Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > Bipolar (BJT) > Single Bipolar Transistors

Nexperia USA Inc. BC856BQCZ

Name: BC856BQCZ
Brand: Nexperia USA Inc.
SKU: BC856BQCZ
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: BC856BQCZ

Manufacturer:: Nexperia USA Inc.

Category:: Single Bipolar Transistors

Package:: 3-XDFN Exposed Pad

Datasheet:: BC856BQCZ.pdf

Description:: TRANS PNP 65V 0.1A DFN1412D-3

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:22,184

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

BC856BQCZ from Nexperia is a PNP general-purpose bipolar junction transistor in a DFN1412D-3 (SOT8009) leadless package, rated for −65 V V_CEO, −100 mA I_C, and 450 mW P_tot on 70 µm FR4 PCB. It delivers h_FE = 220–475 at V_CE = −5 V and I_C = −2 mA, with side-wettable flanks for AOI-compatible solder joint inspection. It serves as a compact, low-profile switching and amplification device in space-constrained consumer and industrial PCBs.

For engineers reviewing the BC856BQCZ datasheet, BC856BQCZ pinout, BC856BQCZ application, or BC856BQCZ equivalent, this page provides verified package mapping, thermal derating curves, saturation voltage behavior across temperature, base-emitter voltage tracking, and validated alternatives for discrete PNP switching in high-density layouts.

Technical Context

This transistor operates as a current-controlled switch or linear amplifier with fixed polarity: emitter supplies current to collector under reverse-biased base-emitter junction. Its DFN1412D-3 footprint enables automated optical inspection via side-wettable flanks, while its 0.48 mm body height supports ultra-thin portable designs.

Thermal performance is defined by two power dissipation ratings-360 mW (35 µm copper) and 450 mW (70 µm copper)-and junction-to-ambient thermal resistance of 348 K/W and 278 K/W respectively. Transient thermal impedance data confirms suitability for pulsed operation up to 1 ms with peak I_C = −200 mA.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CEO	−65 V - Maximum safe collector-emitter voltage with base open; defines off-state blocking capability in switching circuits.
I_C	−100 mA - Continuous DC collector current rating; sets upper limit for steady-state load drive or bias current.
h_FE	220–475 at V_CE = −5 V, I_C = −2 mA - Confirmed DC current gain range enabling predictable base drive sizing for saturation.
V_CE(sat)	−650 mV max at I_C = −100 mA, I_B = −5 mA - Low saturation voltage minimizes conduction loss in high-efficiency switching nodes.
P_tot	450 mW on FR4 with 70 µm copper - Power handling capacity determines thermal margin in sealed enclosures or stacked boards.
C_c	2 pF typical at V_CB = −10 V - Low collector capacitance supports >100 MHz transition frequency (f_T) in RF-coupled or fast-switching stages.

Pinout & Package

BC856BQCZ uses the DFN1412D-3 (SOT8009) ultra-small leadless package: 1.4 mm × 1.2 mm × 0.48 mm body, 0.8 mm pitch, side-wettable flanks, and 0.5 mm max profile. Designed for reflow soldering with recommended stencil thickness of 0.1 mm.

Pin/Terminal	Circuit Role	Design Meaning
1	Base (B)	Current-controlled input node; requires −0.5 mA typical base drive to saturate at −10 mA collector load.
2	Emiter (E)	Common reference terminal for PNP topology; connects to higher-potential rail in high-side switch configurations.
3	Collector (C)	Output current sink node; handles up to −100 mA continuous load with <650 mV drop when fully saturated.

Key Features

Feature	Design Value
Side-wettable flanks	Enables 100% automated optical inspection (AOI) of solder joints without X-ray, reducing post-reflow defect escapes.
0.48 mm package height	Reduces vertical stack height in wearables, hearing aids, and slim IoT sensors where Z-dimension is constrained.
FR4-compatible thermal derating	Supports 450 mW dissipation on standard 70 µm copper PCBs-no thermal pad or heatsink required for ≤100 mA loads.
−6 V V_EBO	Allows direct interface with 3.3 V or 5 V logic without level-shifting resistors in emitter-follower configurations.

Applications

LED Driver Circuit

Level-Shifting Interface

Use Scenario: Driving 20 mA indicator LEDs from 3.3 V microcontroller GPIO pins in battery-powered handheld devices.

IC Role / Device Role / Timing Role: PNP switch sinking LED current to ground, with base driven low to turn on.

Use Value: Low V_CE(sat) (<650 mV) preserves forward voltage margin for red/green LEDs; small DFN footprint saves board area.

Use Scenario: Translating 1.8 V logic outputs to 5 V domains in mixed-voltage sensor subsystems.

IC Role / Device Role / Timing Role: Emitter-follower configured PNP providing inverted level shift with minimal propagation delay.

Use Value: −6 V V_EBO rating allows safe 5 V emitter bias; h_FE > 220 ensures stable current sourcing into 10 kΩ loads.

Power Sequencing Control

Low-Power Sensor Biasing

Use Scenario: Enabling/disabling 3.3 V analog supply rails during system boot-up using MCU-controlled enable signals.

IC Role / Device Role / Timing Role: High-side switch controlling V_CC delivery to op-amps or ADCs via emitter-connected supply rail.

