Texas Instruments BQ2204APN
- Part No.:
- BQ2204APN
- Manufacturer:
- Texas Instruments
- Category:
- Controllers
- Package:
- 16-DIP (0.300", 7.62mm)
- Datasheet:
-
BQ2204APN.pdf
- Description:
- IC SRAM NONVOLTILE CNTRLR 16-DIP
- Quantity:
- Payment:

- Shipping:

Inventory:3,886
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Product details
Overview
BQ2204APN from Texas Instruments is a CMOS SRAM nonvolatile controller unit that converts up to four banks of standard CMOS SRAM into battery-backed nonvolatile memory. It provides power-fail detection (VPFD = 4.62 V typical), <10 ns CE propagation delay, and dual 3V primary-cell backup inputs (BC1/BC2) for industrial data retention in systems like programmable logic controllers and real-time clocks.
For engineers reviewing the BQ2204APN datasheet, BQ2204APN pinout, BQ2204APN application, or BQ2204APN equivalent, key selection criteria include its 5V supply operation with 5% tolerance, THS-selectable power-fail threshold, conditioned CE outputs (CECON1–CECON4), and support for hardware-based SRAM bank decoding via A/B inputs.
Technical Context
The BQ2204APN implements a precision comparator-based power-fail detection circuit with user-selectable VPFD (4.62 V at THS = VSS or 4.37 V at THS = VCC). Its internal switching logic routes VOUT to BC1 or BC2 based on voltage comparison with VBSO = 0.4 V typical, enabling sequential battery use without manual intervention.
During power-down, CECON outputs are forced high within tWPT = 100 µs typical after VCC falls below VPFD, unconditionally write-protecting SRAM. During power-up, CECON outputs remain inactive for tCER = 120 ms max after VCC exceeds VPFD to ensure processor stabilization before memory access resumes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Supply | 4.75–5.5 V; supports 5% tolerance operation with THS tied to VSS |
| VPFD Threshold | 4.62 V typical; triggers SRAM write-protection when main supply drops out-of-tolerance |
| tCED Propagation Delay | <10 ns; enables high-speed transparent CE pass-through during valid power operation |
| VOUT Switching | Automatically selects higher-voltage BC1 or BC2 input; VBSO = 0.4 V ensures reliable battery handover |
| tCER Recovery Time | 120 ms max; guarantees SRAM remains write-protected during processor boot stabilization |
| Backup Input Range | 2.0–4.0 V per BC1/BC2; compatible with standard 3V lithium primary cells |
| IOUT Capability | 160 mA max at VOUT; sufficient to drive multiple SRAM banks during backup mode |
Pinout & Package
Package: 16-pin narrow-body PDIP (Plastic Dual In-line Package), 0.3-inch width, commercial temperature range (0°C to 70°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | +5 V main supply input | Power source for logic and control circuitry; monitored for VPFD detection |
| VSS | Ground reference | Common return path for all internal circuits and I/O pins |
| CE | Chip-enable active-low input | Primary enable signal passed through decoder to one CECON output during power-valid operation |
| A, B | Decoder address inputs | Select which of four CECON outputs is activated; typically connected to high-order address lines |
| CECON1–CECON4 | Conditioned chip-enable outputs | Drive SRAM CE pins; forced high during power failure to write-protect memory banks |
| BC1, BC2 | 3 V primary backup cell inputs | Accept non-rechargeable lithium batteries; internal comparator selects higher-voltage source |
| THS | Threshold select input | Tied to VSS for 5% VPFD (4.62 V) or to VCC for 10% VPFD (4.37 V) |
| VOUT | Backup supply output | Switches between BC1 and BC2; powers SRAM VCC pins and CECON pull-ups during backup mode |
| NC | No-connect terminals | Pins 8, 11, and 13 are unused; must be left floating or grounded per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Hardware-based SRAM bank decoding | Two-input A/B logic selects one of four CECON outputs-eliminates need for external address decoders |
| Automatic battery switchover | Voltage comparison between BC1 and BC2 with 0.4 V hysteresis enables hot-swap replacement of primary cells |
| Controlled write-protection timing | tWPT = 100 µs ensures memory cycles complete before protection engages, preventing data corruption |
| Power-up stabilization hold | tCER = 120 ms prevents premature SRAM access during microcontroller initialization sequences |
| Configurable power-fail threshold | THS pin allows system-level tuning of VPFD between 4.62 V and 4.37 V to match supply tolerance requirements |
Applications
| Industrial PLC Data Retention | Real-Time Clock Backup |
|---|---|
Use Scenario: Programmable logic controller retains configuration and process variables during AC mains interruption. IC Role / Device Role / Timing Role: BQ2204APN monitors 5V rail and switches SRAM banks to lithium backup when VPFD is crossed. Use Value: Ensures deterministic write-protection within 100 µs and sustained VOUT delivery at 160 mA to preserve volatile memory state. | Use Scenario: Embedded RTC module maintains timekeeping and alarm registers during main power loss. IC Role / Device Role / Timing Role: BQ2204APN isolates RTC SRAM using CECON outputs and supplies VOUT from BC1/BC2 during brownout. Use Value: Eliminates software-based backup management; hardware-controlled switchover avoids clock drift or register corruption. |
| Medical Device Configuration Storage | Point-of-Sale Transaction Logging |
Use Scenario: Diagnostic equipment stores calibration coefficients and user preferences across power cycles. IC Role / Device Role / Timing Role: BQ2204APN conditions CE signals to four SRAM banks containing calibration tables and audit logs. Use Value: Dual BC inputs allow scheduled battery replacement without service downtime; VBSO hysteresis prevents oscillation during marginal voltage transitions. | Use Scenario: Retail terminal logs sales transactions in SRAM before committing to flash, requiring guaranteed write integrity during outage. IC Role / Device Role / Timing Role: BQ2204APN forces CECON outputs high before VCC drops below VPFD, halting writes to prevent partial record corruption. Use Value: <10 ns CE propagation delay ensures no timing margin violation during normal operation; tCER hold prevents premature resume after recovery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM nonvolatile controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS1230Y-120 | 5V-only NV SRAM with integrated lithium battery; no external SRAM support or multi-bank decoding | Self-contained solution for single-bank memory; lacks BC1/BC2 switchover and A/B decoding | Choose DS1230Y-120 when compactness and simplicity outweigh flexibility in bank count and battery management. |
