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Infineon Technologies BGF148E6327XTSA1
- Part No.:
- BGF148E6327XTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Specialized ICs
- Package:
- 14-XFQFN Exposed Pad
- Datasheet:
-
BGF148E6327XTSA1.pdf
- Description:
- IC INTERFACE PROTECTION TSNP14-2
- Quantity:
- Payment:
- Shipping:
Inventory:4,708
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Product details
Overview
BGF148E6327XTSA1 from Infineon Technologies is a 7-line bidirectional ESD and EMI interface protection device for SD card interfaces, featuring ±15 kV IEC61000-4-2 contact ESD protection on external I/Os, 1.2 pF typical line capacitance, 20 Ω integrated series resistors, and TSNP-14-2 package. It supports SD3.0 UHS-I mode in smartphones, tablets, and digital cameras.
For engineers reviewing the BGF148E6327XTSA1 datasheet, BGF148E6327XTSA1 pinout, BGF148E6327XTSA1 application, or BGF148E6327XTSA1 equivalent, key selection criteria include line capacitance stability vs. voltage, clamping voltage under 16 A TLP stress, dynamic resistance of 0.03 Ω, and compatibility with SD Card Specification v4.1 including UHS104 mode.
Technical Context
This device integrates six π-type EMI filters (each with 20 Ω series resistor + ESD diode to GND) and one dedicated SD card detect (CD)/DAT3 line path with identical protection. All seven lines provide bidirectional ESD clamping via low-capacitance diodes with 6.5 V breakdown and sub-9 V clamping at 16 A TLP.
The TSNP-14-2 package enables compact layout with 400 µm pitch and optimized I/O arrangement for minimal PCB area. Its low voltage dependency of line capacitance ensures signal integrity across 0–5.5 V operating range, critical for high-speed SD3.0 data lines up to 104 MB/s.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection (External IO) | ±15 kV per IEC61000-4-2 contact discharge - ensures robustness against user-handling ESD events in portable devices |
| Line Capacitance | 1.2 pF typical at 1 MHz, 0 V bias - preserves signal integrity for SD3.0 UHS-I clock and data lines |
| Series Resistance | 20 Ω typical (R1–R6) - damps ringing and limits ESD current without degrading rise/fall times |
| Clamping Voltage | ≤9 V at 16 A TLP - protects downstream SD controller I/Os from overstress during fast ESD transients |
| Dynamic Resistance | 0.03 Ω - enables rapid voltage clamping with minimal IR drop during high-current ESD pulses |
| Operating Voltage | 0–5.5 V - covers full SD card interface voltage range including 3.3 V and 1.8 V signaling modes |
Pinout & Package
Package: TSNP-14-2 (Thin Small No-lead, 14-pin, 0.4 mm pitch, RoHS/halogen-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | SDCLK | SD card clock line - protected path with 20 Ω resistor + ESD diode to GND |
| 2 | SDCMD | SD command line - protected path with 20 Ω resistor + ESD diode to GND |
| 3 | SDDAT0 | SD data line 0 - protected path with 20 Ω resistor + ESD diode to GND |
| 4 | SDDAT1 | SD data line 1 - protected path with 20 Ω resistor + ESD diode to GND |
| 5 | SDDAT2 | SD data line 2 - protected path with 20 Ω resistor + ESD diode to GND |
| 6 | SDDAT3/CD | SD data line 3 or card detect - protected path with 20 Ω resistor + ESD diode to GND |
| 7–8 | GND | Ground terminals - low-inductance return paths for all ESD current dissipation |
| 9–14 | VCC | Supply connection - decoupling node for internal ESD clamp biasing; tied to host/card VCC rail |
Key Features
| Feature | Design Value |
|---|---|
| 7-line bidirectional ESD protection | Full coverage for SD3.0 interface (CLK, CMD, DAT0–3, CD) with ±15 kV external/±8 kV internal ESD rating |
| Integrated π-type EMI filter | Six lines use 20 Ω + low-C diode topology for >30 dB attenuation above 100 MHz while minimizing crosstalk |
| Stable 1.2 pF line capacitance | Voltage-independent capacitance ensures consistent timing margin across 0–5.5 V operation |
| Low leakage current | ≤100 nA at 5.5 V reverse bias - avoids SD bus leakage-induced timeout or initialization failure |
Applications
| Smartphone SD Card Interface | Digital Camera SD Slot |
|---|---|
Use Scenario: High-density mobile PCB where SD card slot is exposed to frequent insertion/removal and user ESD events. IC Role / Device Role / Timing Role: Front-end protection IC placed between microSD connector and SoC SD controller, preserving signal integrity at 104 MB/s UHS-I speeds. Use Value: Prevents field failures from ±15 kV contact ESD while maintaining <1.5 pF loading on all data lines to meet setup/hold timing. | Use Scenario: Compact digital still camera with integrated microSD slot subject to environmental EMI and handling ESD. IC Role / Device Role / Timing Role: EMI/ESD co-protection device on SD bus, filtering RF noise from lens motors and flash circuits while clamping transients. Use Value: Enables reliable 4K video recording by suppressing cross-talk between CLK/DAT lines and reducing bit errors from EMI-induced jitter. |
| Tablet SD Expansion Port | Laptop SD Card Reader |
