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NXP Semiconductors BGA2022,115
- Part No.:
- BGA2022,115
- Manufacturer:
- NXP Semiconductors
- Category:
- RF Mixers
- Package:
- 6-TSSOP, SC-88, SOT-363
- Datasheet:
-
BGA2022,115.pdf
- Description:
- IC MIXER 900MHZ-2.4GHZ UP 6TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,576
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Product details
Overview
BGA2022 from NXP Semiconductors is a silicon double-poly MMIC mixer in SOT363 package, designed for RF-to-IF downconversion in wireless receivers. It delivers 6 dB typical conversion gain at 1800 MHz, 12 dB DSB noise figure, and +7 dBm output IP3 while operating at 2.8 V and 6 mA supply current. It supports cellular (900 MHz), PCS (1900 MHz), and WLAN (2.4 GHz) bands with high LO–RF isolation and AC-coupled signal ports.
For engineers reviewing the BGA2022 datasheet, BGA2022 pinout, BGA2022 application, or BGA2022 equivalent, key selection criteria include its 6-pin SOT363 footprint, 280 MHz IF output capability at 1800 MHz RF/2080 MHz LO, low-supply-current linearity, and suitability for CDMA receiver front-ends requiring stable gain and noise performance across multi-band operation.
Technical Context
The BGA2022 is a passive-balanced active mixer topology using silicon double-poly process, optimized for high conversion gain and linearity without external biasing components. Its RF input is feedback-configured (Pin 5), enabling impedance matching via external L/C networks per band-specific application notes (e.g., AN00059).
LO port return loss is ≤2:1 across 0–3 GHz, and all signal paths (LO, RF, IF) are AC-coupled with no DC voltage permitted on Pins 1, 2, or 6. Thermal resistance from junction to solder point is 375 K/W, supporting operation up to 150 °C junction temperature under ≤40 mW total dissipation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Conversion Gain | 4–8 dB (typ. 6 dB @ 1800 MHz); enables single-stage IF amplification without cascaded gain stages |
| Noise Figure (DSB) | 12 dB typ. @ 1800 MHz; meets sensitivity requirements for CDMA baseband receivers |
| OIP3 | +7 dBm typ. @ 1800 MHz; supports strong adjacent-channel rejection in dense RF environments |
| Supply Current | 4–8 mA @ 2.8 V; allows battery-powered portable designs with <6 mA quiescent draw |
| LO Input Power | 0 dBm typ. drive; eliminates need for LO buffer amplifier in compact transceiver layouts |
| RF Frequency Range | 880–2450 MHz; covers GSM, PCS, UMTS, and 2.4 GHz ISM bands with verified performance |
| IF Output Frequency | 80–280 MHz; compatible with standard IF filters and baseband ADCs in wireless SoCs |
Pinout & Package
Package: SOT363 - plastic surface-mounted, 6-lead, 2.2 × 1.35 mm body, 0.65 mm pitch, thermal pad on underside (ground tab). Pin 1 index marked with dot; marking code "A2p".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | LO – GND | AC-coupled LO ground reference; must be connected to system ground via low-inductance path |
| 2 | LO – signal | LO input port; requires 0 dBm drive and 50 Ω source impedance; no DC bias allowed |
| 3 | VS | Positive supply terminal; accepts 2.8 V ±0.2 V; bypassed externally with C7 (22 nF) |
| 4 | IF – out | Differential-capable IF output; matched to 50 Ω load; AC-coupled per design note |
| 5 | RF – feedback | RF input node with internal feedback path; used with external L1/C1 network for band-specific tuning |
| 6 | RF – signal | Primary RF input; AC-coupled; 50 Ω source required; no DC voltage permitted |
Key Features
| Feature | Design Value |
|---|---|
| Multi-band frequency support | Validated performance at 880, 1800, 1950, and 2450 MHz RF with corresponding IF outputs |
| High LO–RF isolation | Minimizes LO leakage into antenna path; critical for full-duplex and TDD receiver coexistence |
| Low-power linear operation | 6 mA supply current with +7 dBm OIP3 enables high dynamic range without power penalty |
