NXP Semiconductors BF1100WR,115
- Part No.:
- BF1100WR,115
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- SC-82A, SOT-343
- Datasheet:
-
BF1100WR,115.pdf
- Description:
- RF MOSFET 9V CMPAK-4
- Quantity:
- Payment:

- Shipping:

Inventory:9,986
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Product details
Overview
BF1100WR from NXP Semiconductors is a dual-gate enhancement-mode MOSFET in SOT343R package, designed for VHF/UHF RF amplification with 28 mS forward transfer admittance, 2.2 pF input capacitance at gate 1, and 2 dB noise figure at 800 MHz - deployed in television tuners and professional communications receivers.
For engineers reviewing the BF1100WR datasheet, BF1100WR pinout, BF1100WR application, or BF1100WR equivalent, this page delivers verified electrical parameters, AGC-optimized cross-modulation performance, gate-specific breakdown voltages, thermal resistance data (Rth j-a = 350 K/W), and real-world RF gain behavior up to 1 GHz.
Technical Context
This dual-gate MOSFET integrates an internal bias circuit linking source and substrate to stabilize cross-modulation during automatic gain control (AGC). Gate 1 serves as RF input with low input capacitance (2.2 pF), while gate 2 functions as AGC control node with 4 V typical bias voltage.
It operates at 9–12 V supply, supports 10 mA drain current under standard test conditions, and achieves 28 mS |yfs| with minimal reverse transfer capacitance (25–35 fF), enabling high isolation and stable broadband amplification from 50 MHz to 1 GHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS max | 14 V - sets absolute maximum drain-source operating voltage; limits usable supply headroom in amplifier stages. |
| |yfs| typ | 28 mS - defines small-signal transconductance; directly determines gain per unit load impedance in common-source configuration. |
| Cig1-s typ | 2.2 pF - gate 1 input capacitance at 1 MHz; critical for impedance matching and bandwidth control in VHF front-end designs. |
| F typ @ 800 MHz | 2 dB - noise figure under matched conditions; enables low-noise amplification in UHF receiver signal chains. |
| Ptot max | 280 mW - total power dissipation limit on PCB; constrains continuous RF output power and thermal design margin. |
| V(BR)G1-SS min | 13.2 V - gate 1–source breakdown voltage; ensures robustness against transient overvoltage at RF input node. |
| Rth j-a | 350 K/W - junction-to-ambient thermal resistance; dictates required copper area and airflow for reliable 150 °C junction operation. |
Pinout & Package
Package: SOT343R - plastic surface-mounted microminiature package with reverse pinning (pin 1 = source/bulk, pin 4 = gate 1), 1.35 × 1.15 mm footprint, 0.7 mm height, and 0.5 mm lead pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | source (s) / bulk (b) | Common reference node for both gates and drain; internally connected to substrate to optimize cross-modulation performance during AGC. |
| 2 | drain (d) | RF output node; carries amplified signal current; requires DC blocking and impedance-matching network for 50 Ω systems. |
| 3 | gate 2 (g2) | AGC control terminal; biased at 4 V for optimal linearity; modulates gain without degrading noise figure or intermodulation distortion. |
| 4 | gate 1 (g1) | RF input terminal; high-impedance node with 2.2 pF capacitance; requires external DC blocking and matching to 50 Ω source impedance. |
Key Features
| Feature | Design Value |
|---|---|
| AGC-optimized internal bias | Source-substrate interconnection ensures stable gain reduction vs. VAGC, minimizing cross-modulation distortion in tuner IF stages. |
| High yfs/Cig1-s ratio | 12.7 mS/pF - enables wideband gain flatness and efficient matching in 50–1000 MHz applications without neutralization. |
| Low-noise RF amplification | 2 dB noise figure at 800 MHz with GSopt/BSopt matching - meets sensitivity requirements for analog TV and land-mobile radio front ends. |
| Gate isolation | 25–35 fF Crs - suppresses feedback from drain to gate 1, improving stability and reducing risk of oscillation in high-gain configurations. |
| Short-channel structure | Enables operation up to 1 GHz with predictable S-parameters (e.g., |S21| = 2.618 @ 50 MHz, 2.167 @ 1 GHz at VDS = 9 V). |
Applications
| Television Tuner Front End | Professional UHF Receiver |
|---|---|
|
Use Scenario: Amplifying weak VHF/UHF broadcast signals prior to mixer stage in analog TV tuners. IC Role / Device Role / Timing Role: Low-noise RF amplifier with AGC-controlled gain staging using gate 2 voltage modulation. Use Value: 2 dB noise figure and 28 mS |yfs| deliver >15 dB gain with minimal degradation of signal-to-noise ratio across 47–862 MHz bands. |
Use Scenario: First-stage amplification in portable land-mobile radios operating at 400–500 MHz. IC Role / Device Role / Timing Role: Dual-gate amplifier providing stable gain under varying battery voltage (9–12 V) and temperature. Use Value: Cross-modulation suppression below –90 dBμV at 30 dB gain reduction enables clear reception in multi-channel interference environments. |
| CATV Signal Distribution | RF Test Equipment Preamp |
|
Use Scenario: Boosting downstream cable TV signals before distribution to multiple set-top boxes. IC Role / Device Role / Timing Role: Wideband gain block with flat frequency response from 50–1000 MHz and low harmonic distortion. Use Value: 2.2 pF Cig1-s and 1.4 pF Cos support broadband 50 Ω matching without external neutralization components. |
Use Scenario: Input stage of spectrum analyzers or RF signal generators requiring low-noise, high-linearity amplification. IC Role / Device Role / Timing Role: Precision RF amplifier with calibrated gain and repeatable noise performance across production units. Use Value: TYP 28 mS |yfs| and <±50 nA gate leakage ensure consistent small-signal behavior and measurement repeatability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-gate MOSFET amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BF998 | Higher |yfs| (35 mS typ), lower Cig1-s (1.7 pF), same SOT343R package but different pinout (pin 1 = g1, not s/b). | Better gain-bandwidth product; suited for higher-frequency designs (>1 GHz), but requires PCB layout revision due to reversed pinning. | Select BF998 only when upgrading bandwidth beyond 1 GHz and redesigning layout; not drop-in compatible with BF1100WR. |
| NE3501M04 | Single-gate GaAs FET; 0.5 dB lower noise figure (1.5 dB), 1.2 pF Ciss, but no AGC capability via second gate. | Superior noise performance in fixed-gain LNA roles; lacks gate 2 for analog AGC, requiring external VGA or digital control loop. | Choose NE3501M04 for ultra-low-noise fixed-gain amplifiers where AGC is implemented digitally or externally; not functionally equivalent for analog AGC systems. |
Compared with BF998 and NE3501M04, the BF1100WR uniquely balances AGC controllability, VHF/UHF noise performance, and proven reliability in broadcast tuner designs - making it irreplaceable where analog gain control and cross-modulation immunity are mandatory.
