Infineon Technologies BCP5116E6433HTMA1

Overview

BCP5116E6433HTMA1 from Infineon Technologies is a PNP silicon bipolar junction transistor designed for audio-frequency driver and output stages in linear amplification circuits. It features a 45 V V_CEO, 1 A continuous collector current, 0.5 V typical V_CE(sat) at I_C = 500 mA / I_B = 50 mA, h_FE of 100–250 (at I_C = 150 mA), and SOT-223 surface-mount package. It is used in automotive amplifier bias networks and industrial DC-DC converter feedback paths.

For engineers reviewing the BCP5116E6433HTMA1 datasheet, BCP5116E6433HTMA1 pinout, BCP5116E6433HTMA1 application, or BCP5116E6433HTMA1 equivalent, key selection criteria include guaranteed h_FE range at high I_C, low V_CE(sat) under switching conditions, thermal resistance R_thJS ≤ 15 K/W, AEC-Q101 qualification, and complementary NPN pairing with BCP54–BCP56 series.

Technical Context

This PNP transistor operates in linear and saturated modes for analog signal buffering and power stage control. Its design supports stable DC biasing in Class AB audio drivers and fast turn-off in pulse-width modulated load switches due to f_T = 125 MHz and low base-emitter saturation voltage (V_BE(sat) ≤ 1 V at I_C = 500 mA).

The device meets AEC-Q101 stress testing requirements for automotive electronics, including temperature cycling, HTRB, and ESD robustness. Its SOT-223 package enables direct PCB thermal coupling to copper pour, supporting 2 W total dissipation at T_S ≤ 120°C with validated R_thJS ≤ 15 K/W.

Key Specifications

Pinout & Package

SOT-223 package with exposed thermal pad (pin 4), standardized for high-power surface-mount thermal performance. Pin 1 = Base, Pin 2 = Collector, Pin 3 = Emitter, Pin 4 = Collector (tab). All pins are solderable; pin 4 provides primary thermal path to PCB.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP general-purpose transistor applications.

Compared with BCP5116E6433HTMA1, BCP51-16 offers identical performance in a different reel configuration, while MMBT5401 trades thermal capability and current rating for smaller footprint-making it unsuitable for automotive or industrial power-stage roles.

Availability

BCP5116E6433HTMA1 is available at Aetrix Electronics and suitable for automotive audio systems, industrial power supply feedback networks, LED constant-current drivers, and programmable logic controller enable circuits requiring stable component supply across extended product lifecycles.

Supply support for BCP5116E6433HTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.

This transistor belongs to Infineon's BCP5x family of AEC-Q101-qualified PNP/NPN complementary transistors, engineered specifically for robust, thermally efficient linear and switching applications in automotive and industrial power systems.

FAQ

Is BCP5116E6433HTMA1 pin-compatible with BCP51-16?

Yes-both share identical SOT-223 pinout (Pin 1 = Base, Pin 2 = Collector, Pin 3 = Emitter, Pin 4 = Collector tab) and identical die characteristics. The suffix "E6433HTMA1" denotes Infineon's specific tape-and-reel packaging (4000 pcs/reel, 180 mm reel), whereas "BCP51-16" indicates an earlier packaging variant (1000 pcs/reel, 180 mm reel); no electrical or mechanical differences exist between the silicon dies.

What is the maximum allowable PCB copper area for thermal pad (Pin 4)?

Infineon recommends ≥ 100 mm² of 2-oz copper connected directly to Pin 4 for full 2 W power dissipation at T_S ≤ 120°C. Thermal vias (≥ 6 × 0.3 mm diameter) should connect the pad to inner-layer ground planes. Smaller copper areas reduce permissible power: 50 mm² supports ~1.4 W; 25 mm² supports ~0.9 W, per AN077 thermal modeling guidelines.

Does this transistor support operation above 125°C junction temperature?

No-the absolute maximum junction temperature is 150°C, but the device is characterized and qualified only up to T_j = 125°C for parametric guarantees. At 150°C, h_FE degrades by ~40%, V_CE(sat) increases by ~25%, and leakage (I_CBO) rises to 20 µA. Operation above 125°C requires derating and validation per AEC-Q101 accelerated life test protocols.

Can BCP5116E6433HTMA1 replace BC807 in the same footprint?

No-BC807 uses SOT-23 (3-pin), while BCP5116E6433HTMA1 uses SOT-223 (4-pin with thermal tab). The pin count, pitch, and thermal pad make them mechanically incompatible. Electrically, BCP5116E6433HTMA1 has higher current (1 A vs. 0.5 A) and lower V_CE(sat) (0.5 V vs. 0.7 V), but PCB redesign is mandatory for substitution.