Infineon Technologies BGS15MC17-2E6433XUSA1

Overview

BGS15MC17-2E6433XUSA1 from Infineon Technologies is an SP5T RF diversity switch for LTE/WCDMA receive-path applications, featuring 0.1–2.9 GHz frequency coverage, 0.35 dB typical insertion loss at 2.1 GHz, 27 dBm CW RF input power handling, and integrated MIPI RFFE interface operating at 1.1–1.95 V. It enables direct battery connection with DC-free RF ports and requires no external DC blocking capacitors unless external DC bias is applied.

For engineers reviewing the BGS15MC17-2E6433XUSA1 datasheet, BGS15MC17-2E6433XUSA1 pinout, BGS15MC17-2E6433XUSA1 application, or BGS15MC17-2E6433XUSA1 equivalent, key selection criteria include RF port isolation (≥28 dB at 2.1 GHz), MIPI RFFE USID programmability, ATSLP-12-4 package compatibility, and low standby current (≤1 µA) in MIPI low-power mode.

Technical Context

The BGS15MC17-2E6433XUSA1 implements a single-pole, five-throw (SP5T) RF switch architecture using Infineon's patented silicon MOS process, delivering GaAs-level RF performance with CMOS integration benefits. Its on-chip MIPI RFFE controller supports register-based path selection, startup behavior control, and software-configurable USID addressing.

It operates across 2.2–5.5 V VBAT and 1.1–1.95 V VIO supply rails, with dedicated SSEL1/SSEL2 pins enabling hardware-selectable device addressing in multi-switch configurations. The switch transitions between active and low-power modes via MIPI commands, with defined settling times of ≤1.5 µs after VIO power-up and ≤3.5 µs after MIPI wake-up.

Key Specifications

Pinout & Package

Package: ATSLP-12-4 (Advanced Thin Small Leadless Package, 12-pin, 0.4 mm pitch), dimensions 1.1 mm × 1.9 mm × 0.65 mm, RoHS-compliant, wettable flank profile for automated optical inspection.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SP5T RF switch applications.

Compared with QM11025 and SKY16604-378LF, BGS15MC17-2E6433XUSA1 provides broader low-VIO compatibility (1.1–1.95 V), built-in hardware address selection (SSEL1/SSEL2), and tighter harmonic suppression (−55 dBc), making it optimal for scalable, multi-switch, battery-powered mobile platforms.

Availability

BGS15MC17-2E6433XUSA1 is available at Aetrix Electronics and suitable for smartphone LTE diversity receivers, tablet WCDMA MIMO front-ends, and IoT cellular gateways requiring stable component supply, consistent ATSLP-12-4 package delivery, and long-term lifecycle support through Infineon's qualified manufacturing lines.

Supply support for BGS15MC17-2E6433XUSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and RF solutions, with global R&D centers and ISO/TS 16949-certified wafer fabs.

The BGS15MC17-2E6433XUSA1 belongs to Infineon's BGS15xx SP5T RF switch product line, engineered specifically for high-efficiency, low-footprint LTE/WCDMA diversity receive-path architectures in mobile consumer electronics.

FAQ

Does BGS15MC17-2E6433XUSA1 require external DC blocking capacitors on its RF ports?

No. The device features DC-free RF ports and does not require external DC blocking capacitors unless an external DC voltage is intentionally applied to the RX1–RX5 or AI terminals. This eliminates insertion loss and board area associated with discrete capacitors in standard LTE/WCDMA receive paths.

What is the maximum allowable RF input power for continuous wave operation?

The absolute maximum RF input power is 27 dBm CW across all RX ports, as specified in Table 2 of the datasheet. Derating is not required up to this level under TA = 25 °C and proper PCB thermal vias; junction temperature remains below 125 °C with standard 2-layer FR4 layout.

How is device addressing handled when multiple BGS15MC17-2E6433XUSA1 units share one MIPI RFFE bus?

Hardware address selection is implemented via SSEL1 and SSEL2 pins, which encode a 2-bit USID (00 to 11). Each device on the shared bus must have unique SSEL1/SSEL2 states; no software configuration is needed beyond initial MIPI write to Register_0 for path selection.

Is the ATSLP-12-4 package compatible with standard reflow profiles for lead-free soldering?

Yes. The ATSLP-12-4 package is qualified for IPC/JEDEC J-STD-020D-compliant lead-free reflow, with peak temperature up to 260 °C for ≤30 seconds. Wettable flanks enable automated optical inspection of solder joint quality without X-ray.