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NXP Semiconductors BCP69-16/DG,115
- Part No.:
- BCP69-16/DG,115
- Manufacturer:
- NXP Semiconductors
- Category:
- Single Bipolar Transistors
- Package:
- TO-261-4, TO-261AA
- Datasheet:
-
BCP69-16/DG,115.pdf
- Description:
- TRANS PNP SC73
- Quantity:
- Payment:
- Shipping:
Inventory:8,007
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Product details
Overview
BCP69-16/DG,115 from NXP Semiconductors is a PNP medium-power bipolar junction transistor in SOT223 (SC-73) surface-mount package, rated for −20 V VCEO, −2 A continuous collector current, and 100–250 DC current gain (hFE) at −1 V VCE and −500 mA IC. It serves as a high-side switch or linear regulator pass device in automotive and industrial power management circuits.
For engineers reviewing the BCP69-16/DG,115 datasheet, BCP69-16/DG,115 pinout, BCP69-16/DG,115 application, or BCP69-16/DG,115 equivalent, this page delivers verified electrical specs, thermal derating curves, AEC-Q101 qualification status, SOT223 pin mapping, and direct alternatives for high-reliability discrete power switching designs.
Technical Context
The BCP69-16/DG,115 operates as a silicon PNP BJT with fixed hFE selection group −16 (100–250), optimized for stable DC amplification and switching in medium-current analog and power control stages. Its SOT223 package features an exposed collector pad (pins 2 and 4) enabling low thermal resistance to PCB copper-critical for sustained −2 A operation under ambient temperatures up to +150 °C.
It meets AEC-Q101 stress qualification for automotive use and supports linear regulation, MOSFET gate driving, and battery-powered load switching where precise current gain and robust thermal performance are required. The device exhibits −0.5 V typical VCE(sat) at −1 A/−100 mA drive and 40–140 MHz fT for moderate-frequency signal handling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | −20 V - Maximum safe collector-emitter voltage with base open; defines upper rail limit in high-side switch configurations. |
| IC | −2 A - Continuous DC collector current rating; supports ≥2 A load switching without forced cooling on standard FR4 PCB. |
| hFE (−1 V, −500 mA) | 100–250 - Guaranteed DC current gain range for −16 selection group; enables predictable base drive sizing in linear and saturated operation. |
| VCE(sat) (−1 A, −100 mA) | ≤ −0.5 V - Low saturation voltage reduces conduction loss and self-heating in switching applications. |
| Rth(j-a) (std footprint) | 192 K/W - Junction-to-ambient thermal resistance on single-layer FR4; determines max power dissipation at given ambient temperature. |
| fT | 40–140 MHz - Transition frequency confirms usable bandwidth for audio and low-MHz signal amplification or feedback control loops. |
| AEC-Q101 | Qualified - Validated for automotive-grade reliability per AEC stress test requirements; suitable for under-hood and infotainment power stages. |
Pinout & Package
SOT223 (SC-73) plastic surface-mounted package with 4 leads and exposed collector pad for enhanced thermal and electrical conductivity. Pin 1 = Base, Pin 2 = Collector, Pin 3 = Emitter, Pin 4 = Collector (dual collector connection).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Base | Control terminal for forward-biased PNP operation; requires negative bias relative to emitter to turn on. |
| 2 | Collector | Main current sink node; electrically and thermally connected to exposed pad for heat transfer to PCB copper. |
| 3 | Emitter | High-side reference node; typically tied to positive supply rail in high-side switch configurations. |
| 4 | Collector | Second collector connection-internally bonded to Pin 2; must be soldered to same copper pour for optimal thermal performance. |
Key Features
| Feature | Design Value |
|---|---|
| Three hFE selections | Enables precise base drive design across production lots: −16 (100–250), −25 (160–375), and standard (85–375). |
| Exposed collector pad (SOT223) | Reduces Rth(j-a) to 93 K/W with 6 cm² copper pad-enabling 1.35 W dissipation at Tamb = 25 °C. |
| AEC-Q101 qualification | Validates suitability for automotive power modules, body control units, and engine management subsystems requiring extended lifetime and thermal cycling robustness. |
| Medium power capability | Combines −2 A current handling with compact SMD footprint-replacing through-hole TO-225/TO-126 devices without sacrificing thermal margin. |
| Leadless SMD construction | Eliminates leadframe parasitics and improves high-frequency response; compatible with standard reflow soldering profiles (J-STD-020). |
Applications
| Linear Voltage Regulators | High-Side Power Switches |
|---|---|
Use Scenario: Adjustable LDO pass element in automotive cabin controllers requiring stable 3.3 V or 5 V rails from 12 V battery input. IC Role / Device Role / Timing Role: PNP pass transistor regulating output voltage via emitter-follower configuration with feedback-controlled base bias. Use Value: −0.5 V VCE(sat) minimizes dropout voltage; AEC-Q101 ensures reliability over 15-year vehicle lifetime. |
Use Scenario: Load disconnect switch for rear lighting or HVAC actuators in 12 V automotive systems. IC Role / Device Role / Timing Role: High-side switch controlling current flow from battery to load; base driven by microcontroller GPIO or dedicated driver. Use Value: −2 A IC rating supports >20 W loads; dual-collector SOT223 package sustains continuous operation at 85 °C ambient. |
| MOSFET Gate Drivers | Battery-Driven Devices |
Use Scenario: Level-shifting gate driver stage for N-channel high-side MOSFETs in BLDC motor inverters or DC-DC converters. IC Role / Device Role / Timing Role: PNP emitter follower providing fast turn-on current and controlled turn-off via base pull-down resistor. Use Value: 140 MHz fT supports ≤1 MHz switching; −0.5 V VCE(sat) limits driver-stage conduction loss. |
Use Scenario: Power enable switch in portable medical monitors or handheld test equipment powered by Li-ion batteries. IC Role / Device Role / Timing Role: Low-leakage (≤100 nA ICBO) PNP switch isolating downstream circuitry during standby mode. Use Value: −100 nA collector cutoff current extends battery shelf life; SOT223 footprint enables compact layout with minimal board area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PNP medium-power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BCP69-25/DG,115 | Higher hFE range (160–375) at −500 mA; otherwise identical VCEO, IC, package, and thermal specs. | Better suited for low-base-drive designs (e.g., microcontroller GPIO direct drive); may require tighter gain tolerance control in precision regulators. | Select when lower base current or higher loop gain is needed; verify stability in feedback-critical applications. |
| BC869-16,115 | SOT89 package (3-pin, smaller footprint); same −20 V/−2 A ratings but lower Ptot (0.50 W std vs. 0.65 W for BCP69); hFE −16 group confirmed. | Preferred for space-constrained layouts where thermal budget allows; not interchangeable due to different pinout (Emitter–Collector–Base) and thermal profile. | Choose for compact consumer electronics; avoid in high-ambient or high-duty-cycle automotive use without thermal validation. |
Compared with BCP69-16/DG,115, the −25 variant offers higher gain for reduced base drive burden, while BC869-16,115 trades thermal headroom for footprint reduction-neither is pin-compatible, but both serve overlapping PNP switching roles with distinct layout and thermal trade-offs.
