Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > Bipolar (BJT) > Single Bipolar Transistors

Nexperia USA Inc. BCP51-10,135

Name: BCP51-10,135
Brand: Nexperia USA Inc.
SKU: BCP51-10,135
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: BCP51-10,135

Manufacturer:: Nexperia USA Inc.

Category:: Single Bipolar Transistors

Package:: TO-261-4, TO-261AA

Datasheet:: BCP51-10,135.pdf

Description:: TRANS PNP 45V 1A SOT-223

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,360

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

BCP51-10,135 from Nexperia is a PNP medium power transistor in SOT223 (SC-73) surface-mount package, rated for −45 V V_CEO, −1 A continuous collector current, and 0.65 W power dissipation on standard FR4 PCB. It features h_FE = 63–160 at I_C = −150 mA, V_CE = −2 V, and is AEC-Q101 qualified for automotive linear voltage regulators and high-side switches.

For engineers reviewing the BCP51-10,135 datasheet, BCP51-10,135 pinout, BCP51-10,135 application, or BCP51-10,135 equivalent, this device serves as a thermally robust, medium-power PNP switching and amplification solution with validated automotive qualification, defined h_FE binning, and SOT223 thermal pad layout compatibility.

Technical Context

This transistor operates as a single PNP bipolar junction device optimized for medium-power linear and switching applications. Its SOT223 package integrates an exposed collector pad for enhanced thermal conduction and electrical grounding, supporting stable operation up to T_j = 150 °C.

It delivers DC current gain (h_FE) of 63–160 under −2 V V_CE and −150 mA I_C, with V_CE(sat) ≤ −0.5 V at I_C = −500 mA / I_B = −50 mA, and f_T = 145 MHz - enabling use in MOSFET drivers and audio/power amplifier stages requiring predictable gain and low saturation loss.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CEO	−45 V - Maximum safe collector-emitter blocking voltage in open-base configuration.
I_C	−1 A - Continuous DC collector current rating under standard PCB thermal conditions.
h_FE (−10 bin)	63–160 - Guaranteed DC current gain range at V_CE = −2 V, I_C = −150 mA, enabling precise bias design.
V_CE(sat)	≤ −0.5 V - Low saturation voltage at I_C = −500 mA / I_B = −50 mA, minimizing conduction loss in switch mode.
P_tot	0.65 W - Total power dissipation limit on FR4 PCB with standard footprint, defining thermal design margin.
f_T	145 MHz - Transition frequency confirming suitability for audio-frequency amplification and fast-switching driver circuits.
R_th(j-a)	192 K/W - Junction-to-ambient thermal resistance on standard FR4, guiding heatsinking requirements.

Pinout & Package

SOT223 (SC-73) plastic surface-mounted package with 4 leads: three functional terminals plus an exposed collector pad acting as thermal and electrical heatsink. Dimensions: 6.7 × 3.7 × 1.8 mm (L × W × H), with 1.2 mm pitch between pins 1–2 and 2–3.

Pin/Terminal	Circuit Role	Design Meaning
1	Base	Control input for forward-biased PNP operation; requires negative base current relative to emitter.
2	Collector	Main current sink terminal; electrically and thermally connected to exposed metal pad for PCB heat spreading.
3	Emitter	Reference terminal and current source node; typically tied to higher potential in high-side configurations.
4	Collector (exposed pad)	Dedicated thermal and low-inductance electrical connection to PCB copper pour; must be soldered for rated power handling.

Key Features

Feature	Design Value
AEC-Q101 qualification	Validated for automotive-grade reliability including temperature cycling, humidity, and mechanical stress testing.
h_FE selection (−10 bin)	Guaranteed 63–160 gain range enables consistent bias point setting across production lots.
Exposed collector pad	Reduces R_th(j-a) by up to 52% vs. standard SMT packages, supporting 0.65 W dissipation without external heatsink.
High peak current capability	I_CM = −2 A (tp ≤ 1 ms) allows robust surge handling in power management transients.
Low V_BE	≤ −1 V at I_C = −500 mA enables efficient drive from logic-level or microcontroller outputs.

Applications

Linear Voltage Regulators

High-Side Switches

Use Scenario: Used as pass transistor in adjustable positive LDOs or discrete series regulators supplying 3.3 V/5 V rails.

IC Role / Device Role / Timing Role: PNP pass element controlling output voltage via base-emitter bias; no timing function.

Use Value: Stable regulation under load steps due to controlled h_FE and low V_CE(sat), reducing dropout and thermal drift.

Use Scenario: Controls power delivery to automotive sensors or infotainment peripherals from battery rail.

IC Role / Device Role / Timing Role: High-side current switch turning on/off 12 V loads; no timing function.

Use Value: AEC-Q101 qualification ensures reliability in vehicle environments; exposed pad maintains T_j < 125 °C at full load.

Battery-Driven Devices

MOSFET Drivers

Use Scenario: Enables reverse-polarity protection and load switching in portable medical monitors or handheld test equipment.

IC Role / Device Role / Timing Role: Discrete PNP switch isolating battery from system during shutdown; no timing function.

Use Value: −45 V V_CEO accommodates 24 V battery systems with margin; low I_CBO (<100 nA) minimizes standby leakage.

