NXP Semiconductors BLF6G15L-40BRN,112
- Part No.:
- BLF6G15L-40BRN,112
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- SOT-1112A
- Datasheet:
-
BLF6G15L-40BRN,112.pdf
- Description:
- RF MOSFET LDMOS 28V CDFM6
- Quantity:
- Payment:

- Shipping:

Inventory:82
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BLF6G15L-40BRN from NXP Semiconductors is a 40 W LDMOS power transistor designed for base station RF power amplification in the 1450–1550 MHz band, operating at 28 V supply with 330 mA quiescent drain current, delivering 2.5 W average output power, 22.0 dB power gain, and −45 dBc adjacent channel power ratio under 2-carrier W-CDMA conditions.
For engineers reviewing the BLF6G15L-40BRN datasheet, BLF6G15L-40BRN pinout, BLF6G15L-40BRN application, or BLF6G15L-40BRN equivalent, this device supports critical design tasks including broadband PA stage selection, thermal management planning for 1.6 K/W junction-to-case resistance, ruggedness validation against VSWR = 10:1 load mismatch, and integration of integrated current sense functionality in macrocell infrastructure.
Technical Context
This LDMOS transistor operates in class-AB mode with internally matched input/output impedances (e.g., ZS = 3.2 − j6.3 Ω, ZL = 4.6 − j4.5 Ω at 1480 MHz), enabling simplified matching network design. Its gate-source threshold voltage (1.4–2.4 V) and forward transconductance (2.7–4.3 S) support stable biasing across temperature and process variation.
Ruggedness is validated for VSWR = 10:1 under CW conditions at 28 V, 330 mA, and 30 W output - confirming suitability for real-world antenna mismatch scenarios. Integrated ESD protection and sense terminals (pins 4/5 for drain sense, 6/7 for gate sense) enable precise current monitoring and robust system-level fault detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 1450–1550 MHz - fully specified broadband operation for W-CDMA bands without retuning |
| Average Output Power | 2.5 W - verified under 2-carrier W-CDMA test model 1 (PAR = 7.5 dB, 0.01% CCDF) |
| Power Gain | 22.0 dB - measured at 2.5 W output, enabling compact multi-stage PA architectures |
| Drain Efficiency | 13.0 % - defined at 2.5 W output, informing thermal budget and power supply sizing |
| ACPR | −45 dBc - adjacent channel power ratio at 5 MHz offset, meeting 3GPP spectral mask requirements |
| Junction-to-Case Thermal Resistance | 1.6 K/W - enables direct heatsink mounting with predictable temperature rise at 2.5 W dissipation |
| Quiescent Drain Current | 330 mA - factory-trimmed IDq supports stable class-AB bias without external adjustment |
| Drain-Source Breakdown Voltage | 65 V - provides 2.3× margin over 28 V rail, supporting transient voltage tolerance |
Pinout & Package
BLF6G15L-40BRN uses a flanged ceramic SOT1112A package with 6 leads and two mounting holes, optimized for high-power RF thermal dissipation and mechanical stability in base station amplifier modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | drain | Main RF power output path; connected to flange for thermal conduction and RF grounding |
| 2 | gate | RF input control terminal; requires DC blocking and impedance matching network |
| 3 | source | Common reference node for main transistor; tied to ground plane via low-inductance path |
| 4, 5 | sense drain | Current-sensing taps for closed-loop bias control and protection circuitry |
| 6, 7 | sense gate | Gate voltage monitoring points enabling adaptive gate bias compensation |
Key Features
| Feature | Design Value |
|---|---|
| Internally matched broadband operation | Eliminates need for external input/output matching networks across 1450–1550 MHz |
| Integrated current sense terminals | Enables real-time drain current monitoring without shunt resistors or additional PCB area |
| VSWR = 10:1 ruggedness | Guarantees survival under worst-case antenna mismatch without derating or shutdown logic |
