Infineon Technologies BGF 104C E6327

Overview

BGF 104C E6327 from Infineon Technologies is a wafer-level packaged ESD protection and RC filter array for High-Speed MultiMediaCard (HS-MMC) interfaces, integrating six 50 Ω series resistors (R1–R6), four 75 kΩ pull-up resistors (R7–R10), one 7 kΩ pull-up resistor (R11), and bidirectional ESD diodes on all 16 terminals. It operates from –40 °C to +85 °C with 15 kV IEC61000-4-2 contact discharge rating on external I/Os and supports HS-MMC bus signal integrity in mobile memory card slots.

For engineers reviewing the BGF 104C E6327 datasheet, BGF 104C E6327 pinout, BGF 104C E6327 application, or BGF 104C E6327 equivalent, key selection criteria include line capacitance (20 pF max per line), ESD robustness (15 kV contact), integrated resistor matching (±20% tolerance), and WLP-16-1 mechanical compatibility with 0.5 mm pitch and 1.96 mm × 1.96 mm footprint in space-constrained handheld designs.

Technical Context

The BGF104 implements passive RC filtering and bidirectional ESD clamping on all 12 signal lines of an HS-MMC interface - six data lines (DAT0–DAT3), CMD, and CLK - using monolithic silicon-based ESD diodes with <100 nA reverse leakage at 3 V and <10 µA at 14 V. Each external I/O (A1, A2, A3, B1, B2, C1, D1) connects through a 50 Ω series resistor to its internal counterpart (A4, B4, C3, C4, D3, D4), while pull-up resistors (R7–R10 = 75 kΩ; R11 = 7 kΩ) bias CMD and DAT lines to V_MMC.

Its WLP-16-1 package integrates all components in a single 1.96 mm × 1.96 mm die with 16 SnAgCu solder balls (0.3 mm diameter, 0.5 mm pitch), enabling direct flip-chip mounting without discrete passives. The design targets high-frequency signal integrity: line-to-GND capacitance is tightly controlled at 20 pF typical to minimize timing skew and insertion loss on 52 MHz HS-MMC buses.

Key Specifications

Pinout & Package

Package: WLP-16-1 - 16-terminal green wafer-level package with SnAgCu solder balls, 0.5 mm pitch, 0.3 mm ball diameter, 1.96 mm × 1.96 mm body, and 0.65 mm total height. Pin 1 (A1) is marked by corner index area per Figure 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar HS-MMC interface protection applications.

Compared with NUF2221 and TPD2E001, the BGF 104C E6327 delivers complete HS-MMC interface protection in one die-scale package - reducing bill-of-materials count by 14 components, eliminating layout-dependent impedance mismatches, and ensuring guaranteed inter-pin capacitance matching across all signal paths.

Availability

BGF 104C E6327 is available at Aetrix Electronics and suitable for mobile phone memory card interfaces, digital camera MMC slots, and industrial handheld terminals requiring stable component supply, long-term lifecycle support, and verified ESD performance in high-volume production.

Supply support for BGF 104C E6327 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, security controllers, and discrete protection devices, with global R&D and manufacturing infrastructure.

The BGF104 belongs to Infineon's Small Signal Discretes product line, engineered specifically for high-density, high-reliability ESD and filtering integration in portable multimedia interfaces - targeting space-constrained consumer electronics with stringent EMC and durability requirements.

FAQ

What is the maximum recommended voltage for V_MMC on the BGF 104C E6327?

V_MMC must be supplied with either 3.0 V or 1.8 V nominal - matching the HS-MMC bus voltage standard used by the host controller. Absolute maximum rating is 14 V, but sustained operation above 3.3 V risks exceeding resistor power dissipation limits and degrading ESD diode lifetime. The device is not rated for 5 V operation.

Can the BGF 104C E6327 be used with SDIO or eMMC interfaces?

No - the BGF 104C E6327 is electrically and mechanically optimized for HS-MMC only. Its resistor values (50 Ω series, 75 kΩ/7 kΩ pull-ups) and pin mapping match the 12-signal HS-MMC bus defined in JEDEC Standard JESD84-B32. SDIO uses different pull-up strengths and timing, while eMMC requires 8-bit data width and distinct command protocol timing not supported by this part's fixed configuration.

How is ESD current routed during a 15 kV event on an external pin?

During IEC61000-4-2 contact discharge, ESD current flows from the struck external pin (e.g., A1) through its integrated bidirectional diode into the local GND terminals (B3, C2, D2), then returns via the PCB ground plane. The 50 Ω series resistor limits peak current dI/dt, while the low-inductance WLP-16-1 GND ball array minimizes voltage overshoot across the protection path - verified to clamp transients below 12 V at 30 A TLP.

Is reflow soldering compatible with the WLP-16-1 package of the BGF 104C E6327?

Yes - the WLP-16-1 package uses SnAgCu (SAC305) solder balls qualified for standard lead-free reflow profiles (J-STD-020D). Peak temperature must not exceed 260 °C for ≤30 seconds, and thermal ramp rates must stay within ±3 °C/s. Reflow voiding is minimized by the 0.3 mm ball diameter and coplanarity tolerance of 0.08 mm, enabling high-yield assembly in automated SMT lines.