NXP Semiconductors BF1108R,215
- Part No.:
- BF1108R,215
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- SOT-143R
- Datasheet:
-
BF1108R,215.pdf
- Description:
- RF MOSFET SOT143R
- Quantity:
- Payment:

- Shipping:

Inventory:8,775
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Product details
Overview
BF1108R,215 from NXP Semiconductors is a silicon RF switch combining a depletion-mode MOSFET and integrated band-switching diode in an SOT143R package. It delivers ≤2 dB on-state insertion loss and ≥30 dB off-state isolation up to 1 GHz, with 12 Ω typical RDS(on), −3 V gate-source pinch-off voltage, and ESD-sensitive handling. It enables low-loss signal routing in VCR tuner loop-through and transceiver switching paths.
For engineers reviewing the BF1108R,215 datasheet, BF1108R,215 pinout, BF1108R,215 application, or BF1108R,215 equivalent, this page provides verified RF switching parameters, SOT143R terminal mapping, real-world use cases in analog RF front-ends, and validated alternative parts for design continuity and sourcing flexibility.
Technical Context
The BF1108R,215 integrates a depletion-type FET with a series-connected switching diode-cathode tied to the FET gate-to isolate the gate from ground during operation, minimizing parasitic capacitance and insertion loss. Its dual-device architecture enables fast, low-loss RF path control without external bias networks.
Static characteristics include −3 V to −4 V VGS(p), 12–20 Ω RDS(on), and 7 V V(BR)GSS; dynamic performance is specified at 50 Ω system impedance with VSK/VDK = 0 V (on) or 5 V (off), supporting reliable RF switching up to 1 GHz under standard test conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-state insertion loss | ≤2 dB at f ≤1 GHz, 50 Ω system - ensures minimal RF signal attenuation in active path |
| Off-state isolation | ≥30 dB at f ≤1 GHz, 50 Ω system - prevents signal leakage between switched paths |
| RDS(on) | 12–20 Ω at VGS = 0 V, ID = 1 mA - defines conduction resistance impacting insertion loss and power handling |
| VGS(p) | −3 to −4 V at VDS = 1 V, ID = 20 µA - sets gate bias threshold for reliable depletion-mode turn-on |
| Input capacitance (Ci) | 0.65–0.9 pF at VSK/VDK = 0 V - contributes to matching network design and bandwidth limits |
| Diode capacitance (Cd) | 1.1 pF at f = 1 MHz, VR = 0 V - affects high-frequency shunt behavior of integrated protection diode |
| ESD sensitivity | Class 1B per JEDEC JS-001 - mandates handling controls during assembly and test |
Pinout & Package
SOT143R plastic surface-mounted package (4 leads, reverse pinning); dimensions: 3.0 × 1.4 × 1.1 mm (L × W × H), thermal resistance Rth(j-sp) = 250 K/W.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | FET gate; diode anode | Common control node: gate drive input and diode anode for gate isolation and surge protection |
| 2 | diode cathode | Connects to VSK/VDK bias rail; enables gate isolation when forward-biased during off-state |
| 3 | source | Interchangeable with drain; RF signal path terminal with low RDS(on) conduction when on |
| 4 | drain | Interchangeable with source; second RF signal path terminal; symmetric layout supports bidirectional RF routing |
Key Features
| Feature | Design Value |
|---|---|
| Integrated gate-protection diode | Diode between gate and cathode (Pin 2) isolates gate from ground, reducing parasitic capacitance and improving isolation |
| Depletion-mode FET core | Operates in normally-on state with VGS = 0 V, simplifying bias circuitry in RF front-end designs |
| Low on-state RDS(on) | 12 Ω typical enables <2 dB insertion loss at 1 GHz, critical for high-fidelity analog RF signal integrity |
| ESD-protected structure | Integrated gate-source/drain protection diodes suppress >7 V transients, meeting IEC 61000-4-2 requirements |
| Reverse-pin SOT143R footprint | Enables PCB layout compatibility with alternate variants while maintaining mechanical and thermal equivalence |
Applications
| VCR Tuner Loop-Through | Transceiver Antenna Switching |
|---|---|
Use Scenario: Signal pass-through path in analog video cassette recorder tuners, where RF input must be routed directly to output with minimal degradation during standby mode. IC Role / Device Role / Timing Role: Normally-on RF switch providing low-loss, direct-conduction path between antenna and IF stage without active bias control. Use Value: ≤2 dB insertion loss preserves signal-to-noise ratio across full 1 GHz tuner bandwidth, avoiding image distortion or ghosting. |
Use Scenario: Bidirectional RF path selection between transmit and receive chains in half-duplex transceivers, requiring fast, low-leakage switching. IC Role / Device Role / Timing Role: RF signal router enabling T/R isolation via gate voltage control; drain/source interchangeability supports symmetrical layout. Use Value: ≥30 dB off-state isolation at 1 GHz prevents TX leakage into RX path, eliminating desensitization and adjacent-channel interference. |
| FM Radio Front-End Switching | IF Signal Path Selection |
Use Scenario: Selecting between multiple antenna inputs or filtering paths in FM broadcast receivers operating below 108 MHz. IC Role / Device Role / Timing Role: Low-capacitance RF switch inserted between LNA and mixer stages to enable gain or filter reconfiguration. Use Value: 0.65–0.9 pF input capacitance minimizes loading on high-impedance IF nodes, preserving Q-factor and selectivity. |
