Nexperia USA Inc. BF723/ZLX

Overview

BF723 from Nexperia is a PNP high-voltage bipolar junction transistor in SOT223 (SC-73) package, rated for V_CEO = −250 V, I_C = −100 mA, and P_tot = 1.2 W at T_amb ≤ 25 °C; used in off-line switch-mode power supply feedback stages and HV bias networks.

For engineers reviewing the BF723 datasheet, BF723 pinout, BF723 application, or BF723 equivalent, key selection criteria include verified high-voltage blocking capability (−250 V), low feedback capacitance (2.5 pF), DC current gain (h_FE ≥ 50 @ −25 mA), thermal resistance to solder point (25 K/W), and SOT223 thermal pad layout compatibility.

Technical Context

The BF723 operates as a medium-power PNP switching transistor with an open-base collector-emitter breakdown voltage of −250 V and a transition frequency f_T of 60 MHz at −10 V/−10 mA. Its low Cre (2.5 pF) minimizes Miller effect in high-speed HV switching nodes.

Thermal design relies on the exposed collector pad in the SOT223 package: R_th(j–sp) = 25 K/W enables direct heat transfer to PCB copper, while R_th(j–a) = 106 K/W reflects performance on standard single-sided 1 cm² tin-plated copper.

Key Specifications

Pinout & Package

SOT223 (SC-73) plastic surface-mount package with 4 leads, 2.3 mm pitch, 6.5 mm × 3.5 mm × 1.65 mm body; collector terminals (pins 2 and 4) are internally connected and serve as thermal and electrical interface to PCB copper pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP high-voltage transistor applications.

Compared with BF722 and MJD2955T4G, the BF723 uniquely balances −250 V blocking, SOT223 thermal efficiency, and 2.5 pF feedback capacitance-making it irreplaceable in compact, high-voltage feedback and bias circuits where polarity, size, and parasitic control are jointly constrained.

Availability

BF723 is available at Aetrix Electronics and suitable for SMPS auxiliary bias supplies, off-line voltage monitors, LED driver pre-regulators, and industrial HV signal level shifters requiring stable component supply across production lifecycles.

Supply support for BF723 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert headquartered in Nijmegen, Netherlands, specializing in high-volume, high-reliability discrete and logic devices for industrial, consumer, and automotive markets.

The BF723 belongs to Nexperia's high-voltage bipolar transistor product line, engineered specifically for robustness in off-line power conversion, HV sensing, and industrial control interfaces where voltage endurance and thermal predictability are critical.

FAQ

Is BF723 automotive-qualified?

No. Per Nexperia's revision history (v.4, 20241008), BF723 is explicitly designated as non-automotive. It lacks AEC-Q101 qualification, automotive-grade screening, and extended temperature validation beyond −65 °C to 150 °C ambient. Automotive designs require parts with "-Q" suffixes such as BF723-Q.

Can BF723 replace BC807 in a 24 V circuit?

No. Although both are PNP SOT223 transistors, BF723 is optimized for −250 V operation with higher V_CE(sat) (−0.6 V vs. BC807's −0.3 V) and lower h_FE consistency at low currents. In 24 V applications, its over-engineered voltage rating adds unnecessary cost and compromises small-signal linearity and gain stability.

What is the maximum continuous power dissipation at 70 °C ambient?

At T_amb = 70 °C, derating applies linearly from 1.2 W at 25 °C using the 106 K/W R_th(j–a). Maximum P_tot = 1.2 W − ((70 − 25) × 1.2 / 106) ≈ 0.79 W. For sustained operation above 70 °C, thermal design must rely on R_th(j–sp) = 25 K/W and proper PCB copper pad layout.

Does pin 4 require a separate PCB trace or connect to pin 2?

Pin 4 is internally bonded to pin 2 as a second collector terminal and must be soldered to the same large copper pour as pin 2. Separating them violates the thermal design intent and risks exceeding T_j limits; the datasheet specifies both pins serve the same collector node and thermal interface.