Availability
BCP69-16/DG,115 is available at Aetrix Electronics and suitable for automotive power management, industrial linear regulators, and high-side load switching requiring stable component supply and AEC-Q101 compliance.
Supply support for BCP69-16/DG,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in power management and automotive-grade discrete components.
The BCP69 series belongs to NXP's AEC-Q101-qualified medium-power transistor family, designed specifically for high-reliability automotive and industrial power control applications demanding robust thermal performance and consistent DC gain.
FAQ
What is the exact hFE range guaranteed for BCP69-16/DG,115?
The BCP69-16/DG,115 is binned to the −16 hFE selection group, guaranteeing a DC current gain of 100 to 250 when measured at VCE = −1 V and IC = −500 mA. This range is validated per NXP's production test flow and documented in Table 2 and Table 8 of the official BCP69_BC869_BC69PA datasheet Rev. 7.
Is BCP69-16/DG,115 pin-compatible with BC869-16,115?
No, BCP69-16/DG,115 is not pin-compatible with BC869-16,115. The BCP69-16/DG,115 uses SOT223 (4-pin, pinout: Base–Collector–Emitter–Collector), while BC869-16,115 uses SOT89 (3-pin, pinout: Emitter–Collector–Base). Their footprints, thermal pads, and terminal assignments differ fundamentally-PCB redesign is required for substitution.
What is the maximum power dissipation of BCP69-16/DG,115 on a standard FR4 PCB?
On a standard FR4 PCB with single-sided copper and no extended heatsink, the BCP69-16/DG,115 has a maximum total power dissipation (Ptot) of 0.65 W at Tamb ≤ 25 °C. This value drops linearly with rising ambient temperature per Figure 1 in the datasheet, reaching zero at approximately 125 °C ambient.
Does BCP69-16/DG,115 support reflow soldering only, or can it be wave-soldered?
Reflow soldering is the only recommended process for BCP69-16/DG,115. NXP explicitly states "Reflow soldering is the only recommended soldering method" in Section 11 of the datasheet. Wave soldering is not qualified and risks thermal damage due to the SOT223 package's thermal mass and internal bond wire limitations.
What automotive qualification does BCP69-16/DG,115 hold?
BCP69-16/DG,115 is qualified to AEC-Q101 for discrete semiconductors, covering stress tests including HTGB, HTRB, AC/DC life test, temperature cycling, and mechanical shock. This qualification is explicitly stated in Section 8.1 and confirmed in the revision history of the BCP69_BC869_BC69PA datasheet Rev. 7.
BCP69-16/DG,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- TO-261-4, TO-261AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Transistor Type:
- -
- Current - Collector (Ic) (Max):
- -
- Voltage - Collector Emitter Breakdown (Max):
- -
- Vce Saturation (Max) @ Ib, Ic:
- -
- Current - Collector Cutoff (Max):
- -
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- -
- Power - Max:
- -
- Frequency - Transition:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SC-73
BCP69-16/DG,115 FAQ
1.How can I place an order for BCP69-16/DG,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for BCP69-16/DG,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BCP69-16/DG,115 reliable?
The price and inventory of BCP69-16/DG,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BCP69-16/DG,115 is usually 5 days.
3.What payment methods are accepted for BCP69-16/DG,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BCP69-16/DG,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BCP69-16/DG,115?
BCP69-16/DG,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BCP69-16/DG,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BCP69-16/DG,115?
For technical support, including BCP69-16/DG,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BCP69-16/DG,115 requirements.
6.How does Aetrix verify that BCP69-16/DG,115 is sourced from the original manufacturer or authorized distributors?
All BCP69-16/DG,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BCP69-16/DG,115 meets industry standards.
7.What is the process for return or replacement of BCP69-16/DG,115?
All BCP69-16/DG,115 units undergo pre-shipment inspection (PSI). If there is an issue with BCP69-16/DG,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BCP69-16/DG,115 part is unused and in its original packaging.
Return procedure for BCP69-16/DG,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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