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Infineon Technologies BGF110E6327XT
- Part No.:
- BGF110E6327XT
- Manufacturer:
- Infineon Technologies
- Category:
- Specialized ICs
- Package:
- 24-UFBGA, WLCSP
- Datasheet:
-
BGF110E6327XT.pdf
- Description:
- IC FILTER HSMMC ESD PROT 24WLP
- Quantity:
- Payment:
- Shipping:
Inventory:3,827
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Product details
Overview
BGF110E6327XT from Infineon Technologies is a wafer-level packaged ESD protection device specifically designed for SD card interface lines, featuring integrated 40 Ω series resistors on nine data/command lines, 50 kΩ pull-up/down resistors on control lines, and ESD robustness up to ±15 kV contact discharge per IEC61000-4-2. It delivers low line capacitance (11.5–13.5 pF at 0–5 V bias), <−35 dB RF attenuation above 10 MHz, and <−70 dB analog crosstalk at 100 MHz.
For engineers reviewing the BGF110E6327XT datasheet, BGF110E6327XT pinout, BGF110E6327XT application, or BGF110E6327XT equivalent, this component supports high-speed SD 2.0/3.0 digital interfaces requiring simultaneous ESD hardening, RF filtering, and signal integrity preservation without compromising timing margins.
Technical Context
The BGF110 integrates discrete ESD diodes with precision thin-film resistors in a monolithic WLP-24-2 structure, enabling co-located protection and impedance matching directly at the SD connector. Its internal topology separates external I/Os (A4–E5) - rated for ±15 kV contact discharge - from internal I/Os (A1–E2, C3) - rated for ±2 kV - using distinct resistor networks and diode clamping paths.
Line capacitance remains stable across 0–5 V bias (11.5–13.5 pF), and RF suppression is achieved via distributed RC filtering: each protected line includes a 40 Ω series resistor (R1–R9) plus parallel 50 kΩ bias resistors (R11–R14) and a 15 kΩ pull-down (R15), with R21 (470 kΩ) isolating the SDWP+CD line.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (Contact) | ±15 kV on external pins (A4,E5); enables direct SD card slot protection without external TVS arrays |
| Series Resistance | 40 Ω on 9 data/command lines; damps reflections and limits ESD current without degrading SD clock/data edge rates |
| Line Capacitance | 11.5–13.5 pF (0–5 V); maintains SD bus timing compliance up to 50 MHz signaling |
| RF Attenuation | ≥35 dB at 100 MHz; suppresses radiated emissions from SD data bursts in handheld devices |
| Crosstalk | ≤−70 dB at 100 MHz; prevents coupling between adjacent SD_DATA0–3 and CMD/CLK lines |
| Operating Temp | −40 °C to +85 °C; supports industrial-grade SD host operation in embedded controllers and portable electronics |
| Package Pitch | 400 µm solder ball pitch; compatible with fine-pitch PCB assembly for compact SD card slots |
Pinout & Package
WLP-24-2 is a 24-ball wafer-level package with SnAgCu solder balls (250 µm diameter, 400 µm pitch), coplanarity ≤0.08 mm, and corner-indexed pin 1 at A3. Balls are face-down mounted; primary datum defined by spherical crowns.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1, A2, B1, B2, C1, C2, C3, D1, D2, E1, E2 | Internal I/Os | Low-voltage (±2 kV) control lines for WP, CD, DAT3_PD/PUs; routed internally with 50 kΩ bias resistors |
| A4, A5, B4, B5, C4, C5, D4, D5, E4, E5 | External I/Os | High-robustness (±15 kV) SD bus lines: DATA0–3, CMD, CLK, SDWP, SDCD; each includes 40 Ω series resistor and ESD diode |
| A3 | Pin 1 Index | Corner-marked ball identifying orientation; used for automated optical alignment during placement |
| GND_H, GND_C | Ground Terminals | Dual ground balls (A1/E5) provide low-inductance return path for ESD current and RF filtering |
Key Features
| Feature | Design Value |
|---|---|
| Integrated SD-specific resistor network | 40 Ω series + 50 kΩ pull-up/down + 15 kΩ pull-down resistors eliminate need for 12 discrete passives per SD slot |
| Stable line capacitance vs. bias | 11.5–13.5 pF over 0–5 V ensures consistent signal rise/fall times across full SD I/O voltage swing |
| Wafer-level green packaging | RoHS-compliant SnAgCu balls and no mold compound enable ultra-thin (<0.4 mm) mounting for slim card readers |
| EMI/RF suppression | −35 dB attenuation at 100 MHz and −70 dB crosstalk reduce conducted/radiated emissions to meet CISPR 22 Class B |
| Dual ESD rating zones | Separate ±15 kV (external) and ±2 kV (internal) protection paths prevent overstress of bias circuitry during connector handling |
Applications
| SD Card Slot Protection | Portable Media Player Interface |
|---|---|
Use Scenario: SD card insertion/removal in consumer handheld devices subject to frequent human-handling ESD events. IC Role / Device Role / Timing Role: Primary ESD clamp and RC filter on all SD bus lines (DATA0–3, CMD, CLK, CD, WP), placed within 3 mm of the card edge connector. Use Value: Eliminates need for discrete 0402 TVS diodes and bias resistors, reducing layout area by >60% while maintaining 50 MHz SD timing margins. | Use Scenario: High-density PCB in MP3 players where SD interface shares space with audio codec and RF section. IC Role / Device Role / Timing Role: Simultaneous ESD hardening and RF noise suppression on SD lines to prevent coupling into sensitive analog audio paths. Use Value: −70 dB crosstalk at 100 MHz prevents audible artifacts during SD file transfers; 40 Ω series resistance damps ringing without violating SD 2.0 setup/hold requirements. |
| Industrial SD Host Controller | Automotive Infotainment SD Slot |
