NXP Semiconductors BLF888BS,112
- Part No.:
- BLF888BS,112
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- SOT-539B
- Datasheet:
-
BLF888BS,112.pdf
- Description:
- RF MOSFET LDMOS 50V SOT539B
- Quantity:
- Payment:

- Shipping:

Inventory:15
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BLF888BS,112 from NXP Semiconductors is a 650 W UHF LDMOS RF power transistor designed for broadcast and industrial transmitter applications in the 470–860 MHz band. It delivers 120 W average output power at 858 MHz under DVB-T (8k OFDM) conditions, with 21 dB power gain, 33 % drain efficiency, and −31 dBc intermodulation distortion shoulder. Its ruggedness supports high-reliability digital modulation schemes including DVB-T.
For engineers reviewing the BLF888BS,112 datasheet, BLF888BS,112 pinout, BLF888BS,112 application, or BLF888BS,112 equivalent, this page provides verified thermal resistance (0.15 K/W), broadband impedance data (Zi/ZL across 300–1000 MHz), PAR handling (8.2 dB at 0.01 % CCDF), and flanged ceramic SOT539B package details - all critical for UHF PA design, thermal management, and matching network synthesis.
Technical Context
The BLF888BS,112 is a balanced dual-gate/dual-drain LDMOS transistor optimized for class-AB operation in common-source configurations. It features internal input matching for broadband gain stability and operates at VDS = 50 V with IDq = 1.3 A quiescent current, supporting both narrowband (860 MHz 2-tone) and broadband DVB-T waveforms.
Its push-pull architecture enables high-power linear amplification with measured IMDshldr of −31 dBc and PAR of 8.2 dB in DVB-T mode. Thermal performance is defined by Rth(j-c) = 0.15 K/W under RF load, enabling robust operation up to Tj = 200 °C with case temperature maintained at 80 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Average Output Power | 120 W at 858 MHz (DVB-T 8k OFDM); sufficient for full-power UHF terrestrial broadcast transmitters |
| Power Gain | 21 dB typical at 858 MHz; enables compact driver-stage design with minimal cascaded stages |
| Drain Efficiency | 33 % at 858 MHz (DVB-T); reduces heat dissipation requirements vs. lower-efficiency alternatives |
| Intermodulation Distortion | −31 dBc shoulder suppression at 858 MHz; meets spectral mask requirements for DVB-T compliance |
| Peak-to-Average Ratio | 8.2 dB at 0.01 % CCDF probability; supports high-PAR OFDM signals without clipping or compression |
| Junction-to-Case Thermal Resistance | 0.15 K/W; allows direct mounting to heatsink with predictable thermal rise under 125 W average load |
| Operating Frequency Range | 470–860 MHz broadband; covers entire UHF TV band (channels 14–69) without retuning |
Pinout & Package
SOT539B is an earless flanged balanced ceramic package with 4 leads and metal flange thermally/electrically connected to source (Pin 5). The flange requires mechanical mounting and electrical grounding for optimal RF performance and thermal conduction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Drain 1 | High-current RF output terminal; symmetric with Pin 2 for balanced push-pull operation |
| 2 | Drain 2 | High-current RF output terminal; paired with Pin 1 to enable differential output matching |
| 3 | Gate 1 | RF input control terminal; internally matched for broadband 470–860 MHz operation |
| 4 | Gate 2 | RF input control terminal; electrically isolated from Gate 1 but matched identically for balance |
| 5 | Source | Common reference node; connected directly to flange for low-inductance grounding and thermal path |
Key Features
| Feature | Design Value |
|---|---|
| Broadband Operation | 470–860 MHz coverage with stable gain and efficiency - eliminates need for band-switching networks in multi-channel transmitters |
| Internal Input Matching | Integrated matching network per gate reduces external component count and layout sensitivity in 50 Ω systems |
| Thermal Robustness | Rth(j-c) = 0.15 K/W enables >125 W continuous operation with standard heatsink designs |
| Ruggedness | Withstands VSWR ≥ 10:1 under full power - critical for antenna mismatch tolerance in broadcast environments |
