Infineon Technologies BCP55H6327XTSA1

Overview

BCP55H6327XTSA1 from Infineon Technologies is an NPN silicon bipolar junction transistor designed for audio-frequency driver and output stages in linear and switching applications. It features a 60 V collector-emitter breakdown voltage (V_(BR)CEO), 1 A continuous collector current (I_C), 0.5 V collector-emitter saturation voltage (V_CE(sat)) at I_C = 500 mA / I_B = 50 mA, and DC current gain (h_FE) of 63–100 at I_C = 150 mA. It is used in automotive amplifier output stages and industrial power switch drivers.

For engineers reviewing the BCP55H6327XTSA1 datasheet, BCP55H6327XTSA1 pinout, BCP55H6327XTSA1 application, or BCP55H6327XTSA1 equivalent, key selection criteria include its SOT-223 package thermal performance (R_thJS ≤ 15 K/W), AEC-Q101 qualification for automotive use, low V_CE(sat), and complementary PNP pairing with BCP52.

Technical Context

This transistor operates as a medium-power general-purpose NPN switch or linear amplifier with fixed-emitter biasing capability. Its 60 V V_(BR)CEO rating supports 24 V and 48 V rail systems, while its 2 W total power dissipation (at T_S ≤ 120 °C) enables operation without forced cooling in compact PCB layouts.

The device exhibits f_T = 100 MHz at I_C = 50 mA / V_CE = 10 V, confirming suitability for high-gain AF amplification up to ~10 kHz with stable phase margin. Its h_FE variation across I_C = 5 mA to 500 mA is documented in Fig. EHP00268, supporting predictable bias design in Class AB output stages.

Key Specifications

Pinout & Package

BCP55H6327XTSA1 is housed in a surface-mount SOT-223 package with four terminals: emitter (pin 1), collector (pins 2 and 4), and base (pin 3). The dual-collector configuration improves thermal spreading and current handling over standard three-pin variants.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN medium-power transistor applications.

Compared with BCP55H6327XTSA1, BCP55-16 offers higher and binned h_FE for matched pair designs, while MMBT5551LT1G trades off automotive reliability and current capacity for smaller footprint and higher voltage rating-making it unsuitable for direct replacement in AEC-Q101 or ≥1 A applications.

Availability

BCP55H6327XTSA1 is available at Aetrix Electronics and suitable for automotive audio systems, industrial motor control, LED lighting drivers, and linear power supplies requiring stable component supply and AEC-Q101 compliance.

Supply support for BCP55H6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.

BCP55H6327XTSA1 belongs to the BCP54–BCP56 family of AEC-Q101-qualified NPN/PNP transistors engineered for robust, thermally efficient audio-frequency power switching in automotive and industrial environments.

FAQ

What is the maximum allowable junction temperature for BCP55H6327XTSA1?

The absolute maximum junction temperature (T_j) is 150 °C, as specified in the Infineon datasheet. Operation above this limit risks permanent degradation of h_FE and increased leakage. Derating is required above T_S = 120 °C, where total power dissipation must be reduced linearly to zero at 150 °C case temperature.

Is BCP55H6327XTSA1 pin-compatible with BCP54 or BCP56 variants?

Yes-BCP54, BCP55, and BCP56 share identical SOT-223 pinout (E-C-B-C), but differ in voltage ratings: BCP54 = 45 V, BCP55 = 60 V, BCP56 = 80 V. Substituting BCP55 for BCP54 is safe in 45 V systems; substituting BCP54 for BCP55 risks breakdown under 60 V transients.

Does BCP55H6327XTSA1 require a heatsink in typical 1 A switching applications?

Not necessarily: with R_thJS ≤ 15 K/W and P_tot = 2 W at T_S = 120 °C, a 2 oz copper pour (≥25 mm²) acts as an effective heatsink. For continuous 1 A conduction at ambient >70 °C, a small external copper slug or thermal pad is recommended to maintain T_j < 130 °C.

How does the dual-collector configuration (pins 2 and 4) affect PCB layout?

Pins 2 and 4 are internally shorted to the collector, so both must be connected to the same net-typically a large copper pour for thermal conduction. Separating them creates unintended impedance imbalance and localized heating. Layout guidelines recommend symmetric copper traces and thermal vias directly beneath both pins to maximize heat extraction.