Use Scenario: Ruggedized SD interface in programmable logic controllers operating in −40 °C to +85 °C ambient. IC Role / Device Role / Timing Role: Temperature-stable ESD protection with minimal capacitance drift, ensuring reliable SD initialization across full industrial temperature range. Use Value: Line capacitance variation <0.5 pF from −40 °C to +85 °C avoids marginal timing failures during cold-start SD enumeration. | Use Scenario: SD card slot in automotive head unit exposed to ISO 10605 ESD pulses and wide thermal cycling. IC Role / Device Role / Timing Role: Dual-zone ESD protection: ±15 kV on exposed card lines, ±2 kV on internal WP/CD control nets tied to MCU GPIOs. Use Value: Prevents latch-up or damage to host MCU pins during card hot-swap while meeting AEC-Q200 stress test requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SD card interface ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SP1002-01WTG | No integrated resistors; requires external 40 Ω series and 50 kΩ bias components; 12 pF capacitance | Higher BOM count and layout area; less optimal for space-constrained SD slots | Choose when existing design uses discrete resistor networks and only ESD diode replacement is needed |
| ESD7L5.0ST5G | Single-line 5 V TVS only; no filtering resistors or multi-line integration; 30 pF capacitance | Cannot replace BGF110's full SD bus protection; limited to point-of-use clamping on individual lines | Use only for retrofitting legacy designs lacking integrated RC networks and accepting higher capacitance penalty |
Compared with SP1002-01WTG and ESD7L5.0ST5G, the BGF110E6327XT uniquely combines 10-line ESD protection, matched series resistance, and bias networks in one WLP package-reducing component count by 12× and preserving SD timing integrity where discrete solutions risk margin loss.
Availability
BGF110E6327XT is available at Aetrix Electronics and suitable for SD card slot protection, portable media player interfaces, and industrial SD host controllers requiring stable component supply with guaranteed long-term availability.
Supply support for BGF110E6327XT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, sensor, and protection ICs for automotive, industrial, and consumer applications.
The BGF110 belongs to Infineon's ESD protection product line, engineered specifically for high-speed digital interfaces like SD, MMC, and eMMC-balancing ESD robustness, RF filtering, and signal integrity in wafer-level packages.
FAQ
What is the maximum recommended trace length between BGF110E6327XT and the SD card connector?
Trace length should not exceed 3 mm from each BGF110 ball to its corresponding SD connector pin. Longer traces degrade ESD current shunting efficiency and increase inductance, reducing the effectiveness of the 40 Ω series resistors in damping fast transients. Layout guidelines in the datasheet specify tight routing to maintain <0.3 nH inductance per line.
Does BGF110E6327XT support SDIO or only standard SD/MMC protocols?
Yes, it supports both SDIO and standard SD/MMC protocols. Its 40 Ω series resistance and 11.5–13.5 pF capacitance are optimized for 0–50 MHz signaling, covering SDIO's typical 25–48 MHz clock rates and SD 2.0's 25 MHz default mode. The dual-zone ESD rating also accommodates SDIO's additional function pins.
Can BGF110E6327XT be used with UHS-I SD cards?
No, BGF110E6327XT is not suitable for UHS-I (Ultra High Speed Mode I) due to its 13.5 pF max line capacitance and lack of impedance-controlled routing support. UHS-I requires <8 pF capacitance and controlled 50 Ω traces; this device is validated only for SD 2.0/3.0 default and high-speed modes up to 50 MHz.
How is thermal dissipation managed during 15 kV ESD events?
During a 15 kV contact discharge, peak power is absorbed by the integrated silicon diodes and dissipated through the 24 solder balls into the PCB ground plane. The datasheet specifies 1131 mA absolute maximum current for 24 hours - but ESD pulses are sub-100 ns, so thermal mass of the copper pads and internal die structure safely handles transient energy without degradation.
BGF110E6327XT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 24-UFBGA, WLCSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Type:
- Filter, HSMMC with ESD Protection
- Applications:
- HSMMC (High Speed Multi Media Card)
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- WLP-24-2
- Grade:
- -
- Qualification:
- -
BGF110E6327XT FAQ
1.How can I place an order for BGF110E6327XT through Aetrix?
Please submit a Request for Quotation (RFQ) for BGF110E6327XT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BGF110E6327XT reliable?
The price and inventory of BGF110E6327XT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BGF110E6327XT is usually 5 days.
3.What payment methods are accepted for BGF110E6327XT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BGF110E6327XT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BGF110E6327XT?
BGF110E6327XT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BGF110E6327XT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BGF110E6327XT?
For technical support, including BGF110E6327XT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BGF110E6327XT requirements.
6.How does Aetrix verify that BGF110E6327XT is sourced from the original manufacturer or authorized distributors?
All BGF110E6327XT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BGF110E6327XT meets industry standards.
7.What is the process for return or replacement of BGF110E6327XT?
All BGF110E6327XT units undergo pre-shipment inspection (PSI). If there is an issue with BGF110E6327XT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BGF110E6327XT part is unused and in its original packaging.
Return procedure for BGF110E6327XT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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