Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > Bipolar (BJT) > Single Bipolar Transistors

Infineon Technologies BCP5616H6327XTSA1

Name: BCP5616H6327XTSA1
Brand: Infineon Technologies
SKU: BCP5616H6327XTSA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: BCP5616H6327XTSA1

Manufacturer:: Infineon Technologies

Category:: Single Bipolar Transistors

Package:: TO-261-4, TO-261AA

Datasheet:: BCP5616H6327XTSA1.pdf

Description:: TRANS NPN 80V 1A PG-SOT223-4-10

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:6,800

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

BCP5616H6327XTSA1 from Infineon Technologies is an NPN silicon bipolar junction transistor designed for audio-frequency driver and output stages in linear and switching applications. It features a collector-emitter breakdown voltage of 80 V, DC current gain (h_FE) of 100–250 at I_C = 150 mA, V_CE = 2 V, and low saturation voltage of ≤0.5 V at I_C = 500 mA / I_B = 50 mA. It is used in automotive amplifier output stages and industrial power control circuits.

For engineers reviewing the BCP5616H6327XTSA1 datasheet, BCP5616H6327XTSA1 pinout, BCP5616H6327XTSA1 application, or BCP5616H6327XTSA1 equivalent, key selection criteria include V_CEO = 80 V, I_C = 1 A continuous, SOT223 package thermal performance, and complementary PNP pairing with BCP53-16 for push-pull configurations.

Technical Context

This transistor operates as a medium-power NPN switch or linear amplifier with specified operation up to T_j = 150 °C and R_thJS ≤ 15 K/W. Its f_T = 100 MHz enables stable gain in AF and low-MHz switching applications, while V_CEsat ≤ 0.5 V supports efficient power delivery under high-current conditions.

The device complies with AEC-Q101 stress testing for automotive use and uses Pb-free (RoHS-compliant) packaging. Its base-emitter breakdown voltage is 5 V, and it exhibits I_CBO ≤ 0.1 µA at 30 V and ≤20 µA at 150 °C - critical for leakage-sensitive bias networks.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CEO	80 V - supports rail voltages up to ±36 V in Class AB audio output stages
I_C (cont.)	1 A - enables direct drive of 8 Ω loads at ≥10 W without external buffering
h_FE	100–250 @ I_C = 150 mA - ensures predictable base drive sizing across production lots
V_CEsat	≤0.5 V @ I_C = 500 mA / I_B = 50 mA - limits conduction loss to <250 mW in saturated switching
f_T	100 MHz - maintains usable gain through 10 MHz, suitable for wideband AF and low-speed digital switching
R_thJS	≤15 K/W - allows 2 W dissipation with ≤30 K rise from solder point, supporting PCB copper pour design
P_tot	2 W @ T_S ≤ 120 °C - defines maximum steady-state power under heatsink-limited mounting

Pinout & Package

The BCP5616H6327XTSA1 is housed in a surface-mount SOT223 package with four terminals: three functional pins (B, C, E) and one exposed collector tab for thermal and electrical connection.

Pin/Terminal	Circuit Role	Design Meaning
1 (B)	Base	Control input; requires 50 mA base drive for full saturation at 500 mA collector current
2 (C)	Collector	Main current output; electrically and thermally connected to exposed metal tab (pin 4)
3 (E)	Emitter	Reference node for biasing; tied to ground or negative rail in common-emitter configuration
4 (C Tab)	Collector Thermal Pad	Provides low-thermal-resistance path to PCB copper; must be soldered for rated P_tot

Key Features

Feature	Design Value
AEC-Q101 qualified	Validated for automotive temperature cycling, humidity, and mechanical shock per JESD22 standards
Complementary PNP pairing	Matched gain and voltage ratings with BCP53-16 for symmetrical push-pull output stages
Low V_CEsat	Reduces conduction loss by >40% vs. standard general-purpose transistors at 500 mA load
RoHS-compliant SOT223	Enables lead-free reflow assembly without derating; footprint compatible with JEDEC MO-178AB
High f_T / h_FE product	Supports stable small-signal amplification up to 10 MHz while maintaining DC current gain >100

Applications

Automotive Audio Output Stage

Industrial DC Motor Driver

Use Scenario: Final output stage in 20–50 W Class AB car radio amplifiers.

IC Role / Device Role / Timing Role: NPN power switch delivering peak currents >800 mA into 4 Ω speaker loads.

Use Value: V_CEO = 80 V withstands automotive load-dump transients; low V_CEsat minimizes heat sink size.

Use Scenario: H-bridge half-bridge leg in 24 V brushed DC motor controllers.

IC Role / Device Role / Timing Role: High-side or low-side switching element controlling direction and speed via PWM.

Use Value: 1 A continuous rating supports 15 W mechanical output; f_T = 100 MHz ensures clean PWM edge fidelity up to 20 kHz.

