NXP Semiconductors BF1208D,115
- Part No.:
- BF1208D,115
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- SOT-563, SOT-666
- Datasheet:
-
BF1208D,115.pdf
- Description:
- RF MOSFET 5V SOT666
- Quantity:
- Payment:

- Shipping:

Inventory:3,608
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Product details
Overview
BF1208D from NXP Semiconductors is a dual N-channel dual-gate MOSFET integrating two low-noise, gain-controlled amplifiers (Amplifier A and B) with shared source and gate2 terminals, plus an integrated switch controlled by Amplifier B's gate1 bias. It delivers 31 mS forward transfer admittance at 100 MHz, 0.9 dB noise figure at 400 MHz (A), 1.4 dB at 800 MHz (B), and superior cross-modulation performance (105 dBµV at 40 dB AGC) for VHF/UHF tuner front-ends operating at 5 V.
For engineers reviewing the BF1208D datasheet, BF1208D pinout, BF1208D application, or BF1208D equivalent, this device is selected for high-linearity, low-noise RF amplification in digitally tuned TV receivers and professional UHF communication equipment where AGC stability, ESD robustness, and compact SOT666 packaging are critical.
Technical Context
The BF1208D implements two independent common-source dual-gate MOSFETs on a single die, with internal bias circuits enabling DC stabilization and minimizing intermodulation distortion during Automatic Gain Control. Gate1 of Amplifier B directly controls an integrated switch that enables/disables Amplifier A - eliminating external switching components.
Its dual-gate architecture separates RF input (gate2) from gain control (gate1), allowing simultaneous optimization of noise figure and AGC linearity. Integrated protection diodes between gates and source safeguard against ±10 mA gate current surges, while substrate-source interconnection ensures consistent thermal and electrical reference across both amplifiers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 6 V maximum - defines safe drain-source voltage swing for 5 V supply operation with margin |
| |yfs| (A) | 31 mS typical at 100 MHz - enables high transconductance gain without external biasing complexity |
| NF (A @ 400 MHz) | 0.9 dB typical - meets stringent low-noise requirements for digital TV tuner first-stage amplification |
| Xmod (A @ 40 dB AGC) | 105 dBµV typical - ensures minimal cross-modulation distortion in multi-channel broadcast reception |
| Ptot | 180 mW maximum at Tsp ≤109 °C - supports continuous operation in thermally constrained SOT666 packages |
| Ciss(G1) | 2.1–2.6 pF per amplifier - maintains stable input impedance matching up to 1 GHz |
| Rth(j-sp) | 225 K/W - quantifies thermal resistance from junction to solder point for PCB thermal design |
Pinout & Package
The BF1208D is housed in a plastic surface-mounted SOT666 package (6-pin, 1.7 × 1.5 mm footprint) with 0.5 mm pitch and exposed source pad for thermal conduction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate1 (Amplifier A) | Primary gain control input for Amplifier A; referenced to source; accepts DC AGC voltage |
| 2 | Gate2 | Shared RF input terminal for both amplifiers; high-impedance node requiring 50 Ω matching |
| 3 | Gate1 (Amplifier B) | Gain control and switch enable input for Amplifier B; controls internal switch that disables Amplifier A |
| 4 | Drain (Amplifier B) | RF output node for Amplifier B; requires DC blocking and 50 Ω load termination |
| 5 | Source | Common source and substrate connection for both MOSFETs; must be low-inductance ground path |
| 6 | Drain (Amplifier A) | RF output node for Amplifier A; isolated from Amplifier B's drain; requires individual matching |
Key Features
| Feature | Design Value |
|---|---|
| Two integrated dual-gate amplifiers | Reduces component count by consolidating two independent VHF/UHF LNA stages into one SOT666 device |
| Internal gate1-controlled switch | Enables seamless amplifier selection without external FETs or logic, simplifying AGC sequencing |
| Superior cross-modulation performance | 105 dBµV at 40 dB AGC ensures clean multi-signal reception in dense broadcast environments |
| High yfs/Ciss ratio | Optimizes gain-bandwidth trade-off for stable wideband amplification up to 1 GHz |
| Integrated gate-source protection diodes | Withstands ±10 mA transient currents, eliminating need for external ESD clamps in tuner designs |
Applications
| Digital Television Tuner | Professional UHF Communication Receiver |
|---|---|
|
Use Scenario: Front-end low-noise amplification in DVB-T/C/S tuners with dynamic channel selection and AGC. IC Role / Device Role / Timing Role: Dual-path RF amplifier providing simultaneous gain control and signal routing via internal switch. Use Value: Enables single-chip dual-LNA architecture with <0.9 dB NF at 400 MHz and 105 dBµV cross-modulation suppression at full AGC range. |
Use Scenario: High-selectivity RF pre-amplification in portable land-mobile radios operating in 400–520 MHz bands. IC Role / Device Role / Timing Role: Primary gain stage with fast AGC response and low intermodulation distortion under multi-tone interference. Use Value: Delivers 1.4 dB NF at 800 MHz and 30 dB transducer power gain at 400 MHz, supporting wide-dynamic-range demodulation. |
| Analog TV Tuner (Legacy) | UHF Wireless Microphone Receiver |
|
Use Scenario: Signal conditioning in NTSC/PAL tuners requiring stable gain over temperature and supply variation. IC Role / Device Role / Timing Role: Dual-gate MOSFET LNA with built-in DC stabilization and gate2 RF input isolation. Use Value: Maintains 31 mS forward transfer admittance and <1.5 dB NF across −25 °C to +85 °C ambient. |
Use Scenario: Low-noise receive path in battery-powered wireless microphone systems with automatic channel switching. IC Role / Device Role / Timing Role: AGC-enabled RF amplifier with integrated switch for mute/standby mode control. Use Value: Achieves 102 dBµV cross-modulation level at 40 dB AGC and operates reliably at 5 V supply with 180 mW total dissipation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-gate MOSFET amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BF1210D,115 | Higher |yfs| (35 mS typ), slightly higher NF (1.0 dB @ 400 MHz), same SOT666 package and pinout | Better gain at expense of marginal noise degradation; suited for higher-frequency UHF extensions | Select when >30 dB gain is prioritized over sub-1 dB NF in 600–900 MHz bands |
| BF1212D,115 | Lower Ciss(G1) (1.8–2.3 pF), improved Crss (25 fF typ), identical AGC and cross-mod specs | Enhanced reverse isolation and bandwidth extension beyond 1 GHz; optimized for wideband SDR front-ends | Choose for >1 GHz operation where reduced feedback capacitance improves stability and matching |
Compared with BF1208D, BF1210D offers higher gain for marginal noise penalty, while BF1212D reduces reverse transfer capacitance to support wider bandwidth and improved out-of-band rejection - both retain pin compatibility and AGC functionality but target distinct frequency and linearity trade-offs.