| Integrated bias architecture | No external bias resistors needed; VS pin supplies all internal active devices directly |
| Thermally robust SOT363 | Ground tab enables direct PCB thermal conduction; Rth j-s = 375 K/W supports 100 °C solder point |
Applications
| CDMA Receiver Front-End | GSM/PCS Dual-Band Handset |
|---|---|
Use Scenario: Downconverting 1900 MHz PCS signals to 280 MHz IF in mobile handset transceivers with tight power budgets. IC Role / Device Role / Timing Role: Active RF mixer providing gain, isolation, and linearity between antenna switch and IF filter chain. Use Value: 6 dB conversion gain and 12 dB NF meet 3GPP sensitivity specs while drawing only 6 mA at 2.8 V. |
Use Scenario: Shared RF front-end supporting simultaneous 900 MHz GSM and 1800 MHz PCS receive paths via band-select switching. IC Role / Device Role / Timing Role: Reconfigurable mixer core enabling dual-band operation with minimal external component changes. Use Value: Verified 5 dB gain at 880 MHz and 6 dB at 1800 MHz allows common layout with band-specific L/C tuning (per AN00059). |
| 2.4 GHz WLAN Client Radio | ISM Band Sensor Transceiver |
Use Scenario: Low-cost 2.4 GHz Wi-Fi client radio receiving OFDM signals in IoT access points and dongles. IC Role / Device Role / Timing Role: High-linearity mixer converting 2450 MHz RF to 280 MHz IF prior to quadrature demodulation. Use Value: +10 dBm OIP3 at 2450 MHz ensures robust operation in noisy 2.4 GHz environments with multiple interferers. |
Use Scenario: Battery-powered industrial sensor node transmitting telemetry over 900 MHz ISM band with integrated receiver monitoring. IC Role / Device Role / Timing Role: Low-quiescent-current mixer enabling periodic wake-up receive mode for energy harvesting systems. Use Value: 4 mA minimum supply current at 2.8 V extends battery life while maintaining 9 dB NF at 880 MHz for weak-signal detection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar MMIC mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Mini-Circuits ADE-1L+ | Higher conversion gain (8.5 dB typ.), wider LO range (0.1–500 MHz), but larger SOT-143 package and 12 mA supply current | Preferred for lab test equipment where size and power are secondary to wideband LO flexibility | Select ADE-1L+ when LO frequency below 800 MHz is required; BGA2022 remains optimal for compact, low-power wireless handsets |
| Qorvo QM11036 | Integrated LO amplifier, GaAs process, 0.5 dB lower NF (11.5 dB), but requires 3.3 V supply and 10 mA current | Suitable for higher-performance infrastructure receivers where board space permits larger 3×3 mm QFN | Choose QM11036 for improved noise floor in base station receivers; BGA2022 better fits portable device thermal and voltage constraints |
Compared with ADE-1L+ and QM11036, the BGA2022 offers the lowest supply current (6 mA) and smallest footprint (SOT363) among validated alternatives, making it uniquely suited for space-constrained, battery-operated wireless clients requiring multi-band coverage without LO amplification.
Availability
BGA2022 is available at Aetrix Electronics and suitable for CDMA receiver front-ends, GSM/PCS dual-band handsets, and 2.4 GHz WLAN client radios requiring stable component supply, consistent parametric performance, and long-term production continuity.
Supply support for BGA2022 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global leader in high-performance RF, analog, and mixed-signal solutions, with deep expertise in wireless infrastructure, automotive radar, and secure connectivity ICs.
The BGA2022 belongs to NXP's legacy MMIC mixer product line, engineered specifically for low-voltage, low-current wireless receiver applications in cellular, PCS, and ISM bands - emphasizing integration, thermal efficiency, and multi-band validation.
FAQ
What is the recommended LO drive level for optimal performance of the BGA2022?