Use Value: −65 V V_CEO provides ample margin against transient overshoot; side-wettable flanks ensure reliable solder joint integrity in production.

Use Scenario: Providing precise, temperature-stable bias current to MEMS microphone or thermistor signal chains.

IC Role / Device Role / Timing Role: Linear-mode current source with emitter degeneration resistor, leveraging h_FE consistency across −55 °C to 150 °C.

Use Value: V_BE drift of ~−2 mV/K enables predictable current variation; low noise figure (10 dB @ 1 kHz) avoids signal degradation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP general-purpose transistor applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
BC856B,060 (SOT23)	Same electrical specs but in larger SOT23-3 package; no side-wettable flanks; 1.3 mm height.	Lacks AOI support; unsuitable for ultra-thin or high-reliability automated inspection lines.	Select when legacy footprint compatibility or hand-soldering repairability is prioritized over miniaturization.
MMBT3906LT1G	Slightly lower h_FE (100–300), same V_CEO/I_C; DFN1006-3 (SOT883) package; 0.5 mm height but smaller 1.0 mm × 0.6 mm footprint.	Higher current density but reduced thermal mass; derates faster above 70 °C ambient.	Select when board area is more critical than thermal headroom, and AOI is not required.

Compared with BC856BQCZ, BC856B,060 offers mechanical robustness and serviceability at the cost of AOI capability and height, while MMBT3906LT1G trades thermal stability for extreme miniaturization-making BC856BQCZ optimal for AOI-enabled, thermally demanding, space-constrained PNP switching.

Availability

BC856BQCZ is available at Aetrix Electronics and suitable for LED driver circuits, level-shifting interfaces, and power sequencing control requiring stable component supply, consistent parametric performance, and AOI-verified assembly yield.

Supply support for BC856BQCZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable discrete, logic, and MOSFET solutions with focus on efficiency, miniaturization, and manufacturability.

The BC856xQC series targets high-volume, space-constrained applications needing AOI-compatible, ultra-thin PNP transistors with guaranteed h_FE spread and thermal robustness on standard FR4 PCBs.

FAQ

What is the maximum allowable junction temperature for BC856BQCZ?

The absolute maximum junction temperature (T_j) is 150 °C per IEC 60134 limiting values. Operation beyond this threshold risks permanent degradation of h_FE, leakage current, and long-term reliability-even if ambient temperature remains within −55 °C to 150 °C limits. Thermal design must ensure T_j stays below 150 °C under worst-case power dissipation and ambient conditions.

Does BC856BQCZ support reflow soldering with standard lead-free profiles?

Yes-Nexperia specifies compatibility with JEDEC J-STD-020D-compliant lead-free reflow profiles. The DFN1412D-3 package withstands peak temperatures up to 260 °C for ≤30 seconds. Recommended stencil thickness is 0.1 mm, and solder land pattern follows Figure 13 in the datasheet to ensure proper wetting of side-wettable flanks.

How does h_FE vary with temperature for BC856BQCZ?

h_FE increases with rising junction temperature: Fig. 8 shows typical gain rising from ~250 at −55 °C to ~400 at 25 °C and ~470 at 150 °C (at V_CE = −5 V, I_C = −2 mA). This positive temperature coefficient must be accounted for in precision current-source designs to avoid thermal runaway in parallel configurations.

Can BC856BQCZ replace BC856B in existing SOT23 designs?

No-BC856BQCZ uses DFN1412D-3 (SOT8009), which is not footprint-compatible with SOT23. Pad layout, pitch (0.8 mm vs. 1.9 mm), and soldering method differ fundamentally. Migration requires PCB redesign, stencil revision, and AOI program updates. Electrical equivalence exists, but mechanical interchangeability does not.

BC856BQCZ Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: BC856xQC

Package/Case:: 3-XDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Transistor Type:: PNP

Current - Collector (Ic) (Max):: 100 mA

Voltage - Collector Emitter Breakdown (Max):: 65 V

Vce Saturation (Max) @ Ib, Ic:: 650mV @ 5mA, 100mA

Current - Collector Cutoff (Max):: 15nA (ICBO)

DC Current Gain (hFE) (Min) @ Ic, Vce:: 220 @ 2mA, 5V

Power - Max:: 360 mW

Frequency - Transition:: 100MHz

Operating Temperature:: 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount, Wettable Flank

Supplier Device Package:: DFN1412D-3

BC856BQCZ FAQ

1.How can I place an order for BC856BQCZ through Aetrix?

Please submit a Request for Quotation (RFQ) for BC856BQCZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BC856BQCZ reliable?

The price and inventory of BC856BQCZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BC856BQCZ is usually 5 days.

3.What payment methods are accepted for BC856BQCZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BC856BQCZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BC856BQCZ?

BC856BQCZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BC856BQCZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BC856BQCZ?

For technical support, including BC856BQCZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BC856BQCZ requirements.

6.How does Aetrix verify that BC856BQCZ is sourced from the original manufacturer or authorized distributors?

All BC856BQCZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BC856BQCZ meets industry standards.

7.What is the process for return or replacement of BC856BQCZ?

All BC856BQCZ units undergo pre-shipment inspection (PSI). If there is an issue with BC856BQCZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BC856BQCZ part is unused and in its original packaging.

Return procedure for BC856BQCZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…