Nexperia USA Inc. BF722-QX

Overview

BF722-QX from Nexperia is an NPN high-voltage transistor in SOT223 (SC-73) package, rated for 250 V_CEO, 100 mA continuous collector current, and 1.2 W power dissipation at T_amb ≤ 25 °C; it delivers 50 minimum DC current gain at 25 mA/20 V and operates up to 150 °C junction temperature. It serves as a robust switching element in automotive-grade high-voltage interface and protection circuits.

For engineers reviewing the BF722-QX datasheet, BF722-QX pinout, BF722-QX application, or BF722-QX equivalent, key selection criteria include its AEC-Q101 qualification, low 1.6 pF feedback capacitance, 60 MHz transition frequency, thermal resistance of 25 K/W to solder point, and dual-collector SOT223 layout enabling enhanced heatsinking in space-constrained HV designs.

Technical Context

This discrete NPN transistor is optimized for high-voltage linear and switching operation with open-base V_CEO and V_CBO both rated at 250 V, and features low Cre (1.6 pF) to minimize Miller effect in fast-switching topologies. Its 25 K/W R_th(j-sp) enables direct thermal coupling to PCB copper, supporting stable performance under pulsed loads up to 200 mA peak collector current.

The device uses a 4-pin SOT223 configuration with pins 2 and 4 both connected to the collector-functionally a single collector terminal with doubled pad area-while pin 1 is base and pin 3 is emitter. This layout improves thermal conduction and current handling without altering internal die structure or biasing behavior.

Key Specifications

Pinout & Package

SOT223 (SC-73) surface-mount plastic package with 4 leads, 2.3 mm pitch, 6.5 mm × 3.5 mm × 1.65 mm body; includes extended copper tab on pins 2 and 4 for improved thermal dissipation and mechanical anchoring.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN high-voltage transistor applications.

Compared with BF722-QX, NSS12201LT1G trades voltage rating and qualification for compactness, while DXT7010PZ-13 extends voltage capability at the cost of thermal performance and board area-making BF722-QX optimal for AEC-Q101-compliant 250 V applications needing balanced power, thermal, and footprint characteristics.

Availability

BF722-QX is available at Aetrix Electronics and suitable for automotive lighting control, industrial auxiliary power regulation, telecom line protection, and medical sensor biasing requiring stable component supply across production lifecycles.

Supply support for BF722-QX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors-including logic, discretes, MOSFETs, and ESD protection-serving automotive, industrial, and consumer markets.

The BF722-QX belongs to Nexperia's AEC-Q101-qualified high-voltage bipolar transistor family, engineered specifically for robust switching and linear operation in harsh-environment automotive and industrial power interface applications.

FAQ

What is the maximum allowable junction temperature for BF722-QX?

The absolute maximum junction temperature (T_j) is 150 °C, as defined in the Absolute Maximum Ratings table. Operation above this value risks permanent degradation of electrical parameters and bond-wire integrity. Derating is required above 25 °C ambient to maintain safe T_j within limits using the specified R_th(j-a) = 106 K/W or R_th(j-sp) = 25 K/W values.

Is BF722-QX pin-compatible with BF723-Q?

No-BF722-QX is an NPN transistor while BF723-Q is its PNP complement; they share identical SOT223 pinning (base-collector-emitter-collector), but polarity reversal means direct substitution would invert circuit function. Use only as complementary pairs in push-pull or H-bridge topologies, not as drop-in replacements.

Does BF722-QX require a heatsink in typical 100 mA switching applications?

Not necessarily-a properly designed 1 cm² copper pad on the collector terminals (pins 2 and 4) provides sufficient thermal path for 1.2 W dissipation at T_amb ≤ 25 °C. At higher ambient temperatures or continuous duty, thermal simulation using R_th(j-sp) = 25 K/W is recommended to verify junction temperature remains below 150 °C.

How does the dual-collector configuration affect PCB layout?

The dual-collector (pins 2 and 4) must be routed to the same net-typically a large copper pour-to maximize thermal conduction and current sharing. Separating them creates unintended impedance imbalance and degrades both thermal performance and current-handling capability. The footprint matches standard SOT223 land patterns with reinforced collector pads per Nexperia's reflow soldering guidelines.