Availability
BF1208D is available at Aetrix Electronics and suitable for digital television tuners, professional UHF communication equipment, and analog broadcast receiver designs requiring stable component supply, ESD-hardened RF amplification, and compact SOT666 packaging.
Supply support for BF1208D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in high-performance RF, analog, and mixed-signal solutions for consumer, automotive, and industrial markets.
The BF1208D belongs to NXP's legacy dual-gate MOSFET amplifier family, engineered specifically for low-noise, gain-controlled RF front-ends in broadcast and communication tuners operating from VHF through upper UHF bands.
FAQ
What is the primary function of the integrated switch in the BF1208D?
The integrated switch in the BF1208D is controlled by the gate1 bias of Amplifier B and enables/disables Amplifier A without external components. When Amplifier B's gate1 is biased to turn it on, the internal switch opens, disconnecting Amplifier A's gate1 and effectively muting its output - a key feature for AGC sequencing and channel switching in tuner applications. This functionality is confirmed in the functional diagram (Figure 3) and dynamic characteristics section of the BF1208D datasheet.
Can the BF1208D operate with a 3.3 V supply instead of the specified 5 V?
The BF1208D is characterized and guaranteed for operation at 5 V drain-source voltage (VDS = 5 V), with absolute maximum VDS rated at 6 V. While static measurements show drain current down to ~10 mA at VDS = 3.3 V, dynamic parameters including noise figure, gain, and cross-modulation performance degrade significantly below 4.5 V. The BF1208D datasheet specifies all key RF metrics at VDS = 5 V, and no characterization data supports reliable 3.3 V operation - thus 5 V is the validated supply for full-spec performance.
How does the BF1208D achieve superior cross-modulation performance during AGC?
The BF1208D achieves superior cross-modulation performance (105 dBµV at 40 dB AGC) through internal bias circuitry that stabilizes DC operating points across both amplifiers during gain reduction, combined with dual-gate architecture that isolates RF input (gate2) from gain control (gate1). This minimizes nonlinear interaction between strong and weak signals under varying AGC conditions - a capability verified in Figures 10 and 26 of the BF1208D datasheet using standardized 50/60 MHz two-tone test setups.
Is the BF1208D pin-compatible with other devices in the BF12xxD series?
Yes, the BF1208D shares identical SOT666 pinout, terminal assignments, and mechanical footprint with BF1210D and BF1212D - all three devices use pins 1–6 for G1A, G2, G1B, DB, S, and DA respectively. This pin compatibility allows direct substitution in existing layouts when upgrading gain, noise, or bandwidth, provided system-level validation confirms parameter alignment - as documented in NXP's ordering information table and package outline diagrams for each variant.
What ESD precautions are required when handling the BF1208D?
The BF1208D is explicitly labeled as sensitive to ElectroStatic Discharge (ESD), with gate oxide vulnerability requiring strict handling per ANSI/ESDA S20.20. Precautions include grounded wrist straps, conductive foam storage, ionized air workstations, and avoidance of direct contact with pins 1, 2, and 3 (gate terminals). The datasheet cautions that ESD events exceeding ±10 mA gate current can permanently damage internal protection diodes - making ESD-safe practices mandatory throughout assembly, testing, and field service of any design using the BF1208D.
BF1208D,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- SOT-563, SOT-666
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- N-Channel Dual Gate
- Frequency:
- 400MHz
- Gain:
- 32dB
- Voltage - Test:
- 5 V
- Current Rating (Amps):
- 30mA
- Noise Figure:
- 0.9dB
- Current - Test:
- 19 mA
- Power - Output:
- -
- Voltage - Rated:
- 6 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-666
BF1208D,115 FAQ
1.How can I place an order for BF1208D,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for BF1208D,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BF1208D,115 reliable?
The price and inventory of BF1208D,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BF1208D,115 is usually 5 days.
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BF1208D,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BF1208D,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BF1208D,115?
For technical support, including BF1208D,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BF1208D,115 requirements.
6.How does Aetrix verify that BF1208D,115 is sourced from the original manufacturer or authorized distributors?
All BF1208D,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BF1208D,115 meets industry standards.
7.What is the process for return or replacement of BF1208D,115?
All BF1208D,115 units undergo pre-shipment inspection (PSI). If there is an issue with BF1208D,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BF1208D,115 part is unused and in its original packaging.
Return procedure for BF1208D,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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