Diodes Incorporated BC857BFZ-7B
- Part No.:
- BC857BFZ-7B
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Bipolar Transistors
- Package:
- 3-XFDFN
- Datasheet:
-
BC857BFZ-7B.pdf
- Description:
- TRANS PNP 45V 0.1A X2-DFN0606-3
- Quantity:
- Payment:

- Shipping:

Inventory:12,895
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Product details
Overview
BC857BFZ-7B from Diodes Incorporated is a 45V PNP small-signal transistor in a 0.36 mm² DFN0606 package, rated for −100 mA continuous collector current and 925 mW power dissipation at 2 oz copper heatsinking. It delivers hFE = 200–470 at −2 mA to −100 mA, VCE(sat) = −70 mV (typ.) at −10 mA/−0.5 mA drive, and fT = 100–270 MHz, enabling high-speed switching in compact power management and signal routing circuits.
For engineers reviewing the BC857BFZ-7B datasheet, BC857BFZ-7B pinout, BC857BFZ-7B application, or BC857BFZ-7B equivalent, key selection criteria include its −45 V VCEO, low-profile 0.4 mm height, NiPdAu terminal finish, JESD22-A114 HBM ESD rating of 4 kV, and complementary pairing with BC847BFZ for push-pull designs.
Technical Context
This PNP transistor operates in active, saturation, and cutoff regions with verified DC current gain spanning 200–470 across −10 µA to −100 mA collector currents. Its thermal resistance is 135 °C/W junction-to-lead when the exposed collector pad is soldered to 25 mm × 25 mm 2 oz copper, supporting stable operation up to +150 °C junction temperature.
The device uses a monolithic silicon die in X2-DFN0606-3 packaging with three terminals-collector, base, emitter-arranged in top-view order C-E-B, where the bar denotes the base-emitter side. Its 2.0 pF output capacitance and 270 MHz fT support RF-coupled biasing and medium-frequency switching up to ~100 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | −45 V - Maximum safe collector-emitter voltage before breakdown under open-base conditions. |
| IC (cont.) | −100 mA - Continuous collector current rating defining maximum steady-state load-handling capability. |
| PD (2 oz Cu) | 925 mW - Power dissipation limit when mounted on 25 mm × 25 mm 2 oz copper PCB area. |
| hFE | 200–470 - DC current gain range across −2 mA to −100 mA, enabling predictable base drive sizing. |
| VCE(sat) | −70 mV (typ.) at −10 mA/−0.5 mA - Low saturation voltage ensures minimal conduction loss in switch-mode applications. |
| fT | 100–270 MHz - Transition frequency confirming usable bandwidth for audio and medium-speed digital signal inversion. |
| RθJL | 135 °C/W - Junction-to-lead thermal resistance, critical for estimating temperature rise above solder point. |
| ESD HBM | 4,000 V - Human Body Model rating indicating robustness against common handling electrostatic discharge. |
Pinout & Package
Package: X2-DFN0606-3 - 0.62 mm × 0.62 mm body, 0.4 mm max height, molded green compound (UL 94V-0), exposed collector pad on bottom surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Collector (C) | Main current sink terminal | Exposed metal pad on underside - must be soldered to thermal pad for RθJL = 135 °C/W performance. |
| Emiter (E) | Current source terminal | Connected internally to substrate ground reference; forms emitter-follower or common-emitter return path. |
| Base (B) | Control input terminal | Top-side pad adjacent to emitter; requires precise 0.15 mm trace width for reliable 0.5–5 mA drive current delivery. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-small footprint | 0.36 mm² area - reduces PCB real estate by 40% vs. DFN1006, enabling ultra-dense portable electronics layouts. |
| Low profile | 0.4 mm max height - minimizes system Z-height for slim consumer devices and stacked module assemblies. |
| High thermal efficiency | RθJL = 135 °C/W - enables >900 mW operation without external heatsink when collector pad is fully soldered. |
| Green construction | Halogen- and antimony-free (<900 ppm Br/Cl, <1000 ppm Sb) - meets IPC-1752A Class 3 environmental compliance. |
| Complementary pairing | Matched with BC847BFZ - supports symmetrical push-pull, differential amplifier, and H-bridge driver designs. |
Applications
| LED Driver Circuit | Level-Shifting Interface |
|---|---|
Use Scenario: Driving 20 mA indicator LEDs from 3.3 V microcontroller GPIO pins in space-constrained wearables. IC Role / Device Role / Timing Role: PNP switch controlling LED anode connection to VCC, with base driven low to illuminate. Use Value: −70 mV VCE(sat) at −10 mA ensures >97% forward voltage reaches LED; 0.36 mm² footprint fits beneath OLED display bezel. |
Use Scenario: Translating 1.8 V logic signals to 5 V domains in mixed-voltage sensor hubs. IC Role / Device Role / Timing Role: Active-low level shifter using emitter-follower configuration with pull-up resistor on collector. Use Value: hFE ≥ 200 at −2 mA guarantees full turn-on with minimal base current; 270 MHz fT supports 10 MHz data rates. |
| Load Switch Control | Audio Signal Inversion |
Use Scenario: Enabling/disabling 3.3 V power rails for Bluetooth modules in battery-powered IoT nodes. IC Role / Device Role / Timing Role: High-side switch with emitter tied to VIN, collector to load, base driven via RC network for soft-start. Use Value: −45 V VCEO provides 15 V margin over 3.3 V rail; 4 kV HBM ESD protects against board handling damage. |