LED Constant-Current Driver

Linear Voltage Regulator Pass Element

Use Scenario: Adjustable constant-current source for high-brightness LED strings (12–24 V).

IC Role / Device Role / Timing Role: Series pass transistor regulating current via feedback-controlled base voltage.

Use Value: Tight h_FE spread (100–250) enables accurate current setting with minimal sense resistor tolerance impact.

Use Scenario: Pass transistor in 5 V/1 A linear regulators for noise-sensitive analog subsystems.

IC Role / Device Role / Timing Role: Voltage-controlled current source dissipating excess input-output differential.

Use Value: R_thJS ≤ 15 K/W allows 2 W dissipation with <30 K rise - sufficient for 7 V dropout at 1 A.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN medium-power transistor applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
BCP56-16TA	Same die, identical V_CEO, h_FE, and V_CEsat; differs only in tape-and-reel packaging (3,000 pcs vs. 1,000 pcs)	No functional difference; same thermal and electrical behavior in circuit	Select based on volume procurement needs and line-side reel compatibility
MJD127G	Higher V_CEO = 100 V, lower h_FE = 30–120, larger TO-252 package	Requires larger PCB area and different thermal layout; suited for higher-voltage industrial use	Choose when >80 V breakdown margin is required and SOT223 footprint is not mandatory

Compared with BCP5616H6327XTSA1, BCP56-16TA offers identical performance in alternate packaging, while MJD127G trades SOT223 compactness for higher voltage headroom and lower gain consistency - impacting base drive design and board space.

Availability

BCP5616H6327XTSA1 is available at Aetrix Electronics and suitable for automotive audio systems, industrial motor drives, and LED lighting control requiring stable component supply and AEC-Q101 qualification.

Supply support for BCP5616H6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.

The BCP54–BCP56 series belongs to Infineon's portfolio of AEC-Q101-qualified bipolar transistors engineered for reliable AF and medium-power switching in harsh automotive and industrial environments.

FAQ

Is BCP5616H6327XTSA1 pin-compatible with BCP54 or BCP55 variants?

Yes - all BCP54/55/56 variants share identical SOT223 pinout (B-C-E-C tab) and mechanical footprint. However, V_CEO and V_CBO differ: BCP54 = 45 V, BCP55 = 60 V, BCP56 = 80 V. Substitution requires verification of voltage margin in the target circuit.

What is the maximum allowable base current for continuous operation?

The absolute maximum DC base current is 100 mA per datasheet. For reliable long-term operation at I_C = 1 A, base current should be limited to ≤100 mA with appropriate current-limiting resistor or driver stage, and thermal derating applied if T_j exceeds 125 °C.

Does the exposed collector tab require electrical isolation from the PCB ground plane?

No - the collector tab is electrically connected to pin 2 (collector). If the collector node is at non-ground potential, the tab must be isolated using a thermally conductive but electrically insulating pad (e.g., silicone thermal pad with dielectric strength >500 V).

Can BCP5616H6327XTSA1 be used in parallel configurations?

Parallel operation is not recommended without individual emitter resistors due to h_FE variation (100–250) and thermal runaway risk. If required, use matched devices with 0.22 Ω emitter resistors and shared thermal mass to ensure current sharing within ±15%.

BCP5616H6327XTSA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: -

Package/Case:: TO-261-4, TO-261AA

Packaging:: Tape & Reel (TR)

Product Status:: Last Time Buy

Transistor Type:: NPN

Current - Collector (Ic) (Max):: 1 A

Voltage - Collector Emitter Breakdown (Max):: 80 V

Vce Saturation (Max) @ Ib, Ic:: 500mV @ 50mA, 500mA

Current - Collector Cutoff (Max):: 100nA (ICBO)

DC Current Gain (hFE) (Min) @ Ic, Vce:: 100 @ 150mA, 2V

Power - Max:: 2 W

Frequency - Transition:: 100MHz

Operating Temperature:: 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-SOT223-4-10

BCP5616H6327XTSA1 FAQ

1.How can I place an order for BCP5616H6327XTSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BCP5616H6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BCP5616H6327XTSA1 reliable?

The price and inventory of BCP5616H6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BCP5616H6327XTSA1 is usually 5 days.

3.What payment methods are accepted for BCP5616H6327XTSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BCP5616H6327XTSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BCP5616H6327XTSA1?

BCP5616H6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BCP5616H6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BCP5616H6327XTSA1?

For technical support, including BCP5616H6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BCP5616H6327XTSA1 requirements.

6.How does Aetrix verify that BCP5616H6327XTSA1 is sourced from the original manufacturer or authorized distributors?

All BCP5616H6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BCP5616H6327XTSA1 meets industry standards.

7.What is the process for return or replacement of BCP5616H6327XTSA1?

All BCP5616H6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BCP5616H6327XTSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BCP5616H6327XTSA1 part is unused and in its original packaging.

Return procedure for BCP5616H6327XTSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…