NXP Semiconductors BGX7101HN/1118
- Part No.:
- BGX7101HN/1118
- Manufacturer:
- NXP Semiconductors
- Category:
- RF Modulators
- Package:
- 24-VFQFN Exposed Pad
- Datasheet:
-
BGX7101HN/1118.pdf
- Description:
- TRANSMITTER IQ MODULATOR 24HVQFN
- Quantity:
- Payment:

- Shipping:

Inventory:4,725
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BGX7101HN/1118 from NXP Semiconductors is a high-linearity RF transmitter IQ modulator supporting 400 MHz to 4000 MHz up-conversion with 12 dBm output at 1 dB gain compression, 27 dBm typical output IP3, and unadjusted sideband suppression of 50 dBc. It operates with differential 100 Ω IQ inputs, 50 Ω single-ended RF output, and independent hardware power-down control - deployed in mobile infrastructure base station transmitters.
For engineers reviewing the BGX7101HN/1118 datasheet, BGX7101HN/1118 pinout, BGX7101HN/1118 application, or BGX7101HN/1118 equivalent, key selection criteria include RF frequency coverage (400–4000 MHz), modulation bandwidth (up to 650 MHz), LO input return loss (>12 dB), sideband suppression stability across temperature, and fast (<1 µs) shutdown timing for TDD systems.
Technical Context
The BGX7101HN/1118 implements a dual-mixer architecture with buffered and phase-split LO path (0° and 90°), enabling precise quadrature up-conversion. Its performance remains stable across IQ common-mode voltage range (0.25 V to 3.3 V), eliminating need for external level-shifting when interfacing with DACs.
LO and RF ports feature broadband 50 Ω termination; differential IQ inputs present 100 Ω impedance with 1.8 pF differential capacitance. The device uses integrated active biasing and supports single 5 V supply, with separate VCC_LO and VCC_RF domains for improved isolation between LO and RF sections.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 400 MHz to 4000 MHz - enables wideband operation across LTE, 5G NR, and microwave backhaul bands |
| PL(1dB) | 12 dBm typical - defines maximum linear output power before 1 dB gain compression occurs |
| IP3o | 27 dBm typical - quantifies third-order linearity for multi-carrier signal integrity |
| Sideband Suppression | 50 dBc unadjusted - measures inherent I/Q amplitude/phase imbalance without calibration |
| Carrier Feedthrough | −45 dBm unadjusted - indicates residual LO leakage at RF output without nulling |
| Modulation Bandwidth | 650 MHz - supports wide instantaneous bandwidth signals including OFDM and wideband DPD |
| IQ Input Impedance | 100 Ω differential - simplifies matching to DAC outputs and baseband filters |
| Power-Down Time | <1 µs - allows rapid TDD switching without disrupting LO synthesizer lock |
Pinout & Package
Package: HVQFN24 (SOT616-3), 4 mm × 4 mm × 0.85 mm, thermally enhanced, exposed die pad requiring RF ground connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| POFF_P (1) | Active-HIGH logic input | Enables fast hardware shutdown; >1.5 V disables modulator, drawing only 6 mA total current |
| LO_P (3), LO_N (4) | Differential LO input | Accepts 0 dBm LO drive; requires AC coupling; provides >12 dB return loss across full RF band |
| MODI_P/MODI_N (21/22), MODQ_P/MODQ_N (10/9) | Differential I/Q baseband inputs | 100 Ω differential impedance; supports 0.25–3.3 V common-mode voltage for direct DAC interface |
| RFOUT (16) | Single-ended RF output | 50 Ω matched; requires AC coupling; delivers up to 12 dBm linear output |
| VCC_LO(5V0) (24), VCC_RF(5V0) (18) | Analog power supplies | Separate 5 V domains isolate LO and RF sections, reducing crosstalk and improving spectral purity |
| RFGND (7,8,11,12,14,17,20), LOGND (2,5,6) | Ground terminals | Dedicated RF and LO ground pins minimize shared-impedance noise and improve isolation |
Key Features
| Feature | Design Value |
|---|---|
| Wide RF frequency coverage | 400–4000 MHz enables reuse across sub-6 GHz 5G, LTE-A, and point-to-point microwave links |
| Common-mode voltage independence | Stable performance across 0.25–3.3 V IQ common-mode range eliminates need for external level shifters |
