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NXP Semiconductors BF1205C,115

Part No.:
BF1205C,115
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
6-TSSOP, SC-88, SOT-363
Datasheet:
AetrixBF1205C,115.pdf
Description:
RF MOSFET 5V 6TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,264

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Product details

Overview

BF1205C from NXP Semiconductors is a dual N-channel dual-gate MOSFET amplifier IC integrating two independent low-noise amplifiers (Amplifier A and Amplifier B) with shared source and gate-2 terminals, plus an integrated AGC-controlled switch operated via Gate 1 of Amplifier B. It delivers 31 mS typical forward transfer admittance, 1.3 dB noise figure at 400 MHz, and superior cross-modulation performance (105 dBµV at 40 dB AGC), optimized for 5 V supply VHF/UHF gain-controlled LNA stages in TV tuners.

For engineers reviewing the BF1205C datasheet, BF1205C pinout, BF1205C application, or BF1205C equivalent, this device requires attention to its dual-gate bias architecture, SOT363 thermal limitations (Rth(j-s) = 240 K/W), AGC voltage-dependent gain switching behavior, and discrete gate-1 control per amplifier - critical for tuner front-end stability and cross-modulation suppression in digital/analog broadcast receivers.

Technical Context

The BF1205C implements two separate common-source dual-gate MOSFETs sharing a physical source terminal and Gate 2 connection, enabling compact VHF/UHF RF front-end integration. Amplifier A uses Gate 1(a) as primary RF input and Gate 2 as DC bias; Amplifier B's Gate 1(b) serves both as AGC control input and switch activation node - turning off Amplifier A when biased high (VGG = 5 V).

Internal diodes protect Gate 1 inputs against ESD and voltage surges; substrate-source interconnection and on-chip bias networks ensure DC stabilization during AGC transitions. Its SOT363 package supports surface-mount assembly but imposes strict thermal derating above Tsp = 107 °C, limiting continuous Ptot to 180 mW.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 6 V max - defines absolute maximum drain-source voltage; operation beyond risks permanent breakdown.
|yfs| (A) 31 mS typ at 1 MHz, ID = 19 mA - determines small-signal transconductance and gain potential in tuned amplifier designs.
NF (A) 1.3 dB typ at 400 MHz - specifies minimum achievable noise figure; critical for sensitivity in UHF TV tuner LNA stages.
Xmod (A) 105 dBµV typ at 40 dB AGC - quantifies immunity to two-tone intermodulation distortion under strong adjacent-channel interference.
Cig1-ss (A) 2.2 pF typ at 1 MHz - sets input matching network complexity and bandwidth trade-offs at VHF/UHF frequencies.
Ptot 180 mW max at Tsp ≤ 107 °C - constrains RF output power handling and requires thermal-aware PCB layout with solder-point copper mass.
Rth(j-s) 240 K/W - indicates junction-to-solder-point thermal resistance; mandates direct thermal path from Source pin to large copper pour.

Pinout & Package

SOT363 micro-miniature plastic surface-mounted package (6 leads); dimensions: 2.2 mm × 1.8 mm × 1.1 mm; body thickness 0.8 mm; lead pitch 0.65 mm; moisture sensitivity level MSL3.

Pin/Terminal Circuit Role Design Meaning
1 Gate 1 (Amplifier A) Primary RF input for Amplifier A; DC-coupled; protected by internal diode to Source.
2 Gate 2 Shared DC bias terminal for both amplifiers; sets channel conduction level and gain slope.
3 Gate 1 (Amplifier B) AGC control input and switch activation node; high logic disables Amplifier A.
4 Drain (Amplifier B) RF output for Amplifier B; requires external matching network and DC blocking.
5 Source Common source/substrate node for both MOSFETs; must be low-inductance RF ground reference.
6 Drain (Amplifier A) RF output for Amplifier A; isolated from Drain (B) to prevent coupling; needs individual bias choke.

Key Features

Feature Design Value
Dual independent LNAs in one die Reduces board area and component count vs. discrete dual-amplifier solutions; eliminates inter-stage mismatch.
Integrated AGC switch Enables seamless gain switching between amplifiers without external FET or analog switch - simplifies tuner AGC loop design.
Superior cross-modulation performance 105 dBµV at 40 dB AGC ensures robust reception in dense signal environments (e.g., urban DVB-T deployments).
High yfs/Cig1 ratio ~14 GHz effective cutoff enables stable wideband gain up to 800 MHz without peaking or instability.
ESD-protected Gate 1 inputs Withstands >2 kV HBM per IEC 61000-4-2 - reduces need for external TVS in production tuner modules.

Applications

Digital TV Tuner Front-End Analog TV Tuner Front-End

Use Scenario: Signal amplification in terrestrial/cable DVB-T/T2 receiver tuners operating at 47–862 MHz with 5 V supply.

IC Role / Device Role / Timing Role: Dual-path LNA providing selectable gain stages and AGC-controlled switching between bands or signal paths.

Use Value: Enables single-chip dual-LNA architecture with <1.4 dB NF and >100 dBµV cross-modulation rejection - meeting EN 300 744 spectral mask requirements.

Use Scenario: RF amplification in legacy PAL/NTSC broadcast receivers requiring stable gain over temperature and supply variation.

IC Role / Device Role / Timing Role: Low-noise preamplifier with integrated AGC path selection for channel tuning and signal level stabilization.

Use Value: Delivers 1.3 dB NF at 400 MHz and 31 mS transconductance - preserving SNR in weak-signal analog video demodulation.

