NXP Semiconductors BF1202R,215
- Part No.:
- BF1202R,215
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- TO-253-4, TO-253AA
- Datasheet:
-
BF1202R,215.pdf
- Description:
- RF MOSFET 5V SOT143R
- Quantity:
- Payment:

- Shipping:

Inventory:8,946
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BF1202R from NXP Semiconductors is an enhancement-type N-channel dual-gate PoLo MOSFET with source and substrate internally connected, designed for VHF/UHF RF amplification in 3–9 V supply systems. It delivers 30 mS typical forward transfer admittance, 1.7 pF input capacitance at gate 1, and 1.1 dB noise figure at 800 MHz, enabling low-noise gain-controlled amplifier stages in TV tuners and professional communications equipment.
For engineers reviewing the BF1202R datasheet, BF1202R pinout, BF1202R application, or BF1202R equivalent, key selection criteria include its dual-gate architecture for AGC control, internal self-biasing for cross-modulation suppression, SOT143R package compatibility, and verified performance at 800 MHz with 12 mA drain current and 5 V drain-source bias.
Technical Context
The BF1202R employs a short-channel dual-gate structure where gate 2 (G2) serves as the primary RF input control terminal while gate 1 (G1) enables automatic gain control (AGC) via variable bias. Integrated diodes between each gate and source provide surge protection against excessive input voltage transients.
Its partly internal self-biasing circuit ensures stable DC operating point under varying AGC conditions, directly supporting consistent cross-modulation performance - measured at 100–105 dBµV input level for k = 1% distortion at 40 dB AGC - without external bias network complexity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Drain-source voltage (VDS) | 10 V maximum - defines safe DC/RF voltage swing across channel without breakdown. |
| Drain current (ID) | 30 mA maximum - sets upper limit for continuous RF output power handling capability. |
| Forward transfer admittance (|yfs|) | 25–40 mS typical - determines small-signal voltage gain and RF amplification efficiency at VDS = 5 V, ID = 12 mA. |
| Noise figure (F) | 1.1–1.8 dB at 800 MHz - quantifies signal-to-noise degradation in high-frequency receiver front-ends. |
| Cross-modulation (Xmod) | 100–105 dBµV at 40 dB AGC - specifies minimum input level before 1% intermodulation distortion occurs under strong AGC control. |
| Input capacitance (Cig1-ss) | 1.7–2.2 pF at 1 MHz - impacts impedance matching and tuning range in VHF/UHF band amplifier designs. |
| Operating junction temperature (Tj) | 150 °C maximum - constrains thermal design margin for surface-mount layout and PCB copper area planning. |
Pinout & Package
The BF1202R is housed in the SOT143R plastic surface-mounted package (reverse pinning), measuring 3.0 × 1.4 mm with 0.95 mm height and 1.9 mm lead pitch. This compact 4-lead outline supports high-density RF board layouts and reflow soldering compatibility.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Source | Common reference node for both gates and drain; internally tied to substrate for enhanced RF stability. |
| 2 | Drain | Main RF output terminal; requires DC blocking and impedance-matching network for optimal power transfer. |
| 3 | Gate 2 | Primary RF input gate; biased at 4 V typical for linear amplification and matched to 50 Ω systems. |
| 4 | Gate 1 | AGC control gate; voltage-variable bias adjusts gain dynamically while maintaining low cross-modulation. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-gate PoLo architecture | Enables independent RF signal injection (G2) and gain control (G1), eliminating need for external AGC diodes or op-amp circuits. |
| Integrated gate-source protection diodes | Prevents ESD damage during handling and transient overvoltage events without requiring external clamping components. |
| Partly internal self-biasing | Stabilizes quiescent current under varying temperature and supply conditions, reducing calibration effort in production tuning. |
| High yfs/Cig1-ss ratio | Delivers superior gain-per-capacitance performance for wideband VHF/UHF amplifiers with minimal matching network complexity. |
| Low noise figure at 800 MHz | Supports high-sensitivity reception in digital TV tuners and wireless infrastructure receivers where SNR is critical. |
Applications
| TV Tuner Front-End | Professional UHF Transceiver LNA |
|---|---|
Use Scenario: Amplifying weak terrestrial or cable TV signals in analog/digital broadcast receivers operating at 47–862 MHz. IC Role / Device Role / Timing Role: Dual-gate RF amplifier stage with G2 as signal input and G1 as AGC-controlled gain adjustor. Use Value: Achieves 100–105 dBµV cross-modulation threshold at 40 dB AGC, ensuring clean channel separation under strong adjacent-channel interference. |
Use Scenario: Low-noise amplification in portable or base-station UHF radios (300–900 MHz) requiring stable gain over temperature and supply variation. IC Role / Device Role / Timing Role: First-stage LNA with integrated self-biasing and gate protection for rugged field deployment. Use Value: 1.1 dB noise figure at 800 MHz and 150 °C junction rating enable reliable operation in uncooled outdoor enclosures. |
| FM Radio IF Amplifier | Wireless Microphone Receiver Preamp |
Use Scenario: Intermediate frequency amplification in FM radio receivers centered at 10.7 MHz with AGC-driven dynamic range compression. IC Role / Device Role / Timing Role: Gain-controlled IF amplifier using G1 for analog AGC voltage and G2 for signal path. Use Value: Maintains 9–11 dB noise figure at 10.7 MHz while delivering >34 dB power gain, improving weak-signal intelligibility. |
Use Scenario: Input-stage amplification in license-free wireless microphone systems operating at 863–865 MHz in ETSI bands. IC Role / Device Role / Timing Role: Low-distortion RF preamplifier with built-in surge protection for handheld transmitter-receiver pairs. Use Value: 30 mS forward transfer admittance and 2.2 pF max Cig1-ss support broadband matching across full 863–865 MHz band. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-gate RF MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BF1202 | Identical electrical specs but packaged in SOT143B (standard pinning: 1=source, 2=drain, 3=gate1, 4=gate2). | Suitable for legacy PCBs designed for SOT143B footprint; not pin-compatible with BF1202R due to reversed gate pin order. | Select BF1202 only when redesigning for standard pinout or sourcing discontinued SOT143B variants. |
