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Nexperia USA Inc. BC857AQBAZ
- Part No.:
- BC857AQBAZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Bipolar Transistors
- Package:
- 3-XDFN Exposed Pad
- Datasheet:
-
BC857AQBAZ.pdf
- Description:
- TRANS 45V 0.1A DFN1110D-3
- Quantity:
- Payment:
- Shipping:
Inventory:6,258
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Product details
Overview
BC857AQBAZ from Nexperia is a PNP general-purpose transistor in an ultra-small DFN1110D-3 (SOT8015) leadless SMD package with side-wettable flanks, rated for −45 V VCEO, −100 mA IC, and AEC-Q101 qualified for automotive use. It delivers hFE = 125–250 at VCE = −5 V and IC = −2 mA, with low 0.48 mm profile and AOI-compatible solder joints - deployed in space-constrained biasing, level-shifting, and load-switching circuits.
For engineers reviewing the BC857AQBAZ datasheet, BC857AQBAZ pinout, BC857AQBAZ application, or BC857AQBAZ equivalent, key selection criteria include its PNP polarity, −45 V breakdown rating, thermal derating on FR4 PCBs, side-wettable flank geometry for solder-joint inspection, and AEC-Q101 qualification status for automotive-grade reliability.
Technical Context
This device operates as a discrete PNP bipolar junction transistor optimized for linear amplification and saturated switching in low-power analog and digital interface stages. Its design centers on high current gain consistency across temperature (−55 °C to +150 °C), low VCE(sat) (≤ −650 mV at IC = −100 mA, IB = −5 mA), and tight parameter distribution within the BC857xQB series (A/B/C variants differentiated by hFE binning).
The DFN1110D-3 package enables high-density placement with 1.1 mm × 1.0 mm footprint and 0.5 mm max height, while side-wettable flanks support automated optical inspection of solder fillets. Thermal resistance Rth(j-a) is 368 K/W (35 µm Cu) or 298 K/W (70 µm Cu), directly linking PCB copper weight to safe operating power limits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | −45 V - Maximum collector-emitter voltage before breakdown under open-base condition; defines safe operating range in high-side switch or amplifier configurations. |
| IC | −100 mA - Continuous DC collector current rating; sets upper limit for steady-state load drive capability in switching applications. |
| hFE | 125–250 - DC current gain at VCE = −5 V, IC = −2 mA; determines base drive requirements for predictable saturation or linear operation. |
| VCE(sat) | ≤ −650 mV - Collector-emitter saturation voltage at IC = −100 mA, IB = −5 mA; directly impacts conduction loss and self-heating in switch-mode use. |
| Ptot | 340 mW - Total power dissipation at Tamb ≤ 25 °C on standard FR4 (35 µm Cu); establishes thermal boundary for ambient-limited designs without heatsinking. |
| Tj(max) | +150 °C - Maximum junction temperature; constrains allowable power dissipation under elevated ambient conditions via derating curves. |
| AEC-Q101 | Qualified - Certified per Automotive Electronics Council stress test standard for discrete semiconductors; supports deployment in automotive infotainment, body control, and sensor interface modules. |
Pinout & Package
DFN1110D-3 (SOT8015) is a 3-terminal, leadless, ultra-thin plastic package measuring 1.1 mm × 1.0 mm × 0.48 mm with side-wettable flanks for AOI-compatible reflow soldering.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Base (B) | Current-controlled input node; requires precise IB calculation to achieve target IC and avoid overdrive or cutoff in switching or amplification. |
| 2 | Emitter (E) | Common reference terminal for PNP operation; connected to higher potential rail in high-side switch topologies or bias networks. |
| 3 | Collector (C) | Output current terminal; sinks current toward emitter; polarity reversal versus NPN mandates careful schematic placement and net routing. |
Key Features
| Feature | Design Value |
|---|---|
| Side-wettable flanks | Enables reliable Automated Optical Inspection (AOI) of solder joint integrity on bottom-side terminals without X-ray. |
| Ultra-small footprint | 1.1 mm × 1.0 mm area - reduces PCB real estate by >50% vs. conventional SOT23, critical for wearables and compact modules. |
| AEC-Q101 qualification | Validated for automotive temperature cycling, humidity, and mechanical stress - eliminates need for additional qualification testing in Tier-1 BOMs. |
| Low package height | 0.48 mm max - allows stacking under shields or integration into ultra-low-profile assemblies such as slim sensors or battery management submodules. |
| High power density | 340 mW dissipation in 1.1 mm² area - achieves >300 mW/mm² thermal density, enabling efficient use of board space without compromising thermal margin. |
Applications
| Automotive Door Module Switching | Portable Sensor Bias Network |
|---|---|
Use Scenario: Driving small solenoids or LEDs in door lock actuators and mirror position controls within automotive body electronics. IC Role / Device Role / Timing Role: PNP high-side switch controlling current flow from battery rail to load; provides logic-level compatible turn-on/turn-off with minimal external components. Use Value: AEC-Q101 qualification ensures reliability across −40 °C to +105 °C ambient; low VCE(sat) minimizes heat generation in sealed enclosures with limited airflow. |
Use Scenario: Providing stable bias current to MEMS pressure or temperature sensors in battery-powered IoT nodes. IC Role / Device Role / Timing Role: Constant-current source configured in common-emitter or emitter-follower topology to set sensor operating point independent of supply variation. Use Value: Tight hFE binning (125–250) and low VBE drift (−2 mV/K) maintain sensor accuracy across temperature; ultra-small DFN package preserves PCB area for RF sections. |
| USB-C Port Power Path Control | Industrial PLC Input Conditioning |
Use Scenario: Enabling/disabling VBUS or auxiliary power rails in USB-C receptacle circuits based on CC line detection logic. IC Role / Device Role / Timing Role: Low-leakage, fast-turning PNP switch isolating downstream circuitry during fault or standby states. Use Value: Low ICBO (≤ −15 nA) prevents unintended leakage into protected domains; side-wettable flanks ensure solder joint reliability in high-volume automated assembly. |
