NXP Semiconductors BLF4G20-110B,112
- Part No.:
- BLF4G20-110B,112
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- SOT-502A
- Datasheet:
-
BLF4G20-110B,112.pdf
- Description:
- RF MOSFET LDMOS 28V LDMOST
- Quantity:
- Payment:

- Shipping:

Inventory:2,761
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Product details
Overview
BLF4G20-110B from NXP Semiconductors (formerly Philips Semiconductors) is a 110 W UHF LDMOS power transistor designed for base station RF power amplification in the 1800–2000 MHz band. It delivers 48 W average output power in GSM EDGE mode at 1930–1990 MHz, with 13.8 dB gain, 38.5% drain efficiency, −61 dBc ACPR400, and 2.1% EVMrms under 28 V/650 mA bias.
For engineers reviewing the BLF4G20-110B datasheet, BLF4G20-110B pinout, BLF4G20-110B application, or BLF4G20-110B equivalent, this device is selected for high-power, broadband cellular infrastructure amplifiers requiring ruggedness under VSWR = 10:1 mismatch, thermal stability up to 200 °C junction temperature, and internally matched 50 Ω input/output impedance.
Technical Context
The BLF4G20-110B operates as a class-AB RF power amplifier stage in multicarrier GSM, EDGE, and CDMA base stations. Its LDMOS structure enables high gain (13.4–13.8 dB), low intermodulation distortion (IMD3 ≤ −29 dBc at 100 W), and robust load mismatch tolerance at 1990 MHz with 28 V supply and 650 mA quiescent current.
Thermally, it features a flanged ceramic SOT502A package with Rth(j-case) = 0.65–0.74 K/W at 100 W output, enabling stable operation at case temperatures up to 80 °C. Internally matched design eliminates external matching networks for standard 50 Ω systems, reducing board space and tuning complexity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 1800–2000 MHz - supports full PCS/GSM1800/UMTS2000 bands without retuning |
| Output Power (CW) | 110 W - peak envelope power capability for high-PAR signal handling |
| Drain Efficiency (GSM EDGE) | 38.5 % typ - reduces heat dissipation and DC power consumption in multichannel PA stages |
| ACPR400 | −61 dBc typ - meets stringent spectral mask requirements for 400 kHz offset in EDGE systems |
| Gain | 13.8 dB typ - enables single-stage amplification with minimal driver stage complexity |
| Junction Temp Limit | 200 °C - allows reliable operation under high ambient and thermal stress in outdoor cabinets |
| Rth(j-case) | 0.65 K/W min at 100 W - ensures efficient heat transfer to heatsink in compact macro-cell designs |
Pinout & Package
BLF4G20-110B uses the flanged ceramic SOT502A package with two mounting holes and two leads. The metal flange is electrically connected to the source terminal and serves as both thermal path and RF ground reference.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Drain | High-voltage RF output node; connects to output matching network and heatsink via flange |
| 2 | Gate | RF input control node; requires DC blocking and bias feed network; sensitive to ESD |
| 3 | Source | Common RF/DC return; tied directly to flange and system ground; defines reference for VGS |
Key Features
| Feature | Design Value |
|---|---|
| Internally matched | 50 Ω input/output impedance - eliminates discrete matching components and calibration steps |
| Ruggedness | VSWR = 10:1 tolerance at full 110 W CW - sustains operation during antenna fault conditions without failure |
| Thermal stability | Positive temperature coefficient of gain - prevents thermal runaway in parallel PA configurations |
| GSM EDGE linearity | 2.1 % EVMrms at 48 W AV - meets 3GPP TS 45.005 Class I/II error vector magnitude limits |
| ESD protection | HBM Class 1B (≥2 kV) - requires handling per ESD-sensitive device protocols during assembly |
Applications
| GSM Base Station PA | EDGE Multicarrier Amplifier |
|---|---|
Use Scenario: High-power final stage in 1800 MHz GSM macro base stations supporting 8–12 TRXs per sector. IC Role / Device Role / Timing Role: RF power transistor delivering 48 W average output in class-AB mode with 28 V supply and 650 mA quiescent current. Use Value: Enables single-transistor PA architecture with >38% efficiency and −61 dBc ACPR, reducing cooling and power supply overhead. |
Use Scenario: Linearized PA stage in 1900–1990 MHz EDGE base stations using digital pre-distortion (DPD). IC Role / Device Role / Timing Role: Main amplifying element operating at 1930–1990 MHz with 2.1% EVMrms and −74 dBc ACPR600. Use Value: Meets 3GPP spectral and modulation accuracy requirements while maintaining 13.8 dB gain for DPD loop stability. |
| CDMA Cellular Infrastructure | UHF Broadband Repeater PA |
Use Scenario: Final PA in CDMA2000 1xRTT base stations operating across 1850–1990 MHz band. IC Role / Device Role / Timing Role: High-efficiency LDMOS transistor delivering 110 W PEP with <−29 dBc IMD3 at 100 W average. Use Value: Supports wide instantaneous bandwidth and low adjacent-channel interference in multi-code CDMA signals. |
Use Scenario: Output stage in bidirectional UHF repeaters deployed in rural coverage extension systems. IC Role / Device Role / Timing Role: Rugged, thermally stable power amplifier capable of continuous operation at 80 °C case temperature. Use Value: Withstands indefinite VSWR = 10:1 loads and maintains performance over extended outdoor service life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BLF4G20S-110B | Same die, earless flanged SOT502B package - no mounting holes, reduced mechanical rigidity | Suitable for lower-vibration indoor or lab environments; not rated for outdoor cabinet mounting | Select BLF4G20-110B for field-deployed macro base stations requiring mechanical stability and heatsink clamping. |
| MRF6V2150N | 150 W GaN HEMT, 1805–2200 MHz, higher gain (15.5 dB), but requires external matching and gate bias sequencing | Better suited for next-gen massive MIMO active antennas where size and efficiency outweigh matching complexity | Choose BLF4G20-110B when leveraging existing LDMOS PCB layouts, proven thermal management, and simplified biasing. |
Compared with BLF4G20S-110B, the BLF4G20-110B offers superior mechanical mounting and thermal interface reliability; compared with MRF6V2150N, it trades peak power and bandwidth for plug-and-play integration, ruggedness, and lower system-level design risk in legacy GSM/EDGE deployments.
