Infineon Technologies BCP5516H6327XTSA1

Overview

BCP5516H6327XTSA1 from Infineon Technologies is an NPN silicon bipolar junction transistor designed for audio-frequency driver and output stages in linear and switching applications. It features a 60 V collector-emitter breakdown voltage (V_(BR)CEO), 1 A continuous collector current (I_C), 0.5 V collector-emitter saturation voltage (V_CE(sat)) at I_C = 500 mA / I_B = 50 mA, and DC current gain (h_FE) of 100–250 at I_C = 150 mA. It is used in automotive amplifier bias networks and industrial power supply base-drive circuits.

For engineers reviewing the BCP5516H6327XTSA1 datasheet, BCP5516H6327XTSA1 pinout, BCP5516H6327XTSA1 application, or BCP5516H6327XTSA1 equivalent, key selection criteria include its SOT-223 package thermal resistance (R_thJS ≤ 15 K/W), AEC-Q101 qualification, complementary PNP pairing with BCP52-16, and verified operation up to 150 °C junction temperature.

Technical Context

This transistor operates as a medium-power NPN switch or linear amplifier with fixed emitter-base and collector-base junction structures optimized for low V_CE(sat) and stable h_FE across I_C = 5 mA to 500 mA. Its 60 V V_(BR)CEO rating supports 24 V and 48 V industrial bus interfaces, while f_T = 100 MHz enables use in high-speed switching up to ~10 MHz square-wave applications.

The device uses a four-terminal SOT-223 package with Collector connected to both pins 2 and 4 for enhanced thermal conduction and current handling. Its thermal design allows 2 W total power dissipation at T_S ≤ 120 °C, validated per Infineon Application Note AN077 for PCB copper area optimization.

Key Specifications

Pinout & Package

SOT-223 package with exposed thermal pad (pin 4 = Collector, electrically tied to pin 2); standard 4-pin configuration optimized for surface-mount thermal management on FR4 PCBs with ≥1 cm² copper pour.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN medium-power transistor applications.

Compared with BCP55-16, the H6327XTSA1 offers identical performance in a standardized tape-and-reel format aligned with automated SMT placement. Against MJD122G, it trades voltage headroom for superior thermal efficiency and tighter gain control in space-constrained designs.

Availability

BCP5516H6327XTSA1 is available at Aetrix Electronics and suitable for automotive audio systems, industrial relay drivers, DC-DC converter base-drive circuits, and LED bias networks requiring stable component supply and AEC-Q101 compliance.

Supply support for BCP5516H6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.

The BCP54–BCP56 family was developed for high-reliability linear and switching applications in automotive and industrial environments, emphasizing thermal robustness, AEC-Q101 qualification, and complementary PNP/NPN pairing.

FAQ

Is BCP5516H6327XTSA1 pin-compatible with BCP55-16?

Yes - both share identical SOT-223 pinout (Base–Collector–Emitter–Collector), same die, and identical electrical specifications. The only differences are marking ("BCP5516H6327XTSA1" vs. "BCP55-16") and tape-and-reel packaging format (H6327XTSA1 uses 180 mm reels with 1,000 pcs; BCP55-16 uses standard 1,000 pc reels). No PCB redesign is needed.

What is the maximum allowable PCB copper area for optimal thermal performance?

Per Infineon Application Note AN077, a minimum 1 cm² of 2-oz copper connected to pin 4 (exposed collector tab) reduces R_thJA to ≤62 K/W at 25 °C ambient. With forced airflow (1 m/s), this supports full 2 W dissipation without exceeding 120 °C case temperature. Smaller copper areas require derating per Figure 5 in the datasheet.

Does this transistor support pulse operation beyond its DC ratings?

Yes - the datasheet specifies permissible pulse load curves showing P_tot(max)/P_tot(DC) ratios up to 10× for t_p ≤ 100 µs (D ≤ 2 %). At 1 ms pulses, safe peak current reaches 1.5 A (I_CM), provided duty cycle remains ≤ 1 % and average power stays within 2 W limits.

Can BCP5516H6327XTSA1 be used in place of BC847B in SOT-23 designs?

No - BCP5516H6327XTSA1 uses SOT-223 (4-pin, 6.5 × 3.5 mm), while BC847B uses SOT-23 (3-pin, 3.0 × 1.4 mm). Pin count, footprint, thermal mass, and current capability differ significantly. Substitution would require PCB redesign, new thermal validation, and requalification of h_FE-dependent bias networks.