Diodes Incorporated BCX5316-13R

Overview

BCX5316-13R from Diodes Incorporated is a PNP medium-power transistor in SOT89 package, rated for -80V V_CEO, -1A continuous collector current, and V_CE(sat) < -500mV at -500mA/-50mA drive-used in AF output stages and medium-power switching circuits requiring robust thermal performance on 50mm² copper.

For engineers reviewing the BCX5316-13R datasheet, BCX5316-13R pinout, BCX5316-13R application, or BCX5316-13R equivalent, key selection criteria include verified V_CEO = -80V rating, R_θJC = 27°C/W junction-to-case thermal resistance, SOT89 collector-pad thermal path, and complementary NPN pairing with BCX5616-13R for push-pull designs.

Technical Context

This PNP bipolar junction transistor operates in linear amplification and saturated switching modes, with DC current gain (h_FE) ranging from 100 to 250 at I_C = -150mA/V_CE = -2V and dropping to 25 at I_C = -5mA. Its f_T = 150MHz supports audio-frequency signal handling up to ~100kHz with stable gain.

Thermal design relies on the exposed collector pad: R_θJA improves from 125°C/W (15mm × 15mm 1oz Cu) to 60°C/W (50mm × 50mm 1oz Cu), while R_θJL = 13°C/W confirms low-resistance conduction path to PCB copper. ESD ratings meet HBM 4kV and CDM 1kV per JEDEC JS-001/JS-002.

Key Specifications

Pinout & Package

Package: SOT89 - Surface-mount plastic package with exposed collector pad for thermal conduction; 3-terminal configuration; 0.052g mass; UL 94V-0 molding compound; matte tin finish leads.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP medium-power transistor applications.

Compared with ZTX753-13R and MJD2955RLG, BCX5316-13R uniquely balances -80V rating, SOT89 thermal efficiency (R_θJC = 27°C/W), and surface-mount compatibility-making it optimal for space-constrained 1–2W industrial switching and audio output designs.

Availability

BCX5316-13R is available at Aetrix Electronics and suitable for industrial motor drives, audio amplifier modules, and programmable logic controller (PLC) output stages requiring stable component supply, long-term lifecycle support, and RoHS 3 compliance.

Supply support for BCX5316-13R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

BCX5316-13R belongs to the BCX5x PNP transistor family designed specifically for medium-power linear amplification and switching in industrial, consumer, and automotive-qualified applications-emphasizing voltage margin, thermal reliability, and lead-free compliance.

FAQ

What is the maximum continuous power dissipation for BCX5316-13R on a standard FR4 PCB?

With the exposed collector pad soldered to 50mm × 50mm of 1oz copper, BCX5316-13R achieves 2.0W continuous power dissipation (R_θJA = 60°C/W). On smaller copper areas (e.g., 15mm × 15mm), derating applies: 1.0W at R_θJA = 125°C/W. Ambient temperature above +25°C further reduces usable power per the derating curve in Figure 1.

Is BCX5316-13R pin-compatible with BCX5116-13R or BCX5216-13R?

Yes-BCX5316-13R shares identical SOT89 package, pinout (C/E/B), and marking layout (AL code) with BCX5116-13R (AD) and BCX5216-13R (AM), enabling drop-in replacement where voltage and gain requirements align. However, V_CEO differs: -45V, -60V, and -80V respectively-so substitution requires verification of circuit voltage stress margins.

Does BCX5316-13R support automotive-grade qualification?

BCX5316-13R is manufactured in IATF 16949 certified facilities and supports PPAP documentation. While not pre-qualified to AEC-Q101 out-of-box, Diodes Incorporated offers AEC-Q101 qualification upon customer request with defined change control-making it suitable for automotive applications where qualification path is managed jointly with the supplier.

How does the SOT89 package's exposed collector pad affect PCB layout?

The exposed collector pad must be connected directly to a dedicated copper pour (≥50mm² recommended) using multiple thermal vias to inner-layer ground or power planes. Avoid routing traces under the pad; use solder mask defined (SMD) stencil openings per Diodes' suggested pad layout. Insufficient copper area raises junction temperature, triggering premature thermal shutdown or parametric shift in h_FE and V_CE(sat).