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NXP Semiconductors BLC8G27LS-245AVJ

Part No.:
BLC8G27LS-245AVJ
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
SOT-1251-2
Datasheet:
AetrixBLC8G27LS-245AVJ.pdf
Description:
RF MOSFET LDMOS 28V 8DFM
Quantity:
Payment:
Payment
Shipping:
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Inventory:3,755

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Product details

Overview

BLC8G27LS-245AVJ from Ampleon is a 240 W asymmetric Doherty LDMOS power transistor designed for base station RF power amplification in the 2500–2700 MHz band. It delivers 56 W average output power with 14.5 dB power gain, 43% drain efficiency, and −35 dBc adjacent channel power ratio under 1-carrier W-CDMA conditions at 2500–2690 MHz. Its ruggedness supports VSWR = 10:1 load mismatch tolerance at 2500 MHz.

For engineers reviewing the BLC8G27LS-245AVJ datasheet, BLC8G27LS-245AVJ pinout, BLC8G27LS-245AVJ application, or BLC8G27LS-245AVJ equivalent, this device requires attention to its dual-amplifier architecture (main + peak), thermal resistance (0.3 K/W), gate voltage limits (±0.5 V to +13 V), and internal matching for 50 Ω systems - critical for broadband Doherty PA design and digital pre-distortion implementation.

Technical Context

The BLC8G27LS-245AVJ integrates two laterally diffused MOSFETs - a main amplifier (IDq = 500 mA) and a peak amplifier (IDq = 660 mA) - on a single die within an air-cavity flanged package. It operates at VDS = 28 V with gate-source quiescent voltages of 2.1 V (main) and 2.1 V (peak), enabling high-efficiency asymmetrical Doherty operation across 2500–2700 MHz.

Its low thermal resistance (0.3 K/W) and integrated ESD protection (HBM Class 2, CDM Class C2A) support stable high-power operation in production-class base station amplifiers. The device exhibits 110 MHz typical video bandwidth in Doherty configuration and is characterized for low memory effects to facilitate effective digital pre-distortion.

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Range 2500–2700 MHz - fully specified for asymmetric Doherty operation in 4G LTE/TDD-LTE base stations
Average Output Power 56 W - measured at PL(AV) = 56 W under 1-carrier W-CDMA, enabling multi-carrier signal handling
Power Gain 14.5 dB - typical Gp at 2500–2690 MHz, supporting compact driver-stage design
Drain Efficiency 43 % - ηD at 56 W output, reducing thermal load and DC power consumption in macrocell PA stages
ACPR −35 dBc - adjacent channel power ratio at 5 MHz offset, meeting 3GPP spectral mask requirements
Thermal Resistance 0.3 K/W - Rth(j-c) enables high-power operation with manageable case temperature rise at 80 °C
VSWR Tolerance 10:1 - ruggedness verified at 2500 MHz under class-AB conditions, supporting antenna mismatch resilience

Pinout & Package

Air cavity plastic earless flanged package SOT1251-2 (9.6 mm × 32.3 mm × 10.2 mm), thermally optimized with flange-connected drain terminals and integrated ESD protection.

Pin/Terminal Circuit Role Design Meaning
1 drain2 (peak) High-current output node for peak amplifier stage; connected to flange for thermal conduction
2 drain1 (main) High-current output node for main amplifier stage; electrically isolated but thermally coupled to flange
3 gate1 (main) Control input for main amplifier; rated VGS(amp)main = −0.5 V to +13 V, threshold 1.9 V
4 gate2 (peak) Control input for peak amplifier; rated VGS(amp)peak = −0.5 V to +13 V, threshold 1.9 V
5 source Common source reference for both amplifiers; tied to ground plane for RF stability
6 video decoupling (main) DC bias feed and low-frequency stabilization point for main amplifier gate
7, 8 n.c. No internal connection - left floating per datasheet; not to be bonded or routed
9 video decoupling (peak) DC bias feed and low-frequency stabilization point for peak amplifier gate