| RoHS Compliance | Meets Directive 2002/95/EC; suitable for environmentally regulated broadcast infrastructure deployments |
Applications
| UHF Broadcast Transmitter | DVB-T Terrestrial Transmitter |
|---|---|
Use Scenario: High-power final stage amplifier in 8k OFDM-based digital TV broadcast transmitters operating in channels 14–69 (470–860 MHz). IC Role / Device Role / Timing Role: Primary RF power amplification device delivering 120 W average output with linearized DVB-T waveform fidelity. Use Value: −31 dBc IMDshldr and 8.2 dB PAR handling ensure compliance with ETSI EN 300 744 spectral masks and adjacent channel leakage requirements. |
Use Scenario: Multi-carrier OFDM amplifier in regional DVB-T headend transmitters requiring broadband linearity and thermal stability. IC Role / Device Role / Timing Role: Balanced LDMOS transistor configured in common-source class-AB topology for high-efficiency signal amplification. Use Value: 21 dB gain and 33 % efficiency reduce driver stage complexity and cooling subsystem size versus lower-gain alternatives. |
| Industrial RF Heating | UHF Wireless Infrastructure |
Use Scenario: Solid-state RF generator for industrial heating systems operating at 850–860 MHz in material processing and plasma generation. IC Role / Device Role / Timing Role: High-reliability power stage delivering continuous RF energy with ruggedness against load variations and thermal cycling. Use Value: 200 °C max junction temperature and 0.15 K/W thermal resistance support unattended 24/7 operation in enclosed industrial enclosures. |
Use Scenario: High-power repeater or gap-filler amplifier in public safety or private wireless UHF networks (e.g., TETRA, P25). IC Role / Device Role / Timing Role: Linear RF PA core enabling clean amplification of complex modulated signals (π/4-DQPSK, C4FM) without spectral regrowth. Use Value: Measured −34 dBc third-order IMD in 2-tone testing ensures low adjacent-channel interference in dense spectrum deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar UHF LDMOS power amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BLF888B,112 | SOT539A package with two mounting holes; identical electrical specs but mechanically distinct flange interface | Requires different heatsink hole pattern; same RF performance and thermal behavior | Select BLF888B,112 when existing PCB/mechanical design accommodates flanged SOT539A mounting |
| MRF8S21100HR5 | 100 W PAV at 2.1 GHz; higher frequency range (1.8–2.2 GHz), lower power, different biasing (VGS = −0.5 V) | Not suitable for UHF broadcast; intended for cellular infrastructure, not DVB-T | Choose only for 2.1 GHz LTE base station applications - not a functional substitute for BLF888BS,112 in UHF broadcast |
Compared with BLF888BS,112, the BLF888B,112 offers identical RF and thermal performance in a mechanically compatible but non-interchangeable flanged package, while the MRF8S21100HR5 serves a different frequency band and power class entirely - making BLF888BS,112 uniquely suited for 470–860 MHz broadcast-grade amplification.
Availability
BLF888BS,112 is available at Aetrix Electronics and suitable for UHF broadcast transmitters, DVB-T infrastructure, industrial RF heating systems, and public safety wireless repeaters requiring stable component supply and long-term production continuity.
Supply support for BLF888BS,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in high-performance RF power solutions for broadcast, industrial, and communications infrastructure.
The BLF888BS,112 belongs to NXP's UHF LDMOS transistor product line, engineered specifically for high-efficiency, high-linearity amplification in digital terrestrial television and industrial RF systems operating between 470 MHz and 860 MHz.
FAQ
What is the maximum junction temperature rating for BLF888BS,112?
The BLF888BS,112 has a maximum junction temperature (Tj) rating of 200 °C, as specified in Table 4 of the NXP datasheet. This high thermal limit supports reliable operation in high-power UHF transmitter applications where sustained RF loading generates significant heat. Proper heatsinking using the flanged SOT539B package is required to maintain safe junction temperatures during continuous operation.