| ESD protection | Prevents damage during handling and assembly; no external TVS required on gate line |
| RoHS-compliant flanged ceramic package | SOT1112A meets environmental compliance while providing superior thermal conductivity vs. plastic packages |
Applications
| Macrocell Base Station PA | Multi-Carrier W-CDMA Amplifier |
|---|---|
Use Scenario: High-reliability outdoor macrocell site amplifying up to four carriers in 1450–1550 MHz band with dynamic traffic loading. IC Role / Device Role / Timing Role: Final-stage RF power amplifier transistor delivering 2.5 W per carrier under 3GPP-compliant modulation. Use Value: Integrated sense terminals and VSWR = 10:1 ruggedness reduce need for complex protection circuitry and field returns. |
Use Scenario: Indoor distributed antenna system (DAS) head-end unit combining multiple W-CDMA carriers before transmission. IC Role / Device Role / Timing Role: Linear broadband PA core maintaining −45 dBc ACPR across 5 MHz carrier spacing. Use Value: Internally matched impedance simplifies combiner interface design and improves intermodulation performance. |
| Remote Radio Head (RRH) | Test Equipment Driver Stage |
Use Scenario: Compact remote radio head requiring high thermal efficiency and minimal footprint in temperature-constrained enclosures. IC Role / Device Role / Timing Role: Primary PA element operating at 28 V with 1.6 K/W Rth(j-case) for direct heatsink coupling. Use Value: Flanged ceramic SOT1112A package delivers 30% lower thermal resistance than comparable plastic LDMOS devices. |
Use Scenario: Production-line RF signal generator output stage validating W-CDMA transmitter compliance per 3GPP TS 25.104. IC Role / Device Role / Timing Role: Stable, repeatable 2.5 W output source with known gain and spectral purity for calibration. Use Value: Factory-characterized 22.0 dB gain and −45 dBc ACPR eliminate need for per-unit gain compensation in test fixtures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BLF6G22LS-130 | Higher frequency range (1920–2170 MHz); 130 W P1dB; same SOT1112A package | Targets LTE Band 2/25 uplink; not suitable for 1450–1550 MHz without retuning | Select when operating above 1800 MHz; avoid for BLF6G15L-40BRN's native band |
| MRF6V2300NB | 2300 MHz center frequency; 300 W P1dB; different flange package (SOT-1227A); no integrated sense terminals | Designed for 2.3 GHz TD-LTE; lacks current sense capability and 1450–1550 MHz optimization | Choose only if migrating to higher-frequency 2.3 GHz systems and accepting added bias complexity |
Compared with BLF6G15L-40BRN, BLF6G22LS-130 offers higher power but shifts frequency coverage upward, while MRF6V2300NB trades integrated sensing and band-specific linearity for raw output at 2.3 GHz - neither provides drop-in replacement capability due to frequency, sense architecture, or thermal interface differences.
Availability
BLF6G15L-40BRN is available at Aetrix Electronics and suitable for macrocell base stations, remote radio heads, and multi-carrier W-CDMA amplifier designs requiring stable component supply, long-lifecycle support, and traceable RoHS-compliant sourcing.
Supply support for BLF6G15L-40BRN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and communications markets, with deep expertise in RF power technologies.
The BLF6G15L-40BRN belongs to NXP's high-efficiency LDMOS RF transistor product line, engineered specifically for 3G/4G base station infrastructure demanding ruggedness, linearity, and thermal reliability in continuous-wave and modulated operation.
FAQ
What is the maximum safe operating drain-source voltage for BLF6G15L-40BRN?
The absolute maximum drain-source voltage (VDS) for BLF6G15L-40BRN is 65 V, as specified in Table 4 of the datasheet. This rating ensures safe operation under transient conditions when biased at the recommended 28 V supply, providing 2.3× voltage headroom to prevent breakdown during switching events or mismatch-induced voltage spikes.
