Nexperia USA Inc. BC847BQB-QZ

Overview

BC847BQB-QZ from Nexperia is an AEC-Q101-qualified NPN general-purpose transistor in a DFN1110D-3 (SOT8015) leadless package, rated for 45 V V_CEO, 100 mA I_C, and DC current gain (h_FE) of 200–450 at V_CE = 5 V / I_C = 2 mA. It serves as a compact, high-reliability switching and amplification device in space-constrained automotive control modules, LED drivers, and sensor interface circuits.

For engineers reviewing the BC847BQB-QZ datasheet, BC847BQB-QZ pinout, BC847BQB-QZ application, or BC847BQB-QZ equivalent, this page delivers verified package dimensions, thermal derating curves, AOI-compatible side-wettable flank geometry, and automotive-grade qualification evidence - all critical for PCB layout, solder joint inspection, and functional safety-critical design validation.

Technical Context

This transistor operates as a discrete NPN bipolar junction device with base-controlled current amplification. Its DFN1110D-3 package features side-wettable flanks for automated optical inspection of solder joints and supports thermal dissipation up to 420 mW on 70 µm copper FR4 PCBs.

Key electrical behavior includes V_CEO = 45 V, V_BE(sat) ≤ 900 mV at I_C = 100 mA / I_B = 5 mA, and f_T = 100 MHz at V_CE = 5 V / I_C = 10 mA - enabling use in low-power signal switching and medium-frequency amplification stages where footprint and thermal performance are constrained.

Key Specifications

Pinout & Package

DFN1110D-3 (SOT8015) is a 3-terminal, ultra-thin (0.48 mm height), leadless plastic package with side-wettable flanks for AOI-compliant reflow soldering. Dimensions: 1.1 × 1.0 × 0.48 mm, 0.65 mm pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN general-purpose transistor applications.

Compared with BC847BW,115 and MMBT3904LT1G, BC847BQB-QZ uniquely combines AEC-Q101 qualification, side-wettable flanks for AOI, and 45 V/100 mA ratings in a 1.1 × 1.0 mm footprint - making it the sole option meeting automotive production requirements for space-constrained, optically inspectable switching.

Availability

BC847BQB-QZ is available at Aetrix Electronics and suitable for automotive body control modules, industrial sensor signal chains, and IoT power sequencing circuits requiring stable component supply, full traceability, and long-term lifecycle support.

Supply support for BC847BQB-QZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified components and advanced packaging technologies.

The BC847xQB-Q series belongs to Nexperia's AEC-Q101-qualified general-purpose transistor product line, engineered specifically for automotive and industrial applications demanding miniaturization, AOI compatibility, and extended temperature operation.

FAQ

Is BC847BQB-QZ pin-compatible with BC847B,115?

No. BC847BQB-QZ uses the DFN1110D-3 (SOT8015) leadless package with side-wettable flanks and a 1.1 × 1.0 mm footprint, while BC847B,115 uses the larger SOT23 package with gull-wing leads. The pin numbering (1-B, 2-E, 3-C) matches electrically, but mechanical mounting, soldering process, and thermal pad requirements differ significantly - direct replacement requires PCB redesign.

What is the maximum allowable PCB copper thickness for achieving the 420 mW P_tot rating?

The 420 mW total power dissipation rating for BC847BQB-QZ is specified for mounting on an FR4 PCB with single-sided 70 µm copper, tin-plated, using the standard footprint per Figure 17. Using thinner copper (e.g., 35 µm) reduces P_tot to 340 mW. Thicker copper layers (>70 µm) do not increase P_tot beyond 420 mW unless additional thermal vias or internal copper planes are implemented per Nexperia's thermal design guidelines.

Does BC847BQB-QZ support reflow soldering per JEDEC J-STD-020?

Yes. BC847BQB-QZ is qualified for lead-free reflow soldering per JEDEC J-STD-020D, with a peak temperature of 260 °C and 30-second duration above 217 °C. The DFN1110D-3 package outline and recommended stencil thickness (0.1 mm) are documented in Figure 17 of the datasheet to ensure reliable side-wettable flank wetting and void-free solder joints.

How does the h_FE variation affect base resistor selection in switching applications?

With h_FE ranging from 200 to 450 at I_C = 2 mA, base drive must be sized for the minimum gain (200) to guarantee saturation across all units. For a 100 mA collector load, I_B ≥ 0.5 mA is required - translating to a maximum base resistor of ≈10 kΩ when driven from a 5.5 V logic source. This ensures robust turn-on even at temperature extremes and process variation.