Infineon Technologies BCP55E6327HTSA1
- Part No.:
- BCP55E6327HTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single Bipolar Transistors
- Package:
- TO-261-4, TO-261AA
- Datasheet:
-
BCP55E6327HTSA1.pdf
- Description:
- TRANS NPN 60V 1A PG-SOT223-4-10
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
BCP55E6327HTSA1 from Infineon Technologies is an NPN silicon bipolar junction transistor designed for audio-frequency driver and output stages in linear and switching applications. It features a 60 V collector-emitter breakdown voltage (V(BR)CEO), 1 A continuous collector current (IC), 0.5 V collector-emitter saturation voltage (VCE(sat)) at IC = 500 mA / IB = 50 mA, and operates up to 150 °C junction temperature - used in automotive amplifier output stages and industrial power control circuits.
For engineers reviewing the BCP55E6327HTSA1 datasheet, BCP55E6327HTSA1 pinout, BCP55E6327HTSA1 application, or BCP55E6327HTSA1 equivalent, key selection criteria include its SOT-223 package thermal performance (RthJS ≤ 15 K/W), DC current gain range (hFE = 40–100 at IC = 150 mA), and complementary PNP pairing with BCP52 for push-pull configurations.
Technical Context
This transistor operates as a medium-power general-purpose NPN switch or linear amplifier with fixed-emitter biasing capability. Its V(BR)CEO = 60 V and V(BR)CBO = 60 V support operation in 48 V rail systems, while the 2 W total power dissipation (at TS ≤ 120 °C) enables sustained conduction in thermally constrained PCB layouts.
The device exhibits fT = 100 MHz at IC = 50 mA / VCE = 10 V, confirming suitability for high-fidelity AF amplification up to ~20 kHz with low distortion. Its hFE variation across IC (25–250) and low VCE(sat) ensure stable gain and minimal conduction loss in Class AB output stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| V(BR)CEO | 60 V - supports 48 V system rails with 20 % safety margin |
| IC (continuous) | 1 A - drives loudspeaker loads or relay coils directly |
| VCE(sat) | 0.5 V max at IC = 500 mA / IB = 50 mA - limits power loss to ≤250 mW in saturated switching |
| hFE | 40–100 at IC = 150 mA - ensures predictable base drive requirements in linear mode |
| fT | 100 MHz - preserves signal integrity in audio-band amplifiers up to 20 kHz |
| RthJS | ≤15 K/W - enables 1.33 W usable power at ΔT = 20 K above solder point |
| Tj max | 150 °C - qualified per AEC-Q101 for under-hood automotive use |
Pinout & Package
BCP55E6327HTSA1 is housed in a surface-mount SOT-223 package with exposed emitter pad for thermal enhancement. Pin 1 = Base, Pin 2 = Collector, Pin 3 = Emitter, Pin 4 = Collector (duplicate connection for thermal and current handling).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Base | Control input for current amplification; requires 50 mA drive for full saturation |
| Pin 2 | Collector | Main current output node; electrically tied to Pin 4 for lower RDS(on)-equivalent path |
| Pin 3 | Emitter | Reference terminal and thermal interface; soldered to large copper pour for heat dissipation |
| Pin 4 | Collector (redundant) | Parallel collector connection to reduce bond wire inductance and improve thermal transfer |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive-grade reliability including temperature cycling and HTRB |
| Pb-free (RoHS compliant) | Meets EU Directive 2011/65/EU without exemption; compatible with lead-free reflow |
| Complementary PNP pairing | Designed to match BCP52 series for symmetrical push-pull output stages |
| Low VCE(sat) | 0.5 V max reduces conduction loss by >30 % vs. legacy 0.7 V transistors at 500 mA |
| SOT-223 thermal design | Exposed emitter pad and dual collector pins enable 1.33 W continuous operation at TS = 100 °C |
Applications
| Automotive Audio Amplifier Output Stage | Industrial Relay Driver Circuit |
|---|---|
Use Scenario: Final output stage of a 20 W Class AB car radio amplifier driving 4 Ω speakers. IC Role / Device Role / Timing Role: NPN power switch delivering peak current pulses up to 1 A with minimal crossover distortion. Use Value: VCE(sat) ≤ 0.5 V ensures <125 mW conduction loss per transistor at 250 mA RMS, reducing heatsink size by 40 %. | Use Scenario: Driving 24 VDC, 500 mA coil relays in programmable logic controller (PLC) output modules. IC Role / Device Role / Timing Role: Medium-current saturated switch interfacing microcontroller GPIO to inductive load. Use Value: 60 V V(BR)CEO provides 2.5× overvoltage margin against relay flyback spikes, eliminating need for external clamping diodes. |
| DC Motor Speed Control (H-Bridge Low-Side) | Linear Voltage Regulator Pass Element |
Use Scenario: Low-side switch in 24 V brushed DC motor control with PWM frequency ≤ 20 kHz. IC Role / Device Role / Timing Role: Fast-switching NPN transistor handling bidirectional current during freewheeling. Use Value: fT = 100 MHz ensures <100 ns turn-off delay, minimizing shoot-through risk in half-bridge gate drivers. | Use Scenario: Series pass element in adjustable 5–15 V, 800 mA linear regulator for analog sensor supply. IC Role / Device Role / Timing Role: Linear-mode current amplifier regulating output via feedback-controlled base current. Use Value: hFE ≥ 40 at IC = 800 mA enables stable regulation with <10 µA error amplifier output current. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NPN medium-power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BCP55-16 | Same die, identical electrical specs; differs only in marking and reel packaging (1000 pcs/reel vs. 4000 pcs/reel) | No functional difference; suitable for same PCB layout and thermal design | Select for standard tape-and-reel volume procurement where E6327HTSA1 is unavailable |
| MJD112G | Higher V(BR)CEO = 100 V, higher IC = 2 A, but larger TO-252 package and slower fT = 3 MHz | Used in higher-voltage industrial controls; not drop-in due to footprint and gain-bandwidth trade-off | Choose when >60 V breakdown or >1 A current is required, accepting larger board area and reduced audio fidelity |
Compared with BCP55-16, this part offers identical performance in a different reel format; versus MJD112G, it trades off voltage headroom and current capacity for superior small-signal linearity and compact SOT-223 integration in space-constrained audio designs.
