My Inquiry
My Account
Nexperia USA Inc. BCP52,135
- Part No.:
- BCP52,135
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Bipolar Transistors
- Package:
- TO-261-4, TO-261AA
- Datasheet:
-
BCP52,135.pdf
- Description:
- TRANS PNP 60V 1A SOT-223
- Quantity:
- Payment:
- Shipping:
Inventory:6,970
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BCP52,135 from Nexperia is a PNP medium-power bipolar junction transistor in SOT223 (SC-73) surface-mount package, rated for −60 V VCEO, −1 A continuous collector current, and 0.65 W power dissipation on standard FR4 PCB. It features three hFE gain selections (63–250), AEC-Q101 qualification, and an exposed collector pad for thermal and electrical conduction. It is used in linear voltage regulators and high-side switching circuits requiring robust thermal performance.
For engineers reviewing the BCP52,135 datasheet, BCP52,135 pinout, BCP52,135 application, or BCP52,135 equivalent, this page delivers verified specifications, validated SOT223 pin mapping, automotive-grade reliability context, and real-world use cases in battery-driven power management and MOSFET driver stages - all grounded in Nexperia's Rev. 9 product data sheet.
Technical Context
The BCP52,135 operates as a silicon PNP BJT with fixed-emitter configuration and base-controlled current amplification. Its design supports linear regulation and switching modes, with VCE(sat) ≤ −0.5 V at IC = −500 mA / IB = −50 mA and fT = 145 MHz at VCE = −5 V / IC = −50 mA.
Thermal behavior is defined by Rth(j-a) = 192 K/W (standard footprint), Rth(j-sp) = 16 K/W, and transient impedance curves showing strong pulse-handling capability up to 2 ms. The device is qualified per AEC-Q101 for automotive underhood environments with Tj ≤ 150 °C and Tstg = −65 to +150 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | −60 V: Maximum safe collector-emitter blocking voltage in open-base configuration. |
| IC | −1 A: Continuous DC collector current rating under specified PCB thermal conditions. |
| Ptot | 0.65 W: Total power dissipation limit on single-layer FR4 with standard footprint. |
| hFE | 63–250: DC current gain range at VCE = −2 V, IC = −150 mA; selection-dependent. |
| VCE(sat) | ≤ −0.5 V: Collector-emitter saturation voltage ensures low conduction loss in switching applications. |
| fT | 145 MHz: Transition frequency confirms suitability for moderate-speed switching and analog amplification. |
| Rth(j-sp) | 16 K/W: Low junction-to-solder-point thermal resistance enables efficient heat transfer to PCB copper. |
Pinout & Package
SOT223 (SC-73) plastic surface-mounted package with 4 leads: three signal terminals (base, collector, emitter) plus an exposed collector pad acting as terminal 4 for enhanced thermal and electrical conductivity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Base | Control electrode; accepts base current to regulate collector-emitter conduction. |
| 2 | Collector | Main current-carrying terminal; electrically and thermally connected to exposed pad (pin 4). |
| 3 | Emiter | Current return path; tied to system ground or load return in high-side switch configurations. |
| 4 | Collector (exposed pad) | Thermal and electrical extension of pin 2; must be soldered to large copper area for rated power handling. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive underhood use with extended temperature cycling and humidity testing. |
| Three hFE selections | Gain bins (−10, −16, standard) enable precise biasing in linear regulators and feedback loops. |
| Exposed collector pad | Reduces thermal resistance by >80% vs. non-exposed packages, enabling higher sustained current in compact layouts. |
| High power dissipation | 1.35 W achievable with 6 cm² collector pad on FR4 - supports space-constrained industrial power stages. |
| Low VCE(sat) | Ensures <100 mW conduction loss at 500 mA, critical for efficiency in battery-powered high-side switches. |
Applications
| Linear Voltage Regulators | High-Side Switches |
|---|---|
Use Scenario: Adjustable LDO pre-regulator stage in automotive body control modules supplying 5 V/1 A to microcontrollers. IC Role / Device Role / Timing Role: PNP pass transistor controlling output voltage via base bias network and error amplifier feedback. Use Value: −60 V rating provides margin against load-dump transients; AEC-Q101 ensures field reliability over 15-year vehicle life. |
Use Scenario: 12 V battery-fed high-side switch driving solenoid valves in HVAC actuators. IC Role / Device Role / Timing Role: Medium-power switching element turning on/off inductive loads with flyback protection. Use Value: Exposed collector pad sustains 1 A continuous current without heatsink; −0.5 V VCE(sat) minimizes self-heating during duty-cycle operation. |
| Battery-Driven Devices | MOSFET Drivers |
Use Scenario: Power path controller in portable medical monitors managing dual Li-ion cell input and system rail sequencing. IC Role / Device Role / Timing Role: Reverse-polarity and overvoltage protection switch placed between battery connector and PMIC input. Use Value: −5 V VEBO rating allows safe operation with reverse-battery fault detection circuitry; low leakage (<100 nA) preserves standby battery life. |
Use Scenario: Level-shifting gate driver for N-channel high-side MOSFETs in BLDC motor inverters. IC Role / Device Role / Timing Role: Current-amplifying stage translating logic-level PWM signals to high-current gate drive pulses. Use Value: 145 MHz fT supports clean 20 kHz PWM edge transitions; hFE binning ensures consistent turn-on timing across production lots. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PNP medium-power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BCX52,115 | SOT89 package (3-pin, no exposed pad); lower Ptot = 0.50 W on standard footprint; same VCEO/IC ratings. | Limited thermal headroom in high-duty-cycle switching; unsuitable for >0.7 A continuous in unheatsinked designs. | Select when board space is constrained and thermal budget permits reduced power derating. |
| BC52PA,115 | SOT1061 ultra-thin package (2 × 2 × 0.65 mm); Ptot = 0.42 W on standard footprint; AEC-Q101 qualified. | Optimized for ultra-low-profile consumer wearables; requires 4-layer PCB for full 1.10 W rating. | Choose for height-sensitive applications where 0.65 mm max profile is mandatory and layer count can be increased. |
Compared with BCX52,115 and BC52PA,115, the BCP52,135 delivers superior thermal performance via its SOT223 exposed-pad architecture - enabling 1 A continuous operation on 2-layer FR4 without forced cooling, while maintaining identical automotive qualification and gain binning flexibility.