Professional UHF Communication Receiver Multi-standard Broadcast Tuner Module

Use Scenario: Wideband LNA stage in portable or fixed UHF land-mobile radios (400–470 MHz) with automatic gain management.

IC Role / Device Role / Timing Role: Dual-gate MOSFET amplifier providing high linearity and low noise while supporting fast AGC response via Gate 1(b).

Use Value: Achieves 103 dBµV cross-modulation at 40 dB AGC - suppressing co-channel interference in congested public safety spectrum.

Use Scenario: Core RF front-end in multi-system tuners supporting DVB-T, DVB-C, and ATSC standards across VHF/UHF bands.

IC Role / Device Role / Timing Role: Reconfigurable dual-amplifier block allowing dynamic path selection and gain optimization per standard.

Use Value: Shared Gate 2 and Source reduce layout complexity; differential gain control enables seamless standard switching without RF path discontinuity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-gate MOSFET amplifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
BF1105C Single dual-gate amplifier (no integrated switch); lower |yfs (25 mS typ); identical SOT363 package. Lacks AGC-controlled switching; requires external switch for dual-path designs. Select when only one LNA path is needed and board space allows discrete switch integration.
BF1212 Higher Ptot (250 mW); higher VDS (12 V); larger SOT143 package; no shared Gate 2. Supports higher supply voltages and wider dynamic range but increases footprint and layout complexity. Prefer for industrial-grade receivers needing extended voltage headroom and thermal margin beyond consumer tuner specs.

Compared with BF1105C and BF1212, the BF1205C uniquely integrates dual amplifiers with shared bias and AGC switching in SOT363 - delivering optimal size, noise, and system-level integration for cost-sensitive broadcast tuner designs.

Availability

BF1205C is available at Aetrix Electronics and suitable for digital television tuners, analog broadcast receivers, professional UHF communication equipment, and multi-standard broadcast tuner modules requiring stable component supply and long-term lifecycle support.

Supply support for BF1205C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer applications.

The BF1205C belongs to NXP's RF transistor product line, engineered specifically for high-performance, low-noise VHF/UHF amplifier functions in broadcast and communication tuner systems.

FAQ

What is the maximum drain-source voltage rating for the BF1205C?

The BF1205C has a maximum drain-source voltage (VDS) rating of 6 V per MOSFET, as specified in the Absolute Maximum Ratings table. Exceeding this voltage risks irreversible breakdown of either Amplifier A or Amplifier B, especially under transient conditions or elevated temperature. Designers must ensure DC bias and RF swing remain within this limit across all operating modes.

How does the integrated switch in the BF1205C operate?

The BF1205C's integrated switch is controlled by Gate 1 of Amplifier B (Pin 3). When VGG = 5 V is applied to Pin 3, Amplifier B turns on and Amplifier A is disabled; at VGG = 0 V, Amplifier A operates and Amplifier B is off. This function is implemented internally via shared source and gate-2 topology - no external components are required to achieve this gain-switching behavior in the BF1205C.

What is the typical noise figure of the BF1205C at 800 MHz?

The BF1205C achieves a typical noise figure (NF) of 1.4 dB at 800 MHz for both Amplifier A and Amplifier B under specified test conditions (VDS = 5 V, VG2-S = 4 V, ID = 19 mA or 13 mA respectively). This value is measured with optimal source admittance (YS(opt)) and confirms suitability for high-frequency UHF tuner applications where low-noise amplification is critical.

Can the BF1205C be used with a 3.3 V supply?

The BF1205C is characterized and optimized for 5 V operation, and its datasheet specifies all key parameters (e.g., |yfs, NF, Xmod) at VDS = 5 V. While limited functionality may occur at 3.3 V, NXP does not guarantee performance - including gain compression, noise degradation, or unreliable AGC switching - making 3.3 V use unsupported and not recommended for production designs relying on BF1205C specifications.

What thermal considerations apply to the BF1205C in PCB layout?

The BF1205C exhibits a junction-to-solder-point thermal resistance (Rth(j-s)) of 240 K/W and a maximum total power dissipation of 180 mW at Tsp ≤ 107 °C. To maintain reliability, the Source pin (Pin 5) must connect to a substantial copper pour acting as a thermal slug; avoid narrow traces or thermal relief on this pin. Layout must also respect the SOT363 package's 0.65 mm pitch and moisture sensitivity level (MSL3).

BF1205C,115 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
6-TSSOP, SC-88, SOT-363
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Technology:
MOSFET (Metal Oxide)
Configuration:
N-Channel Dual Gate
Frequency:
400MHz
Gain:
30dB
Voltage - Test:
5 V
Current Rating (Amps):
30mA
Noise Figure:
1.3dB
Current - Test:
19 mA
Power - Output:
-
Voltage - Rated:
6 V
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
6-TSSOP

BF1205C,115 FAQ

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Please submit a Request for Quotation (RFQ) for BF1205C,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BF1205C,115 reliable?

The price and inventory of BF1205C,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BF1205C,115 is usually 5 days.

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Once your BF1205C,115 order is processed, you will receive an email with the shipment details and tracking number.

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5.How can I obtain technical support or documentation for BF1205C,115?

For technical support, including BF1205C,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BF1205C,115 requirements.

6.How does Aetrix verify that BF1205C,115 is sourced from the original manufacturer or authorized distributors?

All BF1205C,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BF1205C,115 meets industry standards.

7.What is the process for return or replacement of BF1205C,115?

All BF1205C,115 units undergo pre-shipment inspection (PSI). If there is an issue with BF1205C,115, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BF1205C,115 part is unused and in its original packaging.

Return procedure for BF1205C,115:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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