Does BLF888BS,112 require external input matching components?
No, BLF888BS,112 incorporates internal input matching optimized for broadband operation from 470 MHz to 860 MHz. As stated in Section 1.2, it is "designed for broadband operation" with "internal input matching for high gain and optimum broadband operation." This eliminates the need for external matching networks at the gate inputs, simplifying PCB layout and improving consistency across frequency bands.
What is the typical drain efficiency of BLF888BS,112 in DVB-T mode?
The BLF888BS,112 achieves a typical drain efficiency (ηD) of 33 % at 858 MHz under DVB-T (8k OFDM) conditions with 120 W average output power and VDS = 50 V, as confirmed in Table 7 of the datasheet. This efficiency level balances linearity and thermal output, enabling practical thermal management in broadcast transmitter final stages.
Is BLF888BS,112 RoHS compliant?
Yes, BLF888BS,112 is compliant with the Restriction of Hazardous Substances (RoHS) Directive 2002/95/EC, as explicitly stated in Section 1.2 ("Features and benefits") of the NXP datasheet. This compliance ensures suitability for environmentally regulated broadcast infrastructure and industrial equipment deployed in EU and other RoHS-aligned markets.
How does the thermal resistance of BLF888BS,112 compare to similar UHF power transistors?
BLF888BS,112 has a typical junction-to-case thermal resistance (Rth(j-c)) of 0.15 K/W, measured under RF conditions at Tcase = 80 °C and PL(AV) = 125 W (Table 5). This value is among the lowest in its class, enabling superior heat transfer to the heatsink compared to alternatives like the MRF8S21100HR5 (Rth(j-c) ≈ 0.35 K/W), directly supporting higher average power capability and longer lifetime.
BLF888BS,112 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- SOT-539B
- Packaging:
- Bulk
- Product Status:
- Active
- Technology:
- LDMOS (Dual), Common Source
- Configuration:
- 2 N-Channel
- Frequency:
- 470MHz ~ 860MHz
- Gain:
- 21dB
- Voltage - Test:
- 50 V
- Current Rating (Amps):
- 2.8µA
- Noise Figure:
- -
- Current - Test:
- 1.3 A
- Power - Output:
- 650W
- Voltage - Rated:
- 104 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- SOT539B
BLF888BS,112 FAQ
1.How can I place an order for BLF888BS,112 through Aetrix?
Please submit a Request for Quotation (RFQ) for BLF888BS,112 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BLF888BS,112 reliable?
The price and inventory of BLF888BS,112 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BLF888BS,112 is usually 5 days.
3.What payment methods are accepted for BLF888BS,112?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BLF888BS,112 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BLF888BS,112?
BLF888BS,112 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BLF888BS,112 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BLF888BS,112?
For technical support, including BLF888BS,112 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BLF888BS,112 requirements.
6.How does Aetrix verify that BLF888BS,112 is sourced from the original manufacturer or authorized distributors?
All BLF888BS,112 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BLF888BS,112 meets industry standards.
7.What is the process for return or replacement of BLF888BS,112?
All BLF888BS,112 units undergo pre-shipment inspection (PSI). If there is an issue with BLF888BS,112, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BLF888BS,112 part is unused and in its original packaging.
Return procedure for BLF888BS,112:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BLF888BS,112 Tags

-
3SK294(TE85L,F)
Toshiba Semiconductor and Storage
-
SAV-551+
Mini-Circuits

-
TAV2-501+
Mini-Circuits

-
CE3514M4-C2
CEL

-
AFT05MS004NT1
NXP USA Inc.
-
SAV-541+
Mini-Circuits

-
CE3512K2-C1
CEL

-
AFM907NT1
NXP Semiconductors

-
SKY65050-372LF
Skyworks Solutions Inc.

-
CE3520K3-C1
CEL

-
AFT09MS007NT1
NXP USA Inc.

-
AFT09MS015NT1
NXP USA Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
