Texas Instruments BQ24351DSGT
- Part No.:
- BQ24351DSGT
- Manufacturer:
- Texas Instruments
- Category:
- Battery Management
- Package:
- 8-WFDFN Exposed Pad
- Datasheet:
-
BQ24351DSGT.pdf
- Description:
- IC BATT PROTECTION LI-ION 8WSON
- Quantity:
- Payment:

- Shipping:

Inventory:750
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BQ24351DSGT from Texas Instruments is an over-voltage and over-current charger protection IC with integrated charging FET and LDO-mode regulation. It provides input OVP (10.5 V), battery OVP (4.35 V), thermal shutdown (150 °C), 1 A load support, and 6.38 V regulated CHGIN output - deployed in Li-ion battery charging front-ends for mobile phones and low-power handheld devices.
For engineers reviewing the BQ24351DSGT datasheet, BQ24351DSGT pinout, BQ24351DSGT application, or BQ24351DSGT equivalent, this page delivers verified functional role, real-world protection thresholds, LDO-mode behavior, thermal response timing, and validated alternative options for portable power system design.
Technical Context
The BQ24351DSGT implements dual-stage protection logic: input voltage monitoring triggers fast OVP shutdown (tDGL(OVP) = 256 ms) after blanking time (tBLK(CHGIN) = 10 ms), while battery voltage sensing enables precise 4.35 V OVP with 250 mV hysteresis and 8.2 ms deglitch delay. Its integrated P-FET supports both pass-through operation and LDO-mode regulation of CHGIN to 6.38 V when ACIN exceeds VO(REG).
Control is host-driven via GATDRV pin, enabling dynamic gate control of the internal charging FET; sleep mode entry/exit thresholds (VSENTRY = 10–105 mV, VSEXIT = 24–160 mV) allow automatic diode-like behavior without external reverse-blocking components. Thermal shutdown activates at 150 °C with 20 °C hysteresis, ensuring safe recovery under sustained overload.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input OVP Threshold | 10.5 V ±0.3 V - disables ACIN-to-OUT path within 256 ms if exceeded, preventing damage to downstream analog baseband ICs. |
| Battery OVP Threshold | 4.35 V ±0.05 V - disconnects charging path when Li-ion cell voltage exceeds safe level, protecting cell integrity. |
| CHGIN LDO Output | 6.38 V ±0.13 V - regulates CHGIN pin voltage independent of ACIN above VO(REG), supplying stable power to host charger controller. |
| Max Load Current | 1 A - supports full-rate charging for single-cell Li-ion systems with integrated FET RDS(on) ≤ 685 mΩ (ACIN→OUT). |
| Thermal Shutdown | 150 °C ±10 °C - shuts down FETs until junction cools by ≥20 °C, preventing permanent thermal damage during sustained overload. |
| Sleep Mode Entry ΔV | VSENTRY = 10–105 mV below OUT - enables automatic reverse-blocking diode emulation without PCB layout changes. |
| Package | 2 mm × 2 mm WSON-8 (DSG) with exposed thermal pad - requires soldered ground connection for thermal dissipation and electrical stability. |
Pinout & Package
Package: 2 mm × 2 mm, 8-pin WSON (DSG) with exposed thermal pad electrically connected to GND. Requires PCB thermal vias and copper pour under pad per TI SLUA271 guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ACIN (Pins 1,2) | Power supply input | Dual-pin input for DC adapter; accepts 4.4–15 V; requires ≥1 µF ceramic capacitor to GND for OVP spike suppression. |
| GND (Pin 3) | Ground reference | Primary ground return; thermal pad must be soldered to same net for thermal management and noise immunity. |
| VBAT (Pin 4) | Battery voltage sense | Monitors pack+ through RBAT resistor (100–470 kΩ); connects to GND if battery OVP function disabled. |
| GATDRV (Pin 5) | Host gate drive input | Accepts voltage-controlled signal from host charger controller to modulate internal P-FET conduction. |
| CHGIN (Pin 6) | LDO-regulated output | Provides 6.38 V regulated supply to host controller; requires ≥1 µF bypass capacitor to GND. |
| OUT (Pins 7,8) | Charging system output | Dual-pin output to battery charging circuit; carries up to 1 A with integrated FET; tracks ACIN or regulates in LDO mode. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated charging FET | Eliminates need for external reverse-blocking diode and discrete FET, reducing BOM count and PCB area in portable chargers. |
| Soft-start / soft-stop | Controls inrush current during power-up and prevents voltage spikes during fault shutdown, minimizing ringing in adapter-cable LC networks. |
| Input OVP + OCP + Battery OVP | Three independent protection layers - 10.5 V input OVP, 1.2 A input OCP, and 4.35 V battery OVP - ensure robust safety across failure modes. |
| LDO-mode CHGIN regulation | Maintains stable 6.38 V supply to host controller even as ACIN varies from 5 V to 15 V, decoupling host operation from input fluctuations. |
| Sleep mode diode emulation | Automatically disables internal FETs when ACIN drops below VSENTRY, preventing reverse current flow without external components. |
Applications
| Mobile Phone Charging Front-End | Low-Power Handheld Device Protection |
|---|---|
Use Scenario: AC adapter plugged into smartphone during Li-ion charging, subject to input voltage spikes and thermal stress. IC Role / Device Role / Timing Role: Charger front-end protector monitoring ACIN and VBAT, enforcing OVP/OCP/Battery OVP, and regulating CHGIN for host PMIC. Use Value: Prevents 30 V input transients from damaging 5 V-rated analog baseband ICs; eliminates reverse-blocking diode loss to improve charge efficiency. |
Use Scenario: Portable medical monitor or Bluetooth headset requiring reliable, compact battery charging with fail-safe protection. IC Role / Device Role / Timing Role: Standalone protection IC placed between AC adapter and host charger IC, providing LDO-mode CHGIN and thermal shutdown. Use Value: Delivers 6.38 V stable supply to host controller under varying input; sleep mode enables automatic reverse-current blocking without firmware intervention. |
| Single-Cell Li-ion Power Path Management | Host-Controlled Charger Interface |