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Diodes Incorporated BCP5610TA
- Part No.:
- BCP5610TA
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Bipolar Transistors
- Package:
- TO-261-4, TO-261AA
- Datasheet:
-
BCP5610TA.pdf
- Description:
- TRANS NPN 80V 1A SOT-223-3
- Quantity:
- Payment:
- Shipping:
Inventory:1,614
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Product details
Overview
BCP5610TA from Diodes Incorporated is an NPN medium-power bipolar junction transistor in SOT223 package, rated for 80V VCEO, 1A continuous collector current, and 2W power dissipation. It features low saturation voltage (VCE(sat) ≤ 500 mV at IC = 500 mA / IB = 50 mA), DC current gain group 10 (hFE = 63–160 at IC = 150 mA), and is qualified for automotive-grade applications requiring AEC-Q101 compliance. It is used in AF driver stages and medium-power switching circuits.
For engineers reviewing the BCP5610TA datasheet, BCP5610TA pinout, BCP5610TA application, or BCP5610TA equivalent, key selection criteria include VCEO rating, thermal resistance (RθJL = 19.4 °C/W), gain group consistency, lead-free "Green" compliance, and SOT223 thermal pad layout compatibility with 50 mm × 50 mm 1 oz copper PCBs.
Technical Context
The BCP5610TA operates as a general-purpose NPN switching and amplification transistor with fixed gain binning (Group 10) ensuring predictable hFE performance across production lots. Its 80V VCEO rating supports operation in 24V and 48V industrial control rails, while its 2W power dissipation capability requires thermal design using the collector tab as primary heat path.
Designed for stable DC and low-frequency AC operation up to ~150 MHz (fT = 150 MHz at IC = 50 mA), it exhibits low VBE(on) (≤1.0 V) and tight VCE(sat) distribution - critical for minimizing conduction loss in linear and saturated-switching modes in audio output and relay driver circuits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | 80 V - Supports switching in 48V systems with 60% derating margin against transients. |
| IC (continuous) | 1 A - Enables direct drive of small solenoids, relays, or LED arrays without external buffering. |
| PD | 2 W - Requires thermal pad connection to ≥50 mm × 50 mm 1 oz copper for full-rated operation in still air. |
| VCE(sat) | ≤ 500 mV @ IC = 500 mA, IB = 50 mA - Limits conduction loss to <250 mW in saturated switch mode. |
| hFE (Group 10) | 63–160 @ IC = 150 mA, VCE = 2 V - Ensures consistent base drive requirements across production units. |
| RθJL | 19.4 °C/W - Defines junction-to-lead thermal path; enables accurate temperature rise estimation when soldered to PCB copper. |
| fT | 150 MHz @ IC = 50 mA, VCE = 10 V - Validates suitability for wideband audio pre-amplifier and RF detector front-end use. |
Pinout & Package
SOT223 package with integrated thermal pad on collector terminal; molded green compound (UL 94V-0), matte tin-plated leads, moisture sensitivity level 1 per J-STD-020, weight ≈ 0.112 g.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Emitter) | Current sink node | Connected to ground or low-side return path; not thermally enhanced - minimal heat spreading. |
| 2 (Base) | Control input | Receives current-limited drive signal; requires series resistor to limit IB ≤ 100 mA continuous. |
| 3 (Collector) | Power output node | Primary thermal path via large metal tab; must be soldered to ≥50 mm² copper pour for rated power handling. |
| 4 (Collector Tab) | Thermal & electrical common | Electrically identical to Pin 3; provides mechanical anchoring and dominant heat conduction path to PCB. |
Key Features
| Feature | Design Value |
|---|---|
| 80V VCEO rating | Enables reliable operation in 48V industrial bus and automotive load-switching applications with headroom for ISO 7637-2 pulse suppression. |
| Group 10 hFE binning | Reduces variation in base drive design across manufacturing lots - simplifies BOM consolidation and reduces calibration overhead. |
| Low VCE(sat) (≤500 mV) | Minimizes power loss and self-heating during high-duty-cycle switching, extending thermal margin in compact enclosures. |
| SOT223 thermal pad | Provides direct junction-to-PCB thermal path with RθJL = 19.4 °C/W - eliminates need for external heatsinks in ≤1.5W applications. |
| AEC-Q101 qualification readiness | Manufactured in IATF 16949-certified facilities with PPAP capability - supports automotive Tier-1 sourcing without requalification. |
Applications
| Audio Output Stage | Industrial Relay Driver |
|---|---|
Use Scenario: Driving 8Ω speaker loads in Class-B or AB amplifier output stages with ±12V supply. IC Role / Device Role / Timing Role: NPN emitter-follower or common-emitter power switch delivering up to 1A peak current with low distortion. Use Value: Low VCE(sat) and tight hFE binning ensure consistent bias point stability and reduced crossover distortion across temperature. |
Use Scenario: Controlling 24VDC industrial relays (coil resistance 200–500 Ω) in PLC I/O modules. IC Role / Device Role / Timing Role: Saturated switch interfacing microcontroller GPIO to relay coil, providing galvanic isolation and current gain. Use Value: 80V VCEO withstands relay coil flyback spikes up to 60V; 2W dissipation handles 100ms coil energization bursts. |
| Automotive Door Lock Actuator | DC Motor Speed Control (Small) |
Use Scenario: Bidirectional H-bridge half-bridge element controlling 12V brushed motor in door lock mechanism. IC Role / Device Role / Timing Role: High-side or low-side switch in discrete H-bridge, operating with PWM up to 20 kHz. Use Value: AEC-Q101-ready process and 150°C TJ(max) support under-hood ambient temperatures; robust ESD HBM (4 kV) prevents latch-up during assembly. |
