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Infineon Technologies BCP5610H6327XTSA1

Part No.:
BCP5610H6327XTSA1
Manufacturer:
Infineon Technologies
Category:
Single Bipolar Transistors
Package:
TO-261-4, TO-261AA
Datasheet:
AetrixBCP5610H6327XTSA1.pdf
Description:
TRANS NPN 80V 1A PG-SOT223-4-10
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,139

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Product details

Overview

BCP5610H6327XTSA1 from Infineon Technologies is an NPN silicon bipolar junction transistor designed for audio-frequency driver and output stages in linear and switching applications. It features 80 V VCEO, 1 A continuous collector current, 0.5 V typical VCE(sat) at IC = 500 mA/IB = 50 mA, hFE ≥ 63 at IC = 150 mA, and SOT223 surface-mount package with four terminals (B-C-E-C).

For engineers reviewing the BCP5610H6327XTSA1 datasheet, BCP5610H6327XTSA1 pinout, BCP5610H6327XTSA1 application, or BCP5610H6327XTSA1 equivalent, this part supports high-current AF amplification, low-saturation switching in power management blocks, thermal-stable biasing networks, and complementary PNP pairing with BCP51–BCP53 series.

Technical Context

This transistor operates as a medium-power general-purpose NPN device optimized for linear amplification and saturated switching. Its 80 V VCEO rating enables use in 24–48 V rail systems, while its 2 W total power dissipation (TS ≤ 120 °C) and RthJS ≤ 15 K/W support thermally constrained PCB layouts.

The device delivers hFE = 63–250 across IC = 5 mA to 500 mA, with fT = 100 MHz at IC = 50 mA/VCE = 10 V, confirming suitability for audio-band signal gain and fast-switching control paths without RF instability concerns.

Key Specifications

ParameterValue and Actual Design Meaning
VCEO80 V - Supports operation up to 80 V collector-emitter voltage before breakdown, enabling use in 48 V industrial power supplies and audio amplifier rails.
IC (continuous)1 A - Rated for sustained 1 A collector current, suitable for driving relays, small motors, or speaker outputs in Class AB stages.
VCE(sat)0.5 V max at IC = 500 mA/IB = 50 mA - Low saturation voltage minimizes conduction loss and self-heating during switching duty cycles.
hFE63–250 - Wide DC current gain range ensures stable biasing across production lots and temperature (−65 to +150 °C junction).
fT100 MHz - Transition frequency confirms usable gain up to mid-audio frequencies and reliable performance in feedback-controlled preamp stages.
RthJS≤15 K/W - Thermal resistance from junction to solder point allows direct thermal coupling to copper pour for passive cooling in space-constrained designs.

Pinout & Package

SOT223 package with 4-terminal configuration: three leads (B, C, E) plus an additional collector tab (C) for enhanced thermal and current handling. The exposed collector pad improves heat transfer and reduces thermal impedance.

Pin/TerminalCircuit RoleDesign Meaning
1BaseControl input for current amplification; requires current-limited drive (max IB = 100 mA DC) to avoid thermal runaway.
2CollectorMain high-current output node; electrically and thermally connected to the exposed metal tab (Pin 4).
3EmitterReference terminal for bias network; tied to ground or negative rail in common-emitter configurations.
4Collector (Tab)Secondary collector connection-must be soldered to large copper area for thermal management and current sharing.

Key Features

FeatureDesign Value
AEC-Q101 qualifiedQualified for automotive-grade reliability per stress test standard, supporting under-hood and infotainment system deployment.
Pb-free / RoHS compliantMeets EU RoHS Directive 2011/65/EU; no lead, mercury, cadmium, hexavalent chromium, PBB, or PBDE in construction.
Complementary PNP pairingDesigned to match BCP51–BCP53 series for push-pull output stages, ensuring matched VBE, hFE, and thermal response.
High fT with low VCE(sat)100 MHz gain-bandwidth product combined with sub-0.5 V saturation enables efficient wideband amplification without sacrificing efficiency.

Applications

Audio Power Amplifier Output StageIndustrial Relay Driver

Use Scenario: Final output stage in Class AB audio amplifiers delivering 1–5 W into 4–8 Ω loads.

IC Role / Device Role / Timing Role: NPN switch/amplifier providing current gain and low-distortion signal swing with minimal thermal drift.

Use Value: 80 V VCEO and 1 A IC enable full-swing operation on ±24 V rails; 0.5 V VCE(sat) reduces idle heating and improves THD+N performance.

Use Scenario: Driving 24 VDC industrial relays (100–500 mA coil current) from microcontroller GPIOs.

IC Role / Device Role / Timing Role: Medium-power interface transistor translating logic-level signals into relay coil actuation current.

Use Value: High hFE (≥63 at 150 mA) allows direct MCU drive without external base buffer; SOT223 thermal mass prevents latch-up during repeated switching.

Linear Voltage Regulator Pass ElementComplementary Push-Pull Pair

Use Scenario: Series pass transistor in adjustable LDO regulators supplying 1–3 A to FPGA or DSP core rails.