Use Scenario: Tablet with full-size SD card slot used in industrial or outdoor environments with elevated ESD risk. IC Role / Device Role / Timing Role: Interface guard IC ensuring SD3.0 backward compatibility with SD2.0/1.0 cards while meeting IEC61000-4-2 Level 4 immunity. Use Value: Eliminates need for discrete RC filters and TVS arrays, saving >3 mm² PCB area and simplifying layout for 7-signal routing. | Use Scenario: Ultrabook SD card reader supporting hot-plug detection and UHS-I transfer modes. IC Role / Device Role / Timing Role: Dual-role protector for DAT3/CD line - provides card presence sensing and ESD-safe data path switching. Use Value: Maintains <500 ns card-detect response time while limiting leakage to <100 nA, preventing false insert/remove interrupts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SD interface protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SP1006-01FTG | Single-line TVS array (0.35 pF), no integrated resistors or multi-line packaging | Requires external 20 Ω resistors and six additional devices for full SD interface | Use only when board space allows discrete implementation and cost sensitivity outweighs assembly complexity |
| EMIF06-SD01F2 | 6-line ESD+EMI filter with 0.65 pF capacitance but no DAT3/CD dual-function pin support | Lacks dedicated card-detect line handling; requires external switch for CD functionality | Select when UHS-I speed is secondary to ultra-low capacitance and DAT3 is unused |
Compared with SP1006-01FTG and EMIF06-SD01F2, BGF148E6327XTSA1 delivers complete 7-line integration with matched 20 Ω termination and SD-spec-compliant DAT3/CD flexibility-reducing BOM count by 6× and eliminating inter-device skew in high-speed timing paths.
Availability
BGF148E6327XTSA1 is available at Aetrix Electronics and suitable for smartphone SD card interfaces, digital camera SD slots, and tablet expansion ports requiring stable component supply and SD3.0 UHS-I compliance.
Supply support for BGF148E6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global R&D and manufacturing infrastructure.
BGF148E6327XTSA1 belongs to Infineon's ESD/EMI interface protection product line, designed specifically for high-speed memory card interfaces requiring integrated filtering, low capacitance, and IEC-compliant transient immunity.
FAQ
What is the maximum operating voltage for BGF148E6327XTSA1?
The absolute maximum operating voltage is 5.5 V applied to any pin relative to GND, with continuous operation rated from 0 V to 5.5 V. This supports both 3.3 V and 1.8 V SD interface signaling levels, and the device maintains specified ESD clamping and capacitance performance across this full range.
Does BGF148E6327XTSA1 require an external power supply?
No external bias is required. The device operates passively using the host or card VCC rail connected to pins 9–14. Internal ESD clamps are diode-based and self-biasing; no current draw occurs outside of transient ESD events or leakage (<100 nA at 5.5 V).
How does the 20 Ω series resistance affect SD3.0 signal integrity?
The 20 Ω resistance is precisely tuned to dampen ringing without degrading edge rates: it reduces overshoot on 104 MB/s UHS-I signals while maintaining rise/fall times within SD specification limits. Measured eye diagrams show >85% eye opening at 200 mV/div with 1.2 pF loading.
Can BGF148E6327XTSA1 be used with SD2.0-only controllers?
Yes. The device is fully backward compatible with SD2.0 and earlier specifications. Its 1.2 pF capacitance and 20 Ω termination meet SD2.0 timing requirements for 50 MB/s mode, and the ±15 kV ESD rating exceeds SD2.0 immunity recommendations, making it suitable for legacy and mixed-generation designs.
BGF148E6327XTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 14-XFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Type:
- Interface Protection
- Applications:
- HSMMC ESD Protection, EMI Filter
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TSNP-14-2
- Grade:
- -
- Qualification:
- -
BGF148E6327XTSA1 FAQ
1.How can I place an order for BGF148E6327XTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BGF148E6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BGF148E6327XTSA1 reliable?
The price and inventory of BGF148E6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BGF148E6327XTSA1 is usually 5 days.
3.What payment methods are accepted for BGF148E6327XTSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BGF148E6327XTSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BGF148E6327XTSA1?
BGF148E6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BGF148E6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BGF148E6327XTSA1?
For technical support, including BGF148E6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BGF148E6327XTSA1 requirements.
6.How does Aetrix verify that BGF148E6327XTSA1 is sourced from the original manufacturer or authorized distributors?
All BGF148E6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BGF148E6327XTSA1 meets industry standards.
7.What is the process for return or replacement of BGF148E6327XTSA1?
All BGF148E6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BGF148E6327XTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BGF148E6327XTSA1 part is unused and in its original packaging.
Return procedure for BGF148E6327XTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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