Availability
BCP52,135 is available at Aetrix Electronics and suitable for linear voltage regulators, high-side switches, and battery-driven devices requiring stable component supply across automotive, industrial, and medical electronics programs.
Supply support for BCP52,135 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, reliable discrete and logic devices for automotive, industrial, and consumer markets.
The BCP52,135 belongs to Nexperia's medium-power PNP transistor family designed specifically for automotive-grade power management and switching applications where thermal robustness, gain consistency, and AEC-Q101 compliance are mandatory.
FAQ
What is the maximum allowable junction temperature for BCP52,135?
The absolute maximum junction temperature (Tj) is 150 °C, as defined in the Absolute Maximum Ratings table. Operation above this temperature risks permanent degradation of hFE, leakage current, and bond wire integrity. Thermal design must ensure Tj remains below 150 °C under worst-case ambient and power dissipation conditions.
Does BCP52,135 require a heatsink for 1 A continuous operation?
No external heatsink is required if the exposed collector pad (pin 4) is soldered to ≥1 cm² of 1-oz copper on a single-layer FR4 PCB, enabling 1.00 W dissipation. On standard footprint (no added copper), 0.65 W limits continuous current to ~750 mA; full 1 A requires thermal enhancement per Figure 1.
How does the hFE selection affect circuit design?
The BCP52,135 is offered in three hFE bins: standard (63–250), −10 (63–160), and −16 (100–250). Designers select based on required base drive current - e.g., −16 bin reduces base current by ~40% vs. standard at IC = −150 mA, easing drive requirements in low-power controllers.
Is BCP52,135 compatible with lead-free reflow soldering profiles?
Yes - BCP52,135 is qualified for lead-free reflow per JEDEC J-STD-020. The recommended peak temperature is 260 °C (max), with time above liquidus ≤60 seconds. Reflow footprint dimensions and solder paste stencil design are specified in Figure 22 of the datasheet.
BCP52,135 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- TO-261-4, TO-261AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- PNP
- Current - Collector (Ic) (Max):
- 1 A
- Voltage - Collector Emitter Breakdown (Max):
- 60 V
- Vce Saturation (Max) @ Ib, Ic:
- 500mV @ 50mA, 500mA
- Current - Collector Cutoff (Max):
- 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 63 @ 150mA, 2V
- Power - Max:
- 1 W
- Frequency - Transition:
- 145MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-223
BCP52,135 FAQ
1.How can I place an order for BCP52,135 through Aetrix?
Please submit a Request for Quotation (RFQ) for BCP52,135 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BCP52,135 reliable?
The price and inventory of BCP52,135 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BCP52,135 is usually 5 days.
3.What payment methods are accepted for BCP52,135?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BCP52,135 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BCP52,135?
BCP52,135 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BCP52,135 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BCP52,135?
For technical support, including BCP52,135 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BCP52,135 requirements.
6.How does Aetrix verify that BCP52,135 is sourced from the original manufacturer or authorized distributors?
All BCP52,135 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BCP52,135 meets industry standards.
7.What is the process for return or replacement of BCP52,135?
All BCP52,135 units undergo pre-shipment inspection (PSI). If there is an issue with BCP52,135, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BCP52,135 part is unused and in its original packaging.
Return procedure for BCP52,135:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BCP52,135 Tags
-
MMBT3906LT1G
onsemi
-
MMBT3904-7-F
Diodes Incorporated
-
MMBT3904LT1G
onsemi
-
MMBT3906-7-F
Diodes Incorporated
-
MMBT3904-TP
Micro Commercial Co
-
MMBT2222A-7-F
Diodes Incorporated
-
BC846BLT1G
onsemi
-
BC847B,215
Nexperia USA Inc.
-
SMMBT3904LT1G
onsemi
-
MMBT2222A-TP
Micro Commercial Co
-
MMBTA06LT1G
onsemi
-
MMBT2222ALT1G
onsemi
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
