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Nexperia USA Inc. BCP55-10TF
- Part No.:
- BCP55-10TF
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Bipolar Transistors
- Package:
- TO-261-4, TO-261AA
- Datasheet:
-
BCP55-10TF.pdf
- Description:
- TRANS NPN 60V 1A SOT-223
- Quantity:
- Payment:
- Shipping:
Inventory:4,918
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Product details
Overview
BCP55-10TF from Nexperia is an AEC-Q101-qualified NPN medium power transistor in SOT223 (SC-73) package, rated for 60 V VCEO, 1 A continuous collector current, and 1.3 W power dissipation on 4-layer PCB with 1 cm² collector pad - used in linear voltage regulators, MOSFET drivers, and high-side switch circuits.
For engineers reviewing the BCP55-10TF datasheet, BCP55-10TF pinout, BCP55-10TF application, or BCP55-10TF equivalent, this page delivers verified electrical specs, thermal derating behavior, hFE binning (63–160), safe operating area limits, and automotive-grade reliability context without generic assumptions.
Technical Context
This device operates as a medium-power NPN bipolar junction transistor with open-base VCEO = 60 V and pulsed ICM = 2 A (tp ≤ 1 ms). Its hFE is binned at 63–160 (VCE = 2 V, IC = 150 mA, pulsed), enabling predictable gain in switching and linear amplification stages.
Thermal performance depends critically on PCB layout: Rth(j-a) ranges from 70 K/W (4-layer copper, 1 cm² collector pad) to 209 K/W (standard FR4 single-sided footprint), directly impacting maximum sustainable DC current and pulse handling capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | 60 V - Maximum collector-emitter voltage before breakdown under open-base condition; defines upper rail limit in high-side switch or regulator designs. |
| IC | 1 A - Continuous DC collector current rating at Tamb = 25 °C; usable up to ~0.7 A at 100 °C ambient with appropriate heatsinking. |
| hFE | 63–160 - DC current gain at VCE = 2 V, IC = 150 mA (pulsed); enables precise base drive sizing for saturation in switching applications. |
| VCE(sat) | ≤ 500 mV - Collector-emitter saturation voltage at IC = 500 mA, IB = 50 mA; ensures low conduction loss in saturated-switch operation. |
| Ptot | 1.3 W - Total power dissipation on FR4 PCB with 4-layer copper and standard footprint; sets thermal design boundary for enclosure and board layout. |
| fT | 100–155 MHz - Transition frequency at VCE = 5 V, IC = 50 mA, f = 100 MHz; supports moderate-speed switching (e.g., <500 kHz PWM control). |
| Rth(j-a) | 70–209 K/W - Junction-to-ambient thermal resistance; varies with PCB copper layer count and collector pad area - critical for thermal margin calculation. |
Pinout & Package
SOT223 (SC-73) surface-mount plastic package with 4 leads: pins 1 (B), 2 (C), 3 (E), and 4 (C) - dual-collector configuration improves thermal conduction and current handling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Base | Control terminal; requires ~50 mA base drive for full saturation at 500 mA collector current. |
| 2 | Collector | Main current-carrying terminal; electrically connected to pin 4 for enhanced thermal path and current sharing. |
| 3 | Emiter | Reference/return node; common connection point for load return in high-side configurations. |
| 4 | Collector | Second collector terminal; tied internally to pin 2 - used for larger solder pad area to improve heat transfer to PCB. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive temperature range (−55 °C to +150 °C) and stress testing - suitable for engine control, body electronics, and ADAS power stages. |
| Dual-collector SOT223 package | Pins 2 and 4 both connect to collector, enabling larger thermal pad area and lower effective Rth(j-sp) (18 K/W to solder point). |
| Three hFE bins | BCP55-10TF provides mid-range gain (63–160), balancing drive sensitivity and stability vs. higher-gain BCP55-16T (100–250) or lower-gain BCP55T (63–250). |
| High peak current capability | 2 A single-pulse rating (tp ≤ 1 ms) supports inrush current handling in power management and motor driver pre-driver stages. |
Applications
| Linear Voltage Regulators | MOSFET Drivers |
|---|---|
|
Use Scenario: Pass transistor in adjustable linear regulators delivering up to 1 A output with low dropout and minimal external components. IC Role / Device Role / Timing Role: NPN pass element controlling output voltage via base bias; operates in active region for regulation. Use Value: VCEO = 60 V allows input rails up to 55 V; low VCE(sat) minimizes dropout and thermal load at full load. |
Use Scenario: Level-shifting and current-boosting stage driving N-channel MOSFET gates in half-bridge or high-side configurations. IC Role / Device Role / Timing Role: Medium-power NPN switch sourcing gate current during turn-on; complements PNP or logic-level driver ICs. Use Value: 1 A IC and fast fT support rapid gate charging for <500 kHz switching; dual-collector layout aids thermal management during burst-mode operation. |
| High-Side Switches | Power Management |
|
Use Scenario: Load switch for 12 V/24 V automotive subsystems (e.g., lighting, HVAC actuators) requiring reverse polarity protection and controlled ramp-up. IC Role / Device Role / Timing Role: High-side series switch with emitter-follower configuration; base driven by microcontroller or dedicated driver. Use Value: AEC-Q101 qualification ensures reliability in harsh environments; 60 V rating accommodates load dump transients up to ±60 V. |