Use Scenario: Level-shifting and signal inversion for 24 V industrial digital inputs interfacing with 3.3 V microcontrollers. IC Role / Device Role / Timing Role: Discrete PNP inverter stage converting sinking input signals to active-high logic levels with noise immunity. Use Value: −45 V VCEO withstands transients on factory floor wiring; robust ESD tolerance (per AEC-Q101) handles repeated hot-plug events without degradation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PNP general-purpose transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BC857BW,115 (Nexperia) | SOT323 package (larger 2.1 mm × 1.25 mm footprint, no side-wettable flanks); same electrical specs but non-AEC-Q101 rated. | Lacks automotive qualification and AOI support; suitable only for commercial-grade consumer or industrial boards without automotive compliance needs. | Select when cost sensitivity outweighs AOI capability and automotive qualification, and PCB layout permits larger package. |
| MMBT857LT1G (onsemi) | SOT-23 package; −45 V VCEO, −100 mA IC, hFE = 120–240; not AEC-Q101 qualified; slightly higher VCE(sat) (−700 mV typ). | Compatible in function but lacks automotive validation and side-wettable flanks; may require rework for AOI process compatibility. | Choose if sourcing diversification is required and AEC-Q101 is not mandated; verify solder-joint inspection method compatibility. |
Compared with BC857AQBAZ, BC857BW,115 trades AOI support and automotive qualification for lower unit cost and wider distributor availability, while MMBT857LT1G offers second-source assurance but requires process validation for solder-joint inspection and automotive deployment.
Availability
BC857AQBAZ is available at Aetrix Electronics and suitable for automotive body electronics, portable sensor modules, USB-C power path management, and industrial PLC input conditioning requiring stable component supply, long-term lifecycle continuity, and AEC-Q101-compliant traceability.
Supply support for BC857AQBAZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, reliable, and scalable discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.
The BC857xQB series belongs to Nexperia's AEC-Q101-qualified general-purpose transistor portfolio, engineered specifically for space-constrained automotive and industrial applications demanding robustness, AOI compatibility, and tight parametric consistency.
FAQ
What is the maximum allowable junction temperature for BC857AQBAZ?
The absolute maximum junction temperature (Tj) is +150 °C, as defined in the Absolute Maximum Ratings table. Operation above this temperature risks permanent device degradation. Derating must be applied per Figure 1: at 75 °C ambient, maximum power dissipation drops to ~250 mW on a standard FR4 PCB with 35 µm copper.
Does BC857AQBAZ support reflow soldering with standard lead-free profiles?
Yes - BC857AQBAZ is qualified for lead-free reflow per JEDEC J-STD-020. The DFN1110D-3 package uses a recommended stencil thickness of 0.1 mm and follows the footprint dimensions in Figure 17. Peak temperature must not exceed 260 °C, with time above 217 °C limited to 60–150 seconds per IPC/JEDEC standards.
How does the side-wettable flank design improve manufacturing yield?
Side-wettable flanks expose solderable metal along the package edge, enabling visible solder fillet formation during reflow. This allows standard AOI systems to inspect joint quality without X-ray, reducing false calls and increasing first-pass yield in high-volume SMT lines - particularly valuable for automotive contract manufacturers requiring zero-defect assembly.
Can BC857AQBAZ replace BC857BQB or BC857CQB in existing designs?
No - BC857AQBAZ has hFE = 125–250, while BC857BQB (220–475) and BC857CQB (420–800) offer higher and tighter current gain ranges. Substituting without circuit review may cause insufficient drive in saturation or excessive gain in linear mode, leading to timing errors or thermal instability.
BC857AQBAZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 3-XDFN Exposed Pad
- Packaging:
- Cut Tape (CT)
- Product Status:
- Discontinued at Digi-Key
- Transistor Type:
- -
- Current - Collector (Ic) (Max):
- 100 mA
- Voltage - Collector Emitter Breakdown (Max):
- 45 V
- Vce Saturation (Max) @ Ib, Ic:
- 400mV @ 5mA, 100mA
- Current - Collector Cutoff (Max):
- 15nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 110 @ 2mA, 5V
- Power - Max:
- 340 mW
- Frequency - Transition:
- -
- Operating Temperature:
- 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- DFN1110D-3
BC857AQBAZ FAQ
1.How can I place an order for BC857AQBAZ through Aetrix?
Please submit a Request for Quotation (RFQ) for BC857AQBAZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BC857AQBAZ reliable?
The price and inventory of BC857AQBAZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BC857AQBAZ is usually 5 days.
3.What payment methods are accepted for BC857AQBAZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BC857AQBAZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BC857AQBAZ?
BC857AQBAZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BC857AQBAZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BC857AQBAZ?
For technical support, including BC857AQBAZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BC857AQBAZ requirements.
6.How does Aetrix verify that BC857AQBAZ is sourced from the original manufacturer or authorized distributors?
All BC857AQBAZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BC857AQBAZ meets industry standards.
7.What is the process for return or replacement of BC857AQBAZ?
All BC857AQBAZ units undergo pre-shipment inspection (PSI). If there is an issue with BC857AQBAZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BC857AQBAZ part is unused and in its original packaging.
Return procedure for BC857AQBAZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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