Infineon Technologies BGF117E6328XTSA1

Overview

BGF117E6328XTSA1 from Infineon Technologies is a wafer-level packaged ESD protection and EMI filter IC for high-speed Mini-/Micro-SD card interfaces, featuring ±15 kV IEC61000-4-2 contact discharge protection on external I/Os, 8 pF typical line capacitance, integrated 40 Ω series resistors and 25 kΩ pull-up resistors, and WLP-16-4-N package (1.55 mm × 1.55 mm, 0.6 mm height). It enables robust, space-constrained SD host interface protection in mobile storage subsystems.

For engineers reviewing the BGF117E6328XTSA1 datasheet, BGF117E6328XTSA1 pinout, BGF117E6328XTSA1 application, or BGF117E6328XTSA1 equivalent, key selection criteria include I/O-specific ESD rating asymmetry (±15 kV external vs. ±2 kV internal), low-voltage-dependent capacitance stability, integrated biasing resistors eliminating discrete pull-ups, and WLP footprint compatibility with high-density SD card routing.

Technical Context

BGF117E6328XTSA1 integrates bidirectional TVS diodes and RC filtering networks per signal line, with snap-back breakdown at –12.5 V to –18.5 V and <100 nA reverse leakage at 3 V. Its WLP-16-4-N structure places 16 solder balls in a 4×4 array with 0.4 mm pitch, where external I/Os (A3, A4, B2, B4, C4, D3, D4) connect to SD card contacts and internal I/Os (A1, A2, B1, C1, D1, D2) route to host controller.

The device implements dedicated 40 Ω series resistors (R1–R6) on all six data/command lines and 25 kΩ pull-up resistors (R7–R11) on CMD, DAT0–DAT3, enabling bus termination without external components. Line-to-GND capacitance remains stable (8–9.5 pF) across 0–5 V bias, critical for maintaining signal integrity up to 100 MHz SD clock frequencies.

Key Specifications

Pinout & Package

WLP-16-4-N is a 1.55 mm × 1.55 mm wafer-level package with 16 coplanar solder balls arranged in a 4×4 grid and 0.4 mm pitch. Pin 1 is located at the A1 corner, marked by a laser-etched index area. Total height is 0.6 mm, standoff is 0.1 mm, and coplanarity is ≤0.08 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection and EMI filtering applications.

Compared with SP1006-01WTG and EMIF06-SD01F2, BGF117E6328XTSA1 uniquely combines ultra-low capacitance, asymmetric ESD grading, and full passive integration-reducing component count by 11 and enabling 100 MHz SD high-speed mode compliance in sub-2 mm² area.

Availability

BGF117E6328XTSA1 is available at Aetrix Electronics and suitable for mobile phone SD host interfaces, tablet embedded storage modules, and automotive infotainment systems requiring stable component supply, high-volume traceability, and long-term lifecycle support.

Supply support for BGF117E6328XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, RF, and protection devices, with global R&D centers and ISO/TS 16949-certified manufacturing.

BGF117E6328XTSA1 belongs to Infineon's RF & Protection Devices product line, engineered specifically for high-speed serial interface protection in space-constrained portable electronics with stringent ESD and EMI compliance requirements.

FAQ

What is the maximum SD clock frequency supported by BGF117E6328XTSA1?

BGF117E6328XTSA1 supports SD high-speed mode up to 50 MHz (100 Mbps data rate) due to its 8 pF typical line capacitance and optimized internal RC network. Measured S21 insertion loss remains below –3 dB up to 100 MHz, enabling reliable operation in UHS-I mode with proper PCB layout and controlled impedance routing.

Can BGF117E6328XTSA1 be used with SD Card Specification v3.0 or later?

Yes - BGF117E6328XTSA1 complies with SD Card Specification v2.0 and MicroSD v1.0, and its electrical characteristics (capacitance, resistance, ESD rating) meet the interface requirements of v3.0 and v4.x. No functional or timing incompatibility exists; however, UHS-II differential signaling requires separate protection solutions not provided by this device.

How are the integrated pull-up resistors connected internally?

The 25 kΩ pull-up resistors (R7–R11) connect each of CMD, DAT0–DAT3 to the internal VCC rail, which is tied to the host-side supply. They are implemented as polysilicon resistors within the die and share the same thermal and voltage coefficient as the ESD diodes, ensuring stable biasing across temperature and supply variation.

Is reflow soldering compatible with the WLP-16-4-N package?

Yes - BGF117E6328XTSA1 uses standard Pb-free solder (SnAgCu) and is qualified for IPC/JEDEC J-STD-020D-compliant reflow profiles. The recommended PCB pad design (Figure 6) specifies 0.25 mm diameter circular pads with 0.4 mm pitch and 1.2 mm overall footprint, supporting both stencil printing and automated optical inspection.