Key Features

Feature Design Value
Asymmetric Doherty architecture Optimized impedance profiles for main (ZL = 1.0 − j4.5 Ω) and peak (ZL = 2.1 − j4.9 Ω) devices enable >60% peak efficiency at 2600 MHz
Internally matched Designed for direct integration into 50 Ω systems without external matching networks at 2500–2700 MHz
Low memory effects Verified via DPD-enabled W-CDMA testing - supports <−50 dBc residual ACPR after linearization
Lower output capacitance Reduces reactive loading in Doherty combiner networks, improving bandwidth and isolation between main/peak paths
Integrated ESD protection HBM Class 2 (2000 V) and CDM Class C2A (500 V) - eliminates need for external TVS on gate lines in PCB layout

Applications

4G LTE Base Station PA Multi-Carrier W-CDMA Amplifier

Use Scenario: Macrocell outdoor base station operating in TDD-LTE Band 41 (2500–2690 MHz) with 20 MHz channel bandwidth and 64 DPCH loading.

IC Role / Device Role / Timing Role: Asymmetric Doherty RF power transistor delivering final-stage amplification with dynamic envelope tracking support.

Use Value: Achieves 43% drain efficiency at 56 W output while maintaining −35 dBc ACPR, reducing cooling requirements and OPEX in deployed sites.

Use Scenario: Indoor distributed antenna system (DAS) head-end amplifier supporting concurrent 2-carrier W-CDMA signals at 2500 MHz and 2600 MHz.

IC Role / Device Role / Timing Role: Dual-path LDMOS transistor enabling high linearity across multiple carriers without intermodulation distortion degradation.

Use Value: Delivers 14 dB power gain and −24 dBc ACPR at 120 W peak power, eliminating need for cascaded PA stages.

Digital Pre-Distortion (DPD) PA High-Ruggedness Remote Radio Head

Use Scenario: Active antenna unit (AAU) with real-time DPD feedback loop requiring minimal memory effect and wide VBW.

IC Role / Device Role / Timing Role: Main+peak LDMOS pair serving as the nonlinear power stage, with gate biasing optimized for DPD convergence.

Use Value: 110 MHz video bandwidth and low memory effects enable stable DPD coefficient adaptation under dynamic traffic loads.

Use Scenario: Pole-mounted remote radio head exposed to variable VSWR due to environmental antenna detuning.

IC Role / Device Role / Timing Role: Final-stage RF transistor capable of surviving 10:1 VSWR at all phase angles without latch-up or parametric shift.

Use Value: Eliminates need for external circulators or VSWR protection circuitry, reducing BOM count and failure points in field-deployed units.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power transistor applications.

Alternative Part Technical Difference Application Difference Selection Advice
AFM30L025N 250 W GaN HEMT; higher gain (17 dB), wider bandwidth (2300–2700 MHz), but requires external gate bias sequencing and no integrated ESD Preferred for new GaN-based macrocell designs targeting >50% efficiency above 2600 MHz; not drop-in compatible Select AFM30L025N when upgrading to GaN for higher power density and thermal margin; redesign gate drive and thermal interface required.
BLC8G27LS-245 Same die, identical RF specs, but packaged in SOT1251-1 (with ear); flange mounting differs, thermal path less optimized (Rth(j-c) = 0.35 K/W) Suitable for legacy board designs using ear-type flange mounting; lower thermal performance limits max continuous output Choose BLC8G27LS-245 only if reusing existing SOT1251-1 footprint; BLC8G27LS-245AVJ offers superior thermal reliability for 24/7 operation.

Compared with AFM30L025N and BLC8G27LS-245, the BLC8G27LS-245AVJ provides best-in-class thermal resistance (0.3 K/W) and integrated ESD protection for LDMOS-based base station PAs, making it optimal for cost-sensitive, high-reliability deployments where GaN adoption is not yet justified.

Availability

BLC8G27LS-245AVJ is available at Aetrix Electronics and suitable for 4G LTE base station development, multi-carrier W-CDMA infrastructure, and remote radio head production requiring stable component supply and long-term lifecycle support.

Supply support for BLC8G27LS-245AVJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Ampleon Netherlands B.V. is a global leader in RF power transistors, spun off from NXP in 2015, specializing in LDMOS and GaN solutions for wireless infrastructure, broadcast, and industrial applications.