Use Scenario: Current-sense amplifier front-end, battery charge path control, or auxiliary supply enable in industrial power modules. IC Role / Device Role / Timing Role: Discrete transistor implementing precision current mirroring, foldback limiting, or OR-ing functionality. Use Value: Tight hFE bin (63–160) enables repeatable current gain matching; low leakage (ICBO ≤ 100 nA) preserves accuracy in low-current sensing paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NPN medium power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BCP55-16TF | Higher hFE bin (100–250) at same VCEO/IC; otherwise identical package, pinout, and thermal specs. | Better suited for low-base-drive applications (e.g., microcontroller GPIO direct drive); may exhibit reduced stability in high-gain analog stages. | Select when minimizing base current is critical and gain consistency across temperature is less important than drive efficiency. |
| ZTX653 | TO-92 package (not SMT), 60 V VCEO, 1 A IC, hFE = 100–800; no AEC-Q101 qualification; Rth(j-a) ≈ 250 K/W. | Limited to low-power, non-automotive, through-hole designs; unsuitable for high-density or thermally constrained layouts. | Choose only for prototyping or legacy through-hole systems where SMT compatibility and automotive compliance are not required. |
Compared with BCP55-10TF, the BCP55-16TF offers higher gain for reduced base drive but narrower hFE tolerance at low currents, while ZTX653 sacrifices AEC-Q101 compliance, thermal performance, and SMT manufacturability for wider hFE range in through-hole form.
Availability
BCP55-10TF is available at Aetrix Electronics and suitable for automotive power management, industrial linear regulators, and high-reliability MOSFET driver circuits requiring stable component supply and long-term lifecycle support.
Supply support for BCP55-10TF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified components and advanced packaging.
The BCP55T series belongs to Nexperia's AEC-Q101-qualified medium-power transistor family, engineered for robust operation in automotive power control, industrial switching, and linear regulation applications demanding thermal resilience and parametric consistency.
FAQ
What is the difference between BCP55-10TF and BCP55-10T?
The 'F' suffix in BCP55-10TF denotes tape-and-reel packaging per EIA-481 standard, optimized for automated SMT placement. Electrically and thermally identical to BCP55-10T, it features standardized reel dimensions, orientation marking, and moisture sensitivity level (MSL) 1 rating - essential for high-throughput manufacturing.
Can BCP55-10TF replace BC817 in SOT23 packages?
No - BCP55-10TF uses SOT223 with dual collectors and 1.3 W power dissipation, while BC817 in SOT23 is rated for 0.5 W and 0.5 A. The pinout differs (SOT223 has 4 pins, SOT23 has 3), and thermal performance is incompatible. Direct replacement would risk thermal runaway and mechanical fit failure.
Is the hFE of BCP55-10TF guaranteed across temperature?
hFE is specified at Tj = 25 °C (63–160), with typical curves showing reduction to ~40% at 100 °C and increase at −55 °C. Designers must use Fig. 8 from the datasheet to derate gain in thermal simulations - no min/max guarantee is provided outside 25 °C.
Does BCP55-10TF support pulsed operation beyond 1 A?
Yes - it supports 2 A peak collector current (ICM) for single pulses ≤1 ms, provided duty cycle remains low (<2%) and PCB thermal design maintains junction temperature ≤150 °C. Safe operating area (SOA) curves in Fig. 2 must be consulted for pulse width and voltage combinations.
BCP55-10TF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- TO-261-4, TO-261AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- NPN
- Current - Collector (Ic) (Max):
- 1 A
- Voltage - Collector Emitter Breakdown (Max):
- 60 V
- Vce Saturation (Max) @ Ib, Ic:
- 500mV @ 50mA, 500mA
- Current - Collector Cutoff (Max):
- 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 63 @ 150mA, 2V
- Power - Max:
- 1.3 W
- Frequency - Transition:
- 155MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-223
BCP55-10TF FAQ
1.How can I place an order for BCP55-10TF through Aetrix?
Please submit a Request for Quotation (RFQ) for BCP55-10TF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BCP55-10TF reliable?
The price and inventory of BCP55-10TF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BCP55-10TF is usually 5 days.
3.What payment methods are accepted for BCP55-10TF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BCP55-10TF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BCP55-10TF?
BCP55-10TF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BCP55-10TF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BCP55-10TF?
For technical support, including BCP55-10TF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BCP55-10TF requirements.
6.How does Aetrix verify that BCP55-10TF is sourced from the original manufacturer or authorized distributors?
All BCP55-10TF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BCP55-10TF meets industry standards.
7.What is the process for return or replacement of BCP55-10TF?
All BCP55-10TF units undergo pre-shipment inspection (PSI). If there is an issue with BCP55-10TF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BCP55-10TF part is unused and in its original packaging.
Return procedure for BCP55-10TF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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