IC Role / Device Role / Timing Role: Current-controlled linear regulator element dissipating excess voltage as heat under load regulation.

Use Value: 2 W Ptot at TS ≤ 120 °C and RthJS ≤ 15 K/W allow stable operation with modest heatsinking in compact enclosures.

Use Scenario: Complementary emitter-follower pair in headphone amplifier output buffers or motor H-bridge predrivers.

IC Role / Device Role / Timing Role: NPN half of matched BCP56/BCP51 pair delivering symmetrical sourcing/sinking capability.

Use Value: Matched VBE, hFE, and thermal coefficients with BCP51–BCP53 minimize crossover distortion and thermal imbalance in analog output stages.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN transistor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
BCP56-10TASame electrical specs, identical SOT223 package, but marked "BCP56-10" and shipped in tape-and-reel per JEDEC standard.No functional difference; differs only in marking and packaging format (no impact on board layout or thermal design).Select when requiring JEDEC-compliant reel packaging for automated assembly lines.
MJD112Higher VCEO (100 V), same IC (1 A), but TO-252 package (larger footprint, higher RthJA).Requires PCB redesign for TO-252 footprint; better suited for higher-voltage (>80 V) or higher-thermal-margin applications.Choose only if system voltage exceeds 80 V or thermal budget permits larger package with lower integration density.

Compared with BCP5610H6327XTSA1, BCP56-10TA offers identical performance in JEDEC-standard packaging, while MJD112 trades SOT223 compactness for higher voltage headroom and different thermal behavior-neither is pin-compatible nor drop-in.

Availability

BCP5610H6327XTSA1 is available at Aetrix Electronics and suitable for audio amplifier output stages, industrial relay drivers, and linear voltage regulator pass elements requiring stable component supply, AEC-Q101 qualification, and RoHS compliance.

Supply support for BCP5610H6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.

The BCP54–BCP56 family belongs to Infineon's general-purpose bipolar transistor product line, engineered for cost-effective, thermally robust AF and switching applications in automotive, industrial, and consumer equipment.

FAQ

Is BCP5610H6327XTSA1 pin-compatible with BCP54 or BCP55 variants?

No. While all share the SOT223-4 package and identical pin 1–4 assignment (B-C-E-C), BCP5610H6327XTSA1 has higher VCEO (80 V) and VCBO (100 V) than BCP54 (45 V) and BCP55 (60 V). Substituting without verifying voltage margin may cause premature breakdown in high-rail designs.

What is the maximum safe operating temperature for continuous use?

The junction temperature must not exceed 150 °C. With RthJS ≤ 15 K/W and Ptot = 2 W at TS ≤ 120 °C, the device remains within safe limits if the solder-point temperature stays at or below 120 °C-achievable using ≥2 cm² 2-oz copper pour under the tab.

Does this transistor require a base resistor in all applications?

Yes. Base current must be limited to prevent damage: IB ≤ 100 mA DC (200 mA peak). For example, driving from a 3.3 V MCU GPIO with hFE = 100 and IC = 500 mA requires ~5 mA IB, so a 560 Ω series resistor ensures safe operation and avoids thermal runaway.

Can BCP5610H6327XTSA1 replace BC817 in SOT-23 designs?

No. BC817 uses SOT-23 (3-pin, 0.65 mm pitch); BCP5610H6327XTSA1 uses SOT223 (4-pin, 2.3 mm pitch, exposed tab). Footprint, thermal path, and pin count are incompatible-PCB redesign and layout validation are required for any substitution.

BCP5610H6327XTSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
TO-261-4, TO-261AA
Packaging:
Tape & Reel (TR)
Product Status:
Last Time Buy
Transistor Type:
NPN
Current - Collector (Ic) (Max):
1 A
Voltage - Collector Emitter Breakdown (Max):
80 V
Vce Saturation (Max) @ Ib, Ic:
500mV @ 50mA, 500mA
Current - Collector Cutoff (Max):
100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce:
63 @ 150mA, 2V
Power - Max:
2 W
Frequency - Transition:
100MHz
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-SOT223-4-10

BCP5610H6327XTSA1 FAQ

1.How can I place an order for BCP5610H6327XTSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BCP5610H6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BCP5610H6327XTSA1 reliable?

The price and inventory of BCP5610H6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BCP5610H6327XTSA1 is usually 5 days.

3.What payment methods are accepted for BCP5610H6327XTSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BCP5610H6327XTSA1 transactions.

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4.How is shipping managed for BCP5610H6327XTSA1?

BCP5610H6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BCP5610H6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BCP5610H6327XTSA1?

For technical support, including BCP5610H6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BCP5610H6327XTSA1 requirements.

6.How does Aetrix verify that BCP5610H6327XTSA1 is sourced from the original manufacturer or authorized distributors?

All BCP5610H6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BCP5610H6327XTSA1 meets industry standards.

7.What is the process for return or replacement of BCP5610H6327XTSA1?

All BCP5610H6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BCP5610H6327XTSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BCP5610H6327XTSA1 part is unused and in its original packaging.

Return procedure for BCP5610H6327XTSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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