The BLC8G27LS-245AVJ belongs to Ampleon's BLC8GxxLS series of asymmetric Doherty LDMOS transistors, engineered specifically for energy-efficient, spectrally clean 4G/LTE base station power amplifiers operating in the 2.5–2.7 GHz band.

FAQ

What is the maximum continuous drain-source voltage rating for the BLC8G27LS-245AVJ?

The BLC8G27LS-245AVJ has a maximum continuous drain-source voltage (VDS) rating of 65 V, as defined in IEC 60134 limiting values. This rating applies under all operating conditions including VSWR = 10:1 mismatch events at 2500 MHz, ensuring safe operation in demanding base station environments where transient overvoltages may occur.

Does the BLC8G27LS-245AVJ require external matching networks for 2600 MHz operation?

No, the BLC8G27LS-245AVJ is internally matched for 50 Ω systems across 2500–2700 MHz. Its input return loss is −10 dB (typical) at 56 W output, and load-pull data confirms optimal ZL values (e.g., 1.0 − j4.5 Ω for main device at 2600 MHz), allowing direct integration without discrete matching components in standard Doherty demo layouts.

How does the BLC8G27LS-245AVJ support digital pre-distortion (DPD) implementation?

The BLC8G27LS-245AVJ is designed for low memory effects and exhibits 110 MHz typical video bandwidth in Doherty configuration. Its consistent AM-AM/AM-PM behavior across 2500–2700 MHz enables stable DPD coefficient convergence, achieving <−50 dBc residual ACPR after linearization - a key requirement for modern 4G/5G base station transceivers using real-time DPD.

What is the thermal resistance from junction to case (Rth(j-c)) for the BLC8G27LS-245AVJ?

The BLC8G27LS-245AVJ has a typical thermal resistance from junction to case (Rth(j-c)) of 0.3 K/W, measured at Tcase = 80 °C, PL = 56 W, VDS = 28 V, IDq = 500 mA (main), and VGS(amp)peak = 0.5 V. This value reflects its optimized SOT1251-2 air-cavity flanged package and enables reliable 240 W peak power operation with appropriate heatsinking.

Is the BLC8G27LS-245AVJ RoHS compliant and qualified for industrial temperature operation?

Yes, the BLC8G27LS-245AVJ is compliant with Directive 2002/95/EC (RoHS) and rated for storage temperatures from −65 °C to +150 °C and junction temperatures up to +225 °C. Its specifications are validated across Tcase = 25 °C to 80 °C, making it suitable for industrial-grade base station equipment deployed in uncontrolled outdoor enclosures.

BLC8G27LS-245AVJ Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
SOT-1251-2
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
LDMOS
Configuration:
Dual, Common Source
Frequency:
2.5GHz ~ 2.69GHz
Gain:
14.5dB
Voltage - Test:
28 V
Current Rating (Amps):
-
Noise Figure:
-
Current - Test:
500 mA
Power - Output:
56W
Voltage - Rated:
65 V
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-DFM

BLC8G27LS-245AVJ FAQ

1.How can I place an order for BLC8G27LS-245AVJ through Aetrix?

Please submit a Request for Quotation (RFQ) for BLC8G27LS-245AVJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BLC8G27LS-245AVJ reliable?

The price and inventory of BLC8G27LS-245AVJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BLC8G27LS-245AVJ is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BLC8G27LS-245AVJ transactions.

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4.How is shipping managed for BLC8G27LS-245AVJ?

BLC8G27LS-245AVJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BLC8G27LS-245AVJ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BLC8G27LS-245AVJ?

For technical support, including BLC8G27LS-245AVJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BLC8G27LS-245AVJ requirements.

6.How does Aetrix verify that BLC8G27LS-245AVJ is sourced from the original manufacturer or authorized distributors?

All BLC8G27LS-245AVJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BLC8G27LS-245AVJ meets industry standards.

7.What is the process for return or replacement of BLC8G27LS-245AVJ?

All BLC8G27LS-245AVJ units undergo pre-shipment inspection (PSI). If there is an issue with BLC8G27LS-245AVJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BLC8G27LS-245AVJ part is unused and in its original packaging.

Return procedure for BLC8G27LS-245AVJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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