Does BLF6G15L-40BRN include built-in ESD protection?
Yes, BLF6G15L-40BRN integrates on-chip ESD protection, explicitly stated in Section 1.2 "Features and benefits". This eliminates the need for external gate-protection diodes in standard handling and assembly environments, though caution remains necessary per the CAUTION note regarding electrostatic discharge sensitivity during transport.
Can BLF6G15L-40BRN be used in single-carrier W-CDMA applications?
Yes, BLF6G15L-40BRN supports single-carrier W-CDMA operation, with documented PARO (output peak-to-average ratio) of 6.0 dB at 10 W average output in Table 8. Its broadband 1450–1550 MHz design and class-AB characteristics ensure linear performance across both single- and multi-carrier configurations without hardware change.
What is the thermal resistance from junction to case for BLF6G15L-40BRN?
The typical thermal resistance from junction to case (Rth(j-case)) for BLF6G15L-40BRN is 1.6 K/W, measured at Tcase = 80 °C and PL = 2.5 W (CW), as given in Table 5. This value enables accurate heatsink sizing and junction temperature prediction under real-world operating conditions.
How many pins does BLF6G15L-40BRN have, and what are their functions?
BLF6G15L-40BRN has seven physical terminals: pins 1 (drain), 2 (gate), 3 (source), plus dual sense terminals - pins 4 and 5 (sense drain) and pins 6 and 7 (sense gate). As shown in Table 2, pins 4–7 provide redundant sensing paths for precision bias control and fault detection in high-reliability base station amplifiers.
BLF6G15L-40BRN,112 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- SOT-1112A
- Packaging:
- Tube
- Product Status:
- Active
- Technology:
- LDMOS
- Configuration:
- Dual, Common Source
- Frequency:
- 1.47GHz ~ 1.51GHz
- Gain:
- 22dB
- Voltage - Test:
- 28 V
- Current Rating (Amps):
- 11A
- Noise Figure:
- -
- Current - Test:
- 330 mA
- Power - Output:
- 2.5W
- Voltage - Rated:
- 65 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- CDFM6
BLF6G15L-40BRN,112 FAQ
1.How can I place an order for BLF6G15L-40BRN,112 through Aetrix?
Please submit a Request for Quotation (RFQ) for BLF6G15L-40BRN,112 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BLF6G15L-40BRN,112 reliable?
The price and inventory of BLF6G15L-40BRN,112 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BLF6G15L-40BRN,112 is usually 5 days.
3.What payment methods are accepted for BLF6G15L-40BRN,112?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BLF6G15L-40BRN,112 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BLF6G15L-40BRN,112?
BLF6G15L-40BRN,112 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BLF6G15L-40BRN,112 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BLF6G15L-40BRN,112?
For technical support, including BLF6G15L-40BRN,112 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BLF6G15L-40BRN,112 requirements.
6.How does Aetrix verify that BLF6G15L-40BRN,112 is sourced from the original manufacturer or authorized distributors?
All BLF6G15L-40BRN,112 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BLF6G15L-40BRN,112 meets industry standards.
7.What is the process for return or replacement of BLF6G15L-40BRN,112?
All BLF6G15L-40BRN,112 units undergo pre-shipment inspection (PSI). If there is an issue with BLF6G15L-40BRN,112, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BLF6G15L-40BRN,112 part is unused and in its original packaging.
Return procedure for BLF6G15L-40BRN,112:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BLF6G15L-40BRN,112 Tags

-
3SK294(TE85L,F)
Toshiba Semiconductor and Storage
-
SAV-551+
Mini-Circuits

-
TAV2-501+
Mini-Circuits

-
CE3514M4-C2
CEL

-
AFT05MS004NT1
NXP USA Inc.
-
SAV-541+
Mini-Circuits

-
CE3512K2-C1
CEL

-
AFM907NT1
NXP Semiconductors

-
SKY65050-372LF
Skyworks Solutions Inc.

-
CE3520K3-C1
CEL

-
AFT09MS007NT1
NXP USA Inc.

-
AFT09MS015NT1
NXP USA Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