| MAX690A | Microprocessor supervisory circuit with reset generation and watchdog; no SRAM CE conditioning or VOUT switching | Provides power monitoring and reset assertion only; cannot replace SRAM backup functionality of BQ2204APN | Choose MAX690A only as supplemental supervision; pairing with discrete logic is required to replicate BQ2204APN's full feature set. |
Compared with DS1230Y-120 and MAX690A, the BQ2204APN uniquely integrates hardware-based four-bank SRAM decoding, dual-primary-cell switchover, and conditioned CE outputs-making it the only direct solution for scalable, field-serviceable nonvolatile memory expansion in industrial control systems.
Availability
BQ2204APN is available at Aetrix Electronics and suitable for industrial PLC data retention, real-time clock backup, and medical device configuration storage requiring stable component supply and long-term obsolescence support.
Supply support for BQ2204APN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and consumer markets.
The BQ2204APN belongs to TI's legacy battery-management and nonvolatile memory controller product line, designed specifically to enable robust, hardware-governed SRAM backup in mission-critical industrial systems where firmware-based solutions introduce reliability risk.
FAQ
What is the function of the THS pin on the BQ2204APN?
The THS pin on the BQ2204APN selects the power-fail detection threshold: when tied to VSS, VPFD is 4.62 V typical for 5% supply tolerance; when tied to VCC, VPFD is 4.37 V typical for 10% tolerance. The BQ2204APN requires THS to be hard-wired to either VSS or VCC-floating or intermediate voltages cause undefined behavior and must be avoided in production designs.
How does the BQ2204APN manage dual backup batteries on BC1 and BC2?
The BQ2204APN continuously compares BC1 and BC2 voltages and routes VOUT to the higher source when their difference exceeds VBSO = 0.4 V. This automatic switchover allows one battery to be replaced while the other sustains memory retention. The BQ2204APN does not charge batteries and is intended only for non-rechargeable 3V lithium primary cells.
What happens to CECON outputs during power-up of the BQ2204APN?
After VCC rises above VPFD, the BQ2204APN holds CECON1–CECON4 inactive for tCER = 120 ms maximum-regardless of CE input state-to allow microcontroller stabilization. Only after this interval does the BQ2204APN resume transparent CE-to-CECON routing. This prevents spurious memory accesses during processor reset and boot sequences.
Can the BQ2204APN support more than four SRAM banks?
No-the BQ2204APN provides exactly four conditioned chip-enable outputs (CECON1–CECON4) and a two-input decoder (A/B), limiting hardware-based bank selection to four SRAM devices. Expanding beyond four banks requires cascading multiple BQ2204APN units or adding external decoding logic, which is not supported by the BQ2204APN's architecture or timing specifications.
Is the BQ2204APN pin-compatible with other members of the bq2204 family?
Yes-the BQ2204APN shares identical pinout and electrical behavior with BQ2204ASN (SOIC-16) and earlier bq2204 variants. All share the same 16-pin DIP/SOIC footprint, VCC/VSS placement, and functional assignment for CE, A, B, BC1, BC2, THS, VOUT, and CECON1–CECON4. Designers may substitute packages without PCB revision, provided thermal and layout constraints are met.
BQ2204APN Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 16-DIP (0.300", 7.62mm)
- Packaging:
- Bulk
- Product Status:
- Active
- Controller Type:
- Nonvolatile SRAM
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- 0°C ~ 70°C
- Mounting Type:
- Through Hole
- Supplier Device Package:
- 16-PDIP
BQ2204APN FAQ
1.How can I place an order for BQ2204APN through Aetrix?
Please submit a Request for Quotation (RFQ) for BQ2204APN on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BQ2204APN reliable?
The price and inventory of BQ2204APN are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BQ2204APN is usually 5 days.
3.What payment methods are accepted for BQ2204APN?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BQ2204APN transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BQ2204APN?
BQ2204APN orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BQ2204APN order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BQ2204APN?
For technical support, including BQ2204APN datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BQ2204APN requirements.
6.How does Aetrix verify that BQ2204APN is sourced from the original manufacturer or authorized distributors?
All BQ2204APN products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BQ2204APN meets industry standards.
7.What is the process for return or replacement of BQ2204APN?
All BQ2204APN units undergo pre-shipment inspection (PSI). If there is an issue with BQ2204APN, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BQ2204APN part is unused and in its original packaging.
Return procedure for BQ2204APN:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BQ2204APN Tags

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BQ2201SN-N
Texas Instruments

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DS1314S+
Analog Devices Inc./Maxim Integrated
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BQ2205LYPW
Texas Instruments
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MXD1210CSA+
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4RCD0232KC1ATG
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DS1312S-2+
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DS1314S-2+T&R
Analog Devices Inc./Maxim Integrated

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DS1321S+
Analog Devices Inc./Maxim Integrated

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DS1312S+
Analog Devices Inc./Maxim Integrated
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MXD1210ESA+
Analog Devices Inc./Maxim Integrated

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DS1321E+
Analog Devices Inc./Maxim Integrated
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