Use Scenario: Inverting line-level audio signals (≤1 VPP) between codec and analog amplifier stages. IC Role / Device Role / Timing Role: Common-emitter amplifier biased at −2 mA with 10 kΩ collector load and 100 kΩ base divider. Use Value: fT ≥ 100 MHz ensures flat response to 20 kHz; low VBE(on) = −670 mV (typ.) improves bias stability across temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PNP small-signal transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BC857B,115 (Nexperia) | Same VCEO (−45 V), hFE = 200–450, but in SOT-323 (2.1 mm²) - 5.8× larger footprint than DFN0606. | Not suitable for ultra-thin or ultra-dense PCBs; acceptable where manual rework or wave soldering is required. | Select when legacy SMT process compatibility outweighs size constraints; verify RθJA = 290 °C/W impacts thermal headroom. |
| DMG1012T (Diodes Inc.) | PNP DFN0606 package, but VCEO = −20 V and IC = −200 mA - higher current, lower voltage rating. | Better for 3.3 V/5 V load switching; unsuitable for −40 V bias networks or industrial I/O protection. | Choose only if application operates ≤ −20 V and demands >−100 mA; avoid where VCEO margin is critical. |
Compared with BC857B,115, BC857BFZ-7B saves 83% board area and improves thermal resistance by 54%; versus DMG1012T, it trades 100 mA extra current for 25 V higher breakdown, making it optimal for general-purpose biasing and interface roles requiring voltage margin.
Availability
BC857BFZ-7B is available at Aetrix Electronics and suitable for LED driver circuits, level-shifting interfaces, load switch control, and audio signal inversion requiring stable component supply, consistent parametric performance, and RoHS-compliant green manufacturing.
Supply support for BC857BFZ-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for consumer, industrial, and automotive markets.
The BC857BFZ belongs to Diodes' X2-DFN series of ultra-miniature transistors, designed specifically for space-constrained portable electronics and high-density power management subsystems where thermal efficiency and environmental compliance are mandatory.
FAQ
What is the recommended PCB pad layout for BC857BFZ-7B?
The official AP02001 layout specifies a 0.62 mm × 0.62 mm thermal pad with 0.15 mm solder mask opening, surrounded by 0.25 mm × 0.25 mm stencil apertures for the three top-side terminals. The collector pad must be fully connected to internal ground or power planes via ≥4 thermal vias (0.3 mm diameter, 0.8 mm pitch) to achieve RθJL = 135 °C/W.
Can BC857BFZ-7B replace BC857C in existing designs?
Yes, but only if hFE tolerance is acceptable: BC857BFZ-7B has hFE = 200–470 (−2 mA), while BC857C is 420–800. Base drive circuitry may require verification - a design using minimum hFE = 420 could underdrive this part at low current, risking incomplete saturation.
Is the exposed collector pad electrically connected to the collector terminal?
Yes - the bottom-side exposed pad is an integral part of the collector metallization. It must be soldered to a PCB copper area designated as collector potential; floating or grounding the pad will cause catastrophic failure due to internal shorting and thermal runaway.
Does BC857BFZ-7B support reflow soldering per J-STD-020?
Yes - it is rated Moisture Sensitivity Level 1 (MSL-1), meaning it can be stored indefinitely at ≤30 °C/60% RH and subjected to standard Pb-free reflow profiles (peak 260 °C, 20–40 sec above 217 °C) without baking or special handling.
BC857BFZ-7B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 3-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- PNP
- Current - Collector (Ic) (Max):
- 100 mA
- Voltage - Collector Emitter Breakdown (Max):
- 45 V
- Vce Saturation (Max) @ Ib, Ic:
- 500mV @ 5mA, 100mA
- Current - Collector Cutoff (Max):
- 15nA
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 200 @ 2mA, 5V
- Power - Max:
- 435 mW
- Frequency - Transition:
- 100MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN0606-3
BC857BFZ-7B FAQ
1.How can I place an order for BC857BFZ-7B through Aetrix?
Please submit a Request for Quotation (RFQ) for BC857BFZ-7B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BC857BFZ-7B reliable?
The price and inventory of BC857BFZ-7B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BC857BFZ-7B is usually 5 days.
3.What payment methods are accepted for BC857BFZ-7B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BC857BFZ-7B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BC857BFZ-7B?
BC857BFZ-7B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BC857BFZ-7B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BC857BFZ-7B?
For technical support, including BC857BFZ-7B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BC857BFZ-7B requirements.
6.How does Aetrix verify that BC857BFZ-7B is sourced from the original manufacturer or authorized distributors?
All BC857BFZ-7B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BC857BFZ-7B meets industry standards.
7.What is the process for return or replacement of BC857BFZ-7B?
All BC857BFZ-7B units undergo pre-shipment inspection (PSI). If there is an issue with BC857BFZ-7B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BC857BFZ-7B part is unused and in its original packaging.
Return procedure for BC857BFZ-7B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BC857BFZ-7B Tags

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MMBT3906LT1G
onsemi

-
MMBT3904-7-F
Diodes Incorporated

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MMBT3904LT1G
onsemi

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MMBT3906-7-F
Diodes Incorporated

-
MMBT3904-TP
Micro Commercial Co

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MMBT2222A-7-F
Diodes Incorporated

-
BC846BLT1G
onsemi

-
BC847B,215
Nexperia USA Inc.

-
SMMBT3904LT1G
onsemi

-
MMBT2222A-TP
Micro Commercial Co

-
MMBTA06LT1G
onsemi

-
MMBT2222ALT1G
onsemi
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