Availability
BLF4G20-110B is available at Aetrix Electronics and suitable for GSM base station transceivers, EDGE multicarrier amplifiers, and CDMA infrastructure equipment requiring stable component supply, long-lifecycle support, and traceable sourcing for telecom OEMs.
Supply support for BLF4G20-110B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and communications markets, with deep heritage in RF power technology inherited from Philips.
The BLF4G20-110B belongs to NXP's UHF LDMOS power transistor family, engineered specifically for high-reliability, high-efficiency cellular infrastructure amplifiers operating in the 1800–2000 MHz band.
FAQ
What is the maximum drain-source voltage rating for BLF4G20-110B?
The BLF4G20-110B has an absolute maximum drain-source voltage (VDS) rating of 65 V, as specified in the limiting values table. This rating ensures safe operation under transient voltage spikes and load mismatch conditions common in base station PA stages. Exceeding 65 V risks permanent breakdown of the LDMOS channel. The device is typically operated at 28 V DC supply in production circuits.
Does BLF4G20-110B require external impedance matching networks?
No, the BLF4G20-110B is internally matched to 50 Ω at both input and output, eliminating the need for external matching components in standard 50 Ω systems. This simplifies PCB layout, reduces component count, and improves production yield. However, fine-tuning may be applied for specific frequency sub-bands or harmonic suppression requirements.
What is the thermal resistance from junction to case for BLF4G20-110B at 100 W output?
At 100 W output power and Tcase = 80 °C, the BLF4G20-110B exhibits a typical thermal resistance Rth(j-case) of 0.65 K/W, with a maximum of 0.74 K/W. This low thermal resistance enables effective heat transfer to the heatsink, supporting continuous operation in high-ambient environments typical of outdoor base station cabinets.
How does BLF4G20-110B perform under load mismatch conditions?
The BLF4G20-110B is characterized for ruggedness under extreme VSWR = 10:1 load mismatch at all phase angles, at 28 V supply, 650 mA quiescent current, 110 W CW output, and 1990 MHz. This capability ensures continued operation during antenna faults or cable damage without device failure-critical for carrier-grade base station reliability.
Is BLF4G20-110B suitable for CDMA2000 1xRTT base station applications?
Yes, the BLF4G20-110B is explicitly listed for CDMA base station applications in its official product profile. At 1930–1990 MHz, it achieves −29 dBc third-order intermodulation (IMD3) and −39.5 dBc fifth-order (IMD5) distortion at 100 W average output, meeting CDMA2000 spectral purity requirements while delivering 38.5% drain efficiency.
BLF4G20-110B,112 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- SOT-502A
- Packaging:
- Tray
- Product Status:
- Obsolete
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 1.93GHz ~ 1.99GHz
- Gain:
- 13.5dB
- Voltage - Test:
- 28 V
- Current Rating (Amps):
- 12A
- Noise Figure:
- -
- Current - Test:
- 700 mA
- Power - Output:
- 100W
- Voltage - Rated:
- 65 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- LDMOST
BLF4G20-110B,112 FAQ
1.How can I place an order for BLF4G20-110B,112 through Aetrix?
Please submit a Request for Quotation (RFQ) for BLF4G20-110B,112 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BLF4G20-110B,112 reliable?
The price and inventory of BLF4G20-110B,112 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BLF4G20-110B,112 is usually 5 days.
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Once your BLF4G20-110B,112 order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for BLF4G20-110B,112?
For technical support, including BLF4G20-110B,112 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BLF4G20-110B,112 requirements.
6.How does Aetrix verify that BLF4G20-110B,112 is sourced from the original manufacturer or authorized distributors?
All BLF4G20-110B,112 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BLF4G20-110B,112 meets industry standards.
7.What is the process for return or replacement of BLF4G20-110B,112?
All BLF4G20-110B,112 units undergo pre-shipment inspection (PSI). If there is an issue with BLF4G20-110B,112, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BLF4G20-110B,112 part is unused and in its original packaging.
Return procedure for BLF4G20-110B,112:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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