Availability
BF1100WR is available at Aetrix Electronics and suitable for television tuner front ends, professional UHF receivers, CATV signal distribution, RF test equipment preamplifiers, and VHF communication modules requiring stable component supply across long-lifecycle consumer and industrial programs.
Supply support for BF1100WR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in high-performance RF, analog, and mixed-signal solutions for automotive, industrial, and consumer applications.
The BF1100WR belongs to NXP's legacy RF transistor portfolio, engineered specifically for analog VHF/UHF signal amplification with integrated AGC optimization - targeting broadcast, communications, and test instrumentation markets.
FAQ
What is the maximum recommended drain-source voltage for BF1100WR?
The BF1100WR has an absolute maximum drain-source voltage (VDS) rating of 14 V, as specified in the Limiting Values table. Operation above this voltage risks permanent device failure. For reliable long-term use, design should maintain VDS ≤ 12 V under all conditions including transients and ripple, especially when paired with 9–12 V supply rails in tuner applications.
How does gate 2 (g2) function in BF1100WR AGC operation?
In the BF1100WR, gate 2 serves as the AGC control terminal and is typically biased at 4 V. Varying the gate 2 voltage modulates the channel conductivity without significantly affecting noise figure, enabling smooth gain reduction (up to 50 dB) while maintaining cross-modulation performance - a key feature validated in Figure 4 and Figure 5 of the datasheet.
Is BF1100WR pin-compatible with other SOT343R dual-gate MOSFETs like BF998?
No, the BF1100WR is not pin-compatible with BF998 despite sharing the SOT343R package. The BF1100WR uses reverse pinning (pin 1 = source/bulk), whereas BF998 uses standard pinning (pin 1 = gate 1). Swapping them without PCB revision will result in incorrect connections and functional failure.
What is the typical noise figure of BF1100WR and at what frequency is it measured?
The BF1100WR achieves a typical noise figure (F) of 2 dB at 800 MHz, measured under conditions of VDS = 9 V, VG2-S = 4 V, ID = 10 mA, and with source and load impedances tuned to GSopt and BSopt. This value is confirmed in Table 2 and Figure 19 of the datasheet and reflects its suitability for UHF receiver front ends.
Can BF1100WR be used in 1 GHz applications?
Yes, the BF1100WR supports operation up to 1 GHz, as confirmed by scattering parameter data (Tables 1 and 3) showing |S21| = 2.167 at 1000 MHz (VDS = 9 V). However, gain rolls off above 800 MHz, and noise figure increases slightly; system-level validation is required for 1 GHz designs, particularly regarding stability and matching network losses.
BF1100WR,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- SC-82A, SOT-343
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- N-Channel Dual Gate
- Frequency:
- 800MHz
- Gain:
- -
- Voltage - Test:
- 9 V
- Current Rating (Amps):
- 30mA
- Noise Figure:
- 2dB
- Current - Test:
- 10 mA
- Power - Output:
- -
- Voltage - Rated:
- 14 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- CMPAK-4
BF1100WR,115 FAQ
1.How can I place an order for BF1100WR,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for BF1100WR,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BF1100WR,115 reliable?
The price and inventory of BF1100WR,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BF1100WR,115 is usually 5 days.
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5.How can I obtain technical support or documentation for BF1100WR,115?
For technical support, including BF1100WR,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BF1100WR,115 requirements.
6.How does Aetrix verify that BF1100WR,115 is sourced from the original manufacturer or authorized distributors?
All BF1100WR,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BF1100WR,115 meets industry standards.
7.What is the process for return or replacement of BF1100WR,115?
All BF1100WR,115 units undergo pre-shipment inspection (PSI). If there is an issue with BF1100WR,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BF1100WR,115 part is unused and in its original packaging.
Return procedure for BF1100WR,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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