Use Scenario: Linear speed regulation of 6–12V DC fans or small PM motors in embedded cooling systems. IC Role / Device Role / Timing Role: Variable-resistance linear pass element controlled by analog voltage or PWM-filtered DAC output. Use Value: 1A continuous rating allows 500 mA sustained motor current with margin; low VBE(on) improves linearity in analog control loop. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NPN medium-power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BCP5616TA | Same package and VCEO, but hFE Group 16 (100–250 at IC = 150 mA) | Higher gain enables lower base drive current; less suitable where gain stability > absolute gain matters | Select when base drive current budget is constrained and tighter hFE tolerance is acceptable. |
| MJD127G | TO-252 package, 80V VCEO, 1A IC, but higher VCE(sat) (≤ 1.5 V @ IC = 0.5 A) and no gain binning | Larger footprint, lower thermal efficiency (RθJA ≈ 60 °C/W vs. 62 °C/W), no automotive qualification path | Choose only if SOT223 footprint is unavailable and board space permits TO-252; avoid for precision gain or automotive designs. |
Compared with BCP5610TA, BCP5616TA offers higher and wider hFE range at same voltage/current ratings - beneficial for low-base-drive designs - while MJD127G trades thermal and gain consistency for legacy TO-252 compatibility, making it less optimal for space-constrained or automotive applications.
Availability
BCP5610TA is available at Aetrix Electronics and suitable for industrial relay drivers, automotive door lock actuators, and audio output stages requiring stable component supply, consistent gain binning, and AEC-Q101-aligned manufacturing traceability.
Supply support for BCP5610TA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.
The BCP54/55/56 family was developed for medium-power linear and switching applications demanding high reliability, thermal efficiency in surface-mount packages, and automotive-grade process control - targeting industrial controls, consumer audio, and body electronics.
FAQ
What is the maximum allowable junction temperature for BCP5610TA?
The BCP5610TA has a specified operating junction temperature range of –55°C to +150°C. At maximum ambient temperature (+125°C), safe operation requires limiting power dissipation to ≤0.8 W using the RθJA = 62 °C/W rating on standard FR4, or ≤1.5 W using RθJL = 19.4 °C/W with proper collector-tab thermal connection.
Is BCP5610TA pin-compatible with BCP54TA or BCP55TA?
Yes - all BCP54/55/56 variants share identical SOT223 pinout (Emitter-Base-Collector-Tab) and mechanical footprint. However, they differ in absolute maximum ratings: BCP54TA is rated for 45V VCEO, BCP55TA for 60V, and BCP5610TA for 80V - substitution requires verification of voltage stress margins in the target circuit.
Does BCP5610TA require a heatsink in typical applications?
No external heatsink is required if the collector tab is soldered to ≥50 mm² of 1 oz copper on a single-sided FR4 PCB. Under those conditions, the device sustains 2W at +25°C ambient. For higher ambient temperatures or smaller copper areas, thermal derating per the datasheet's curve must be applied - heatsinking is unnecessary unless power exceeds 1.2W at +85°C ambient.
What does the '10' suffix in BCP5610TA indicate?
The '10' denotes DC current gain (hFE) binning Group 10, specifying hFE = 63–160 at IC = 150 mA and VCE = 2 V. This binning ensures predictable base drive requirements and reduces unit-to-unit variation in production assemblies - distinct from the '16' variant (hFE = 100–250) and un-binned versions.
BCP5610TA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- TO-261-4, TO-261AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- NPN
- Current - Collector (Ic) (Max):
- 1 A
- Voltage - Collector Emitter Breakdown (Max):
- 80 V
- Vce Saturation (Max) @ Ib, Ic:
- 500mV @ 50mA, 500mA
- Current - Collector Cutoff (Max):
- 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 63 @ 150mA, 2V
- Power - Max:
- 2 W
- Frequency - Transition:
- 150MHz
- Operating Temperature:
- -65°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-223-3
BCP5610TA FAQ
1.How can I place an order for BCP5610TA through Aetrix?
Please submit a Request for Quotation (RFQ) for BCP5610TA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BCP5610TA reliable?
The price and inventory of BCP5610TA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BCP5610TA is usually 5 days.
3.What payment methods are accepted for BCP5610TA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BCP5610TA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BCP5610TA?
BCP5610TA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BCP5610TA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BCP5610TA?
For technical support, including BCP5610TA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BCP5610TA requirements.
6.How does Aetrix verify that BCP5610TA is sourced from the original manufacturer or authorized distributors?
All BCP5610TA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BCP5610TA meets industry standards.
7.What is the process for return or replacement of BCP5610TA?
All BCP5610TA units undergo pre-shipment inspection (PSI). If there is an issue with BCP5610TA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BCP5610TA part is unused and in its original packaging.
Return procedure for BCP5610TA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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