| BF1202WR | Same functionality with SOT343R package (smaller 2.2 × 1.35 mm outline) and lower thermal resistance (155 K/W vs. 185 K/W). | Better suited for space-constrained portable devices requiring higher power density and improved thermal performance. | Choose BF1202WR when board area is limited and thermal management must accommodate higher ambient temperatures. |
Compared with BF1202 and BF1202WR, the BF1202R offers reverse-pin SOT143R compatibility - enabling drop-in replacement on existing SOT143R layouts - while maintaining identical RF performance and AGC behavior, making it ideal for tuner redesigns requiring mechanical fit without circuit modification.
Availability
BF1202R is available at Aetrix Electronics and suitable for VHF/UHF tuners, professional communications equipment, and low-noise RF amplifier modules requiring stable component supply across industrial and broadcast product lifecycles.
Supply support for BF1202R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in high-performance RF, analog, and mixed-signal solutions for automotive, industrial, and consumer applications.
The BF1202R belongs to NXP's PoLo (Polarity Logic) dual-gate MOSFET product line, engineered specifically for low-noise, AGC-capable RF amplification in broadcast and communications systems operating up to 1 GHz.
FAQ
What is the maximum drain-source voltage rating for the BF1202R?
The BF1202R has a maximum drain-source voltage (VDS) rating of 10 V, as specified in the Absolute Maximum Ratings table. This value represents the peak DC or RF voltage that can be safely applied between drain and source terminals without risk of avalanche breakdown or permanent device damage. Operation beyond this limit may cause irreversible failure, especially under pulsed or high-temperature conditions.
How does the BF1202R achieve low cross-modulation in AGC applications?
The BF1202R achieves low cross-modulation through its partly internal self-biasing circuit, which stabilizes the DC operating point during automatic gain control. At 40 dB AGC, the BF1202R maintains a cross-modulation threshold of 100–105 dBµV - meaning it resists intermodulation distortion even when amplifying multiple strong signals simultaneously - without requiring external bias compensation networks.
Is the BF1202R pin-compatible with the BF1202?
No, the BF1202R is not pin-compatible with the BF1202. While both share identical electrical specifications, the BF1202 uses SOT143B packaging with standard pinning (1=source, 2=drain, 3=gate1, 4=gate2), whereas the BF1202R uses SOT143R with reverse pinning (1=source, 2=drain, 3=gate2, 4=gate1). PCB layout revision is required to substitute one for the other.
What is the typical noise figure of the BF1202R at 400 MHz?
The BF1202R exhibits a typical noise figure of 0.9 dB at 400 MHz under standard test conditions (VDS = 5 V, VG2-S = 4 V, ID = 12 mA, YS = YS,opt). This value reflects its optimized small-signal performance in UHF receiver front-ends, where minimizing added noise is essential for maintaining signal integrity in weak-signal environments.
Does the BF1202R require external gate protection diodes?
No, the BF1202R does not require external gate protection diodes. It integrates protection diodes between each gate (G1 and G2) and the source terminal, safeguarding against electrostatic discharge and input voltage surges up to ±10 mA gate current limits. This eliminates the need for discrete ESD protection components in most RF front-end designs.
BF1202R,215 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- TO-253-4, TO-253AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- N-Channel Dual Gate
- Frequency:
- 400MHz
- Gain:
- 30.5dB
- Voltage - Test:
- 5 V
- Current Rating (Amps):
- 30mA
- Noise Figure:
- 0.9dB
- Current - Test:
- 12 mA
- Power - Output:
- 200mW
- Voltage - Rated:
- 10 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- SOT-143R
BF1202R,215 FAQ
1.How can I place an order for BF1202R,215 through Aetrix?
Please submit a Request for Quotation (RFQ) for BF1202R,215 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BF1202R,215 reliable?
The price and inventory of BF1202R,215 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BF1202R,215 is usually 5 days.
3.What payment methods are accepted for BF1202R,215?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BF1202R,215 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BF1202R,215?
BF1202R,215 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BF1202R,215 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BF1202R,215?
For technical support, including BF1202R,215 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BF1202R,215 requirements.
6.How does Aetrix verify that BF1202R,215 is sourced from the original manufacturer or authorized distributors?
All BF1202R,215 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BF1202R,215 meets industry standards.
7.What is the process for return or replacement of BF1202R,215?
All BF1202R,215 units undergo pre-shipment inspection (PSI). If there is an issue with BF1202R,215, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BF1202R,215 part is unused and in its original packaging.
Return procedure for BF1202R,215:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BF1202R,215 Tags

-
3SK294(TE85L,F)
Toshiba Semiconductor and Storage
-
SAV-551+
Mini-Circuits

-
TAV2-501+
Mini-Circuits

-
CE3514M4-C2
CEL

-
AFT05MS004NT1
NXP USA Inc.
-
SAV-541+
Mini-Circuits

-
CE3512K2-C1
CEL

-
AFM907NT1
NXP Semiconductors

-
SKY65050-372LF
Skyworks Solutions Inc.

-
CE3520K3-C1
CEL

-
AFT09MS007NT1
NXP USA Inc.

-
AFT09MS015NT1
NXP USA Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

