T_A = 100 °C, derating begins at T_S = 71 °C per datasheet. With R_thJA ≈ 350 K/W (typical for SOT23 on 2-layer board), P_tot drops to ~120 mW, limiting I_C to ~60 mA at V_CE = 5 V to maintain T_j ≤ 150 °C-verified via thermal simulation and JEDEC JESD51-2 testing.

Does BC847B support pulsed operation beyond its DC ratings?

Yes-pulse testing (t_p ≤ 10 ms, duty cycle ≤ 2%) permits I_C up to 200 mA. The permissible pulse load curve shows P_tot(max)/P_tot(DC) = 2.5 at t_p = 1 ms, enabling short-duration surge handling in motor commutation or solenoid drive without thermal runaway.

Can BC847B be used in place of BC847BL3?

No-BC847BL3 uses TSLP-3-1 package (0.8 × 1.6 mm), differing in thermal resistance (R_thJS ≤ 60 K/W vs 240 K/W) and solder pad layout. While electrically identical, mechanical incompatibility prevents direct replacement without PCB redesign and requalification per AEC-Q200.