Use Scenario: Routing intermediate frequency signals between demodulator, audio processor, and recording circuits in legacy consumer AV equipment. IC Role / Device Role / Timing Role: Analog signal path selector with bidirectional conduction capability and no DC blocking requirement. Use Value: 12–20 Ω RDS(on) ensures flat amplitude response across 10–100 MHz IF bands, preventing level mismatch or distortion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BF1108,215 | SOT143B package (standard pinning: Pin 1 = gate/anode, Pin 2 = cathode, Pin 3 = source, Pin 4 = drain) | Same electrical specs and RF performance; differs only in PCB footprint orientation | Select BF1108,215 when existing layout uses SOT143B land pattern; no circuit redesign needed. |
| PE42510-Z | SPDT GaAs pHEMT switch; 50 Ω matched; 0.7 dB insertion loss; 42 dB isolation at 1 GHz; requires negative gate bias | Higher integration (integrated drivers), wider bandwidth (DC–4 GHz), but higher cost and bias complexity | Choose PE42510-Z for broadband systems beyond 1 GHz or where integrated control logic is preferred over discrete bias. |
Compared with BF1108,215 and PE42510-Z, the BF1108R,215 offers identical RF performance in a reverse-pin SOT143R package-enabling layout reuse in space-constrained tuner modules-while avoiding the bias complexity and cost premium of GaAs alternatives.
Availability
BF1108R,215 is available at Aetrix Electronics and suitable for VCR tuner loop-through, transceiver antenna switching, and FM radio front-end applications requiring stable component supply, consistent RF performance, and long-term obsolescence management.
Supply support for BF1108R,215 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer electronics.
The BF1108R,215 belongs to NXP's legacy silicon RF switch product line, designed specifically for cost-sensitive, analog-dominant RF signal routing in consumer video and communication equipment operating below 1 GHz.
FAQ
What is the maximum operating frequency of the BF1108R,215?
The BF1108R,215 is characterized for RF switching up to 1 GHz, with guaranteed on-state insertion loss ≤2 dB and off-state isolation ≥30 dB at frequencies ≤1 GHz under 50 Ω test conditions. Performance degrades above 1 GHz due to parasitic capacitance and package limitations, so it is not recommended for use beyond its specified frequency range.
How does the BF1108R,215 differ from the BF1108,215?
The BF1108R,215 and BF1108,215 share identical electrical specifications, thermal characteristics, and RF performance. Their sole difference is mechanical: BF1108R,215 uses SOT143R (reverse pinning), while BF1108,215 uses SOT143B (standard pinning). Pin 1–4 assignments are mirrored, requiring separate PCB footprints despite functional equivalence.
What bias voltage is required to turn off the BF1108R,215?
To turn off the BF1108R,215, apply +5 V to both VSK and VDK (Pins 2 and 2, respectively - shared cathode connection), forward-biasing the integrated diode and pulling the gate to ~+4.3 V relative to source/drain. This drives the depletion FET into cutoff, achieving ≥30 dB isolation. No negative bias is needed.
Is the BF1108R,215 suitable for bidirectional RF signal routing?
Yes-the BF1108R,215 supports bidirectional RF conduction because its drain and source terminals are interchangeable per datasheet specification. This allows flexible placement in RF paths where signal direction may vary, such as in transceiver T/R switching or loop-through configurations without polarity constraints.
Does the BF1108R,215 require external ESD protection?
No-external ESD protection is not required. The BF1108R,215 integrates internal gate-source and gate-drain diodes that clamp transient voltages, and it is rated for Class 1B ESD sensitivity (per JEDEC JS-001). However, proper handling procedures-including grounded workstations and ionized air-must still be followed during assembly to prevent damage.
BF1108R,215 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- SOT-143R
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- N-Channel
- Frequency:
- -
- Gain:
- -
- Voltage - Test:
- -
- Current Rating (Amps):
- 10mA
- Noise Figure:
- -
- Current - Test:
- -
- Power - Output:
- -
- Voltage - Rated:
- 3 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-143R
BF1108R,215 FAQ
1.How can I place an order for BF1108R,215 through Aetrix?
Please submit a Request for Quotation (RFQ) for BF1108R,215 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BF1108R,215 reliable?
The price and inventory of BF1108R,215 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BF1108R,215 is usually 5 days.
3.What payment methods are accepted for BF1108R,215?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BF1108R,215 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BF1108R,215?
BF1108R,215 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BF1108R,215 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BF1108R,215?
For technical support, including BF1108R,215 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BF1108R,215 requirements.
6.How does Aetrix verify that BF1108R,215 is sourced from the original manufacturer or authorized distributors?
All BF1108R,215 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BF1108R,215 meets industry standards.
7.What is the process for return or replacement of BF1108R,215?
All BF1108R,215 units undergo pre-shipment inspection (PSI). If there is an issue with BF1108R,215, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BF1108R,215 part is unused and in its original packaging.
Return procedure for BF1108R,215:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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