Infineon Technologies BCR 183 B6327

Overview

BCR 183 B6327 from Infineon Technologies is a PNP silicon digital transistor with integrated bias resistors (R1 = R2 = 10 kΩ), designed for switching, inverting, interface, and driver circuits in automotive and industrial control systems. It features V_CEO = 50 V, I_C = 100 mA, V_CE(sat) ≤ 0.3 V at I_C = 10 mA / I_B = 0.5 mA, and AEC-Q101 qualification.

For engineers reviewing the BCR 183 B6327 datasheet, BCR 183 B6327 pinout, BCR 183 B6327 application, or BCR 183 B6327 equivalent, key selection criteria include built-in resistor matching, thermal resistance (R_thJS ≤ 133 K/W for BCR183U variant), RoHS-compliant SC74 package, and guaranteed performance across −40 °C to +125 °C ambient.

Technical Context

This device integrates two matched PNP transistors in a single SC74 (SOT-363) package with isolated die and symmetrical pinout. Its internal R1/R2 ratio (0.9–1.1) ensures consistent logic-level switching behavior across temperature.

The digital transistor operates as a single-stage inverter or level shifter without external base biasing. Input voltage thresholds-V_i(on) = 1–2.5 V and V_i(off) = 0.8–1.8 V-enable direct interfacing with 3.3 V and 5 V CMOS/TTL logic families under defined load conditions.

Key Specifications

Pinout & Package

BCR 183 B6327 uses the SC74 (SOT-363) surface-mount package: 6-pin, 2.5 mm × 1.9 mm footprint, 1.1 mm max height, RoHS-compliant matte tin lead finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital transistor applications.

Compared with BCR 183 B6327, BCR193B offers complementary NPN functionality but requires redesign of drive logic, while NSVD2101PT1G sacrifices dual-transistor matching and precision biasing for lower unit cost in non-matched applications.

Availability

BCR 183 B6327 is available at Aetrix Electronics and suitable for automotive lighting control, industrial PLC I/O modules, consumer appliance motor drivers, and medical diagnostic equipment interfaces requiring stable component supply and AEC-Q101 compliance.

Supply support for BCR 183 B6327 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and discrete power devices, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The BCR183 series belongs to Infineon's automotive-qualified digital transistor product line, engineered specifically for robust, space-constrained switching in harsh-environment control systems where reliability and thermal stability are critical.

FAQ

What is the maximum continuous collector current for BCR 183 B6327?

The absolute maximum continuous collector current is 100 mA per transistor channel, verified under T_S ≤ 118 °C for the BCR183U variant. Derating applies above this case temperature, with total power dissipation dropping linearly to zero at 150 °C junction temperature. Pulse operation allows higher peak currents per the permissible pulse load curves in the datasheet.

Does BCR 183 B6327 support dual independent switching functions?

Yes - the SC74 package contains two electrically isolated PNP transistors (TR1 and TR2) with individually accessible collectors, emitters, and bases. Pin assignments allow simultaneous or independent control, and the matched R1/R2 values ensure consistent switching thresholds across both channels under identical thermal conditions.

Can BCR 183 B6327 be used with 3.3 V microcontroller GPIOs?

Yes - its V_i(on) range (1–2.5 V) guarantees turn-on with standard 3.3 V logic high outputs, and V_i(off) (0.8–1.8 V) ensures reliable cutoff during logic low states. No level-shifting circuitry is required, provided the GPIO can source ≥100 µA to bias the internal R1 resistor.

Is there a recommended PCB layout guideline for thermal management?

Yes - Infineon recommends using ≥10 mm² copper pour connected to Pin 2 (E1) and Pin 4 (E2) as thermal pads, with ≥2 thermal vias per emitter pad to inner ground planes. The SC74 footprint drawing specifies 0.35 mm pad width and 0.95 mm spacing; maintaining solder mask defined pads improves thermal transfer efficiency by ~15% versus non-solder-mask-defined layouts.