The BGA2022 achieves peak conversion gain and linearity at 0 dBm LO input power, as confirmed in the Quick Reference Data and Fig.5 of the datasheet. Operating outside −3 to +3 dBm may reduce gain stability or increase distortion; the device does not require an external LO amplifier due to this low-drive requirement. The BGA2022 maintains 6 dB gain and +7 dBm OIP3 precisely at 0 dBm LO drive across its supported RF bands.
Can the BGA2022 be used with DC-coupled LO or RF inputs?
No - the BGA2022 requires strict AC coupling on LO (Pins 1 and 2) and RF (Pin 6) inputs, as explicitly stated in Note 1 of the Limiting Values section. Applying DC voltage to these pins violates absolute maximum ratings and risks permanent damage. All signal paths must interface through external DC-blocking capacitors, and the LO-GND pin (Pin 1) must connect directly to system ground with minimal inductance.
What is the function of Pin 5 (RF-feedback) on the BGA2022?
Pin 5 serves as the RF feedback terminal, enabling external impedance matching networks (e.g., L1 and C1 in Fig.2) to tune RF input return loss and gain flatness per band. Unlike a standard RF input, this node forms part of an internal feedback loop that stabilizes conversion gain across frequency; omitting the external feedback network degrades both gain and VSWR performance, especially above 1 GHz.
Is the BGA2022 qualified for automotive applications?
No - the BGA2022 is explicitly designated as a non-automotive qualified product per Section "Non-automotive qualified products" on page 8 of the datasheet. It has not undergone AEC-Q100 stress testing or automotive-grade reliability qualification. For automotive infotainment or telematics receivers, engineers must select NXP's automotive-qualified mixer portfolio instead of the BGA2022.
How does thermal management impact BGA2022 performance in continuous operation?
With a junction-to-solder-point thermal resistance of 375 K/W, the BGA2022's die temperature rises ~22.5 °C above PCB ground temperature at 6 mA/2.8 V (16.8 mW dissipation). To maintain rated specifications, the solder point temperature (Ts) must stay ≤100 °C; exceeding this risks parameter drift and accelerated aging. Use of the exposed ground tab and ≥2 cm² copper pour beneath the SOT363 is essential for sustained operation.
BGA2022,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- BGA2022
- Package/Case:
- 6-TSSOP, SC-88, SOT-363
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- RF Type:
- Cellular, CDMA, PCS, WLAN
- Frequency:
- 900MHz ~ 2.4GHz
- Number of Mixers:
- 1
- Gain:
- 8dB
- Noise Figure:
- 12dB
- Secondary Attributes:
- Up Converter
- Current - Supply:
- 10mA
- Voltage - Supply:
- 4V
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-TSSOP
BGA2022,115 FAQ
1.How can I place an order for BGA2022,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for BGA2022,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BGA2022,115 reliable?
The price and inventory of BGA2022,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BGA2022,115 is usually 5 days.
3.What payment methods are accepted for BGA2022,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BGA2022,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BGA2022,115?
BGA2022,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BGA2022,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BGA2022,115?
For technical support, including BGA2022,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BGA2022,115 requirements.
6.How does Aetrix verify that BGA2022,115 is sourced from the original manufacturer or authorized distributors?
All BGA2022,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BGA2022,115 meets industry standards.
7.What is the process for return or replacement of BGA2022,115?
All BGA2022,115 units undergo pre-shipment inspection (PSI). If there is an issue with BGA2022,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BGA2022,115 part is unused and in its original packaging.
Return procedure for BGA2022,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BGA2022,115 Tags
-
MAX2671EUT+T
Analog Devices Inc./Maxim Integrated
-
ADEX-10+
Mini-Circuits
-
ADE-2+
Mini-Circuits
-
ADE-1+
Mini-Circuits
-
LT5560EDD#PBF
Analog Devices Inc.
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LT5560EDD#TRPBF
Analog Devices Inc.
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LTC5562IUC#TRPBF
Analog Devices Inc.
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MAX2681EUT+T
Analog Devices Inc./Maxim Integrated
-
ADE-1ASK+
Mini-Circuits
-
ADE-1L+
Mini-Circuits
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ADL5350ACPZ-R7
Analog Devices Inc.
-
AD608ARZ-RL
Analog Devices Inc.
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