Use Scenario: Drives N-channel power MOSFET gates in motor control half-bridges or DC-DC synchronous rectifiers.

IC Role / Device Role / Timing Role: Level-shifting current sink providing fast gate discharge path; no timing function.

Use Value: 145 MHz f_T supports >100 kHz switching; −2 A I_CM handles gate charge surges without saturation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP medium power transistor applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
BCX51-10,115	SOT89 package (3-lead), lower P_tot = 0.50 W on standard FR4, same −45 V/−1 A ratings and h_FE bin.	Limited to lower-power PCB layouts without thermal pad; unsuitable where SOT223 footprint or 0.65 W dissipation is required.	Select when board space is constrained and thermal demand is ≤0.5 W; verify pad layout compatibility.
BC51PA,115	SOT1061 package (3-terminal, 2×2×0.65 mm), higher thermal resistance (R_th(j-a) = 298 K/W), same −45 V/−1 A specs and h_FE bin.	Targeted at ultra-thin consumer devices; requires 4-layer PCB or large copper area to achieve comparable power handling.	Choose only for height-sensitive designs; confirm thermal derating per Figure 12 and mounting pad size.

Compared with BCX51-10,115 and BC51PA,115, the BCP51-10,135 offers superior thermal performance in SOT223 due to its dedicated collector pad, enabling higher sustained power in automotive and industrial regulators without board-level redesign.

Availability

BCP51-10,135 is available at Aetrix Electronics and suitable for linear voltage regulators, high-side switches, and MOSFET drivers requiring stable component supply in automotive, industrial control, and battery-powered systems.

Supply support for BCP51-10,135 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert specializing in high-performance, reliable discrete and logic devices, with leadership in automotive-qualified components and energy-efficient solutions.

The BCP51 series belongs to Nexperia's medium-power bipolar transistor product line, designed specifically for robust, thermally efficient switching and amplification in automotive power management and industrial linear regulation.

FAQ

What is the h_FE range for BCP51-10,135 and how is it binned?

The BCP51-10,135 is binned to the "−10" h_FE group, guaranteeing a DC current gain of 63–160 at V_CE = −2 V and I_C = −150 mA. This binning is verified per unit during final test and marked as "BCP51/10" on the device body. No additional sorting or screening is required for designs relying on this gain window.

Can BCP51-10,135 replace BCX51-10,115 in existing SOT89 layouts?

No - BCP51-10,135 uses SOT223 (4-lead, 6.7×3.7 mm), while BCX51-10,115 uses SOT89 (3-lead, 4.6×2.6 mm). Footprint, pin assignment (SOT223: 1=base, 2=collector, 3=emitter, 4=collector pad; SOT89: 1=emitter, 2=collector, 3=base), and thermal pad geometry are incompatible. PCB redesign is mandatory for substitution.

Is the exposed collector pad on BCP51-10,135 electrically isolated?

No - Pin 2 (collector) and Pin 4 (exposed pad) are internally shorted and share the same collector potential. The pad must be soldered to a PCB copper pour connected to the collector net to achieve rated power dissipation and thermal performance. Leaving it unconnected de-rates P_tot to 0.65 W → 0.35 W.

Does BCP51-10,135 support wave soldering?

No - Nexperia explicitly states "Reflow soldering is the only recommended soldering method" for BCP51-10,135 (Section 11, Data Sheet Rev. 9). Wave soldering risks thermal damage to the die and delamination due to SOT223's exposed pad construction and thermal mass asymmetry. Reflow profile must follow JEDEC J-STD-020 Class 3 guidelines.

BCP51-10,135 Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: -

Package/Case:: TO-261-4, TO-261AA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Transistor Type:: PNP

Current - Collector (Ic) (Max):: 1 A

Voltage - Collector Emitter Breakdown (Max):: 45 V

Vce Saturation (Max) @ Ib, Ic:: 500mV @ 50mA, 500mA

Current - Collector Cutoff (Max):: 100nA (ICBO)

DC Current Gain (hFE) (Min) @ Ic, Vce:: 63 @ 150mA, 2V

Power - Max:: 1 W

Frequency - Transition:: 145MHz

Operating Temperature:: 150°C (TJ)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: SOT-223

BCP51-10,135 FAQ

1.How can I place an order for BCP51-10,135 through Aetrix?

Please submit a Request for Quotation (RFQ) for BCP51-10,135 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BCP51-10,135 reliable?

The price and inventory of BCP51-10,135 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BCP51-10,135 is usually 5 days.

3.What payment methods are accepted for BCP51-10,135?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BCP51-10,135 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BCP51-10,135?

BCP51-10,135 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BCP51-10,135 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BCP51-10,135?

For technical support, including BCP51-10,135 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BCP51-10,135 requirements.

6.How does Aetrix verify that BCP51-10,135 is sourced from the original manufacturer or authorized distributors?

All BCP51-10,135 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BCP51-10,135 meets industry standards.

7.What is the process for return or replacement of BCP51-10,135?

All BCP51-10,135 units undergo pre-shipment inspection (PSI). If there is an issue with BCP51-10,135, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BCP51-10,135 part is unused and in its original packaging.

Return procedure for BCP51-10,135:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…