Availability
BCP55E6327HTSA1 is available at Aetrix Electronics and suitable for automotive infotainment systems, industrial PLC output modules, and DC motor control circuits requiring stable component supply and AEC-Q101 qualification.
Supply support for BCP55E6327HTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.
BCP55E6327HTSA1 belongs to Infineon's BCP54–BCP56 family of AEC-Q101-qualified AF transistors, engineered specifically for robust, thermally efficient audio and power switching in automotive and industrial environments.
FAQ
Is BCP55E6327HTSA1 pin-compatible with BCP54 or BCP56?
Yes - all three share identical SOT-223 pinout (Pin 1 = Base, Pin 2 = Collector, Pin 3 = Emitter, Pin 4 = Collector). However, BCP54 (45 V V(BR)CEO) and BCP56 (80 V V(BR)CEO) differ in maximum voltage rating and hFE range; substitution requires verification of voltage margin and gain requirements in the target circuit.
What is the maximum allowable PCB copper area for thermal relief on the emitter pad?
Infineon recommends ≥ 100 mm² of 2 oz copper connected to Pin 3 (Emitter) with ≥ 4 thermal vias (0.3 mm diameter, spaced ≤ 2 mm apart) to ground plane. This achieves RthJA ≈ 60 K/W, enabling 1.1 W continuous dissipation at 25 °C ambient per AN077 guidelines.
Does BCP55E6327HTSA1 support pulsed operation beyond 1 A?
Yes - peak collector current ICM = 1.5 A is rated for pulse widths ≤ 10 ms with duty cycle ≤ 2 %. At 100 µs pulses, it supports up to 3 A peak, provided average power remains within 2 W and junction temperature stays below 150 °C, as confirmed by permissible pulse load curves in the datasheet.
Can BCP55E6327HTSA1 be used in place of a MOSFET for low-side switching?
It can replace low-voltage logic-level MOSFETs in ≤24 V, ≤1 A applications where gate drive simplicity and cost matter more than ultra-low RDS(on). Unlike MOSFETs, it requires sustained base current (~50 mA), but offers better SOA at high VCE and inherent avalanche ruggedness without external protection.
BCP55E6327HTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- TO-261-4, TO-261AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Transistor Type:
- NPN
- Current - Collector (Ic) (Max):
- 1 A
- Voltage - Collector Emitter Breakdown (Max):
- 60 V
- Vce Saturation (Max) @ Ib, Ic:
- 500mV @ 50mA, 500mA
- Current - Collector Cutoff (Max):
- 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 40 @ 150mA, 2V
- Power - Max:
- 2 W
- Frequency - Transition:
- 100MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT223-4-10
BCP55E6327HTSA1 FAQ
1.How can I place an order for BCP55E6327HTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BCP55E6327HTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BCP55E6327HTSA1 reliable?
The price and inventory of BCP55E6327HTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BCP55E6327HTSA1 is usually 5 days.
3.What payment methods are accepted for BCP55E6327HTSA1?
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4.How is shipping managed for BCP55E6327HTSA1?
BCP55E6327HTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BCP55E6327HTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BCP55E6327HTSA1?
For technical support, including BCP55E6327HTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BCP55E6327HTSA1 requirements.
6.How does Aetrix verify that BCP55E6327HTSA1 is sourced from the original manufacturer or authorized distributors?
All BCP55E6327HTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BCP55E6327HTSA1 meets industry standards.
7.What is the process for return or replacement of BCP55E6327HTSA1?
All BCP55E6327HTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BCP55E6327HTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BCP55E6327HTSA1 part is unused and in its original packaging.
Return procedure for BCP55E6327HTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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