| Fast hardware shutdown | <1 µs transition time minimizes LO unlock risk during TDD slot switching in base stations |
| Integrated active biasing | Eliminates external bias networks, reduces BOM count, and improves temperature stability |
| ESD protection | HBM ±2500 V and FCDM ±650 V on all pins ensures robustness in manufacturing and field environments |
| Thermal resistance | Rth(j-mb) = 10 K/W enables reliable operation at +85 °C mounting base temperature |
Applications
| Mobile Network Infrastructure | Microwave Backhaul |
|---|---|
Use Scenario: LTE/5G macrocell and small cell remote radio units requiring wideband digital predistortion and high ACLR. IC Role / Device Role / Timing Role: Transmitter IQ modulator converting baseband I/Q signals to RF carrier with minimal distortion and carrier leakage. Use Value: 27 dBm IP3o and 50 dBc sideband suppression enable >45 dB ACLR in 100 MHz 5G NR channels without complex calibration. | Use Scenario: Point-to-point 6–42 GHz E-band wireless links using IF-upconversion architecture. IC Role / Device Role / Timing Role: Wideband IF-to-RF upconverter operating at 2.65 GHz or 3.65 GHz intermediate frequencies. Use Value: 650 MHz modulation bandwidth supports 500+ MHz instantaneous signal bandwidth for high-throughput data transport. |
| Industrial Broadband Radios | Test & Measurement Equipment |
Use Scenario: Secure tactical radios and spectrum monitoring receivers needing agile, low-distortion RF synthesis. IC Role / Device Role / Timing Role: High-linearity modulator in software-defined radio (SDR) transmit chains with FPGA-based waveform generation. Use Value: Stable 12 dBm PL(1dB) and <1 µs shutdown allow dynamic channel hopping and burst transmission without LO relock delays. | Use Scenario: Vector signal generators and production test platforms requiring calibrated, repeatable RF output. IC Role / Device Role / Timing Role: Precision modulator stage in lab-grade signal sources where unadjusted SBS and CF define baseline calibration accuracy. Use Value: −45 dBm unadjusted carrier feedthrough and 50 dBc sideband suppression provide known error floor for automated calibration routines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transmitter IQ modulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADL5375-05ACPZ-R7 | 500 MHz–4 GHz range; 11 dBm PL(1dB); 25 dBm IP3o; requires dual ±5 V supplies | Higher supply complexity; lower IP3o limits multi-carrier linearity in dense 5G deployments | Select for legacy designs already using ADI's modulator ecosystem and dual-supply infrastructure |
| TRF372017IRGZT | 300 MHz–4.8 GHz range; 10 dBm PL(1dB); 24 dBm IP3o; integrated LO synthesizer | Includes PLL/VCO but lower linearity; less suitable for high-ACLR base station applications | Select when system-level integration (LO + modulator) outweighs linearity requirements |
Compared with ADL5375-05ACPZ-R7 and TRF372017IRGZT, the BGX7101HN/1118 delivers superior third-order linearity (27 dBm IP3o vs. ≤25 dBm) and faster shutdown (<1 µs), making it preferred for high-density 5G NR and critical infrastructure where spectral purity and TDD agility are mandatory.
Availability
BGX7101HN/1118 is available at Aetrix Electronics and suitable for mobile network infrastructure, microwave backhaul, and industrial broadband radio applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for BGX7101HN/1118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and communications markets.
The BGX7101HN/1118 belongs to NXP's RF transmitter modulator product line, engineered specifically for high-linearity, wideband up-conversion in cellular infrastructure and mission-critical wireless systems.
FAQ
What is the RF frequency range supported by the BGX7101HN/1118?
The BGX7101HN/1118 supports an RF frequency range from 400 MHz to 4000 MHz, covering key bands for LTE, 5G NR sub-6 GHz, and microwave point-to-point links. This range is verified across all operating conditions per the official NXP datasheet Rev. 5, with consistent performance in S22_RF (>10 dB return loss) and S11_LO (>12 dB return loss).
Does the BGX7101HN/1118 require external DC blocking capacitors on its RF and LO ports?
Yes, the BGX7101HN/1118 requires series AC-coupling capacitors on both LO_P/LO_N and RFOUT pins because these ports are internally DC-biased. The datasheet specifies this in Section 12.2 and shows 0.3 pF and 0.4 pF capacitors in the typical application diagram (Figure 4), confirming mandatory AC coupling for proper biasing and signal integrity.
What is the typical power consumption of the BGX7101HN/1118 in active mode at 2.14 GHz?
At 2.14 GHz LO frequency and 25 °C mounting base temperature, the BGX7101HN/1118 draws 182 mA total supply current in active mode (Table 6). This value is measured with VCC = 5 V and Pi(lo) = 0 dBm, and remains within ±5 mA across the full −40 °C to +85 °C operating range.
How does the POFF_P pin function on the BGX7101HN/1118?
The POFF_P pin (Pin 1) is an active-HIGH logic input that places the BGX7101HN/1118 into low-current shutdown mode when driven above 1.5 V, reducing total current to 6 mA. Transition time between active and inactive states is under 1 µs, and the shutdown feature maintains LO port impedance stability to prevent synthesizer unlock in base station TDD applications.
Can the BGX7101HN/1118 interface directly with a 1.8 V CMOS DAC?
Yes, the BGX7101HN/1118 supports IQ common-mode voltages from 0.25 V to 3.3 V, fully encompassing 1.8 V CMOS DAC outputs. Its differential input impedance is 100 Ω with 1.8 pF capacitance, enabling direct connection without level-shifting circuitry - a design feature explicitly validated in Section 8.1 and Table 6 of the datasheet.
BGX7101HN/1118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 24-VFQFN Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Active
- Function:
- Upconverter
- LO Frequency:
- 400MHz ~ 4GHz
- RF Frequency:
- 400MHz ~ 4GHz
- P1dB:
- 12dBm
- Noise Floor:
- -158dBm/Hz
- Output Power:
- 20dBm (Max)
- Current - Supply:
- 188 mA
- Voltage - Supply:
- 4.75V ~ 5.25V
- Test Frequency:
- 5MHz
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-HVQFN (4x4)
BGX7101HN/1118 FAQ
1.How can I place an order for BGX7101HN/1118 through Aetrix?
Please submit a Request for Quotation (RFQ) for BGX7101HN/1118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BGX7101HN/1118 reliable?
The price and inventory of BGX7101HN/1118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BGX7101HN/1118 is usually 5 days.
3.What payment methods are accepted for BGX7101HN/1118?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BGX7101HN/1118 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BGX7101HN/1118?
BGX7101HN/1118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BGX7101HN/1118 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BGX7101HN/1118?
For technical support, including BGX7101HN/1118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BGX7101HN/1118 requirements.
6.How does Aetrix verify that BGX7101HN/1118 is sourced from the original manufacturer or authorized distributors?
All BGX7101HN/1118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BGX7101HN/1118 meets industry standards.
7.What is the process for return or replacement of BGX7101HN/1118?
All BGX7101HN/1118 units undergo pre-shipment inspection (PSI). If there is an issue with BGX7101HN/1118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BGX7101HN/1118 part is unused and in its original packaging.
Return procedure for BGX7101HN/1118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BGX7101HN/1118 Tags

-
LTC5599IUF#TRPBF
Analog Devices Inc.

-
LTC5599IUF#PBF
Analog Devices Inc.

-
LTC5589IUF#PBF
Analog Devices Inc.

-
ADL5375-05ACPZ-R7
Analog Devices Inc.

-
ADL5385ACPZ-R7
Analog Devices Inc.

-
AD8346ARUZ-REEL7
Analog Devices Inc.

-
LTC5588IPF-1#PBF
Analog Devices Inc.

-
ADRF6755ACPZ-R7
Analog Devices Inc.

-
TRF370417IRGET
Texas Instruments

-
HMC631LP3ETR
Analog Devices Inc.

-
TRF3705IRGET
Texas Instruments

-
LTC5589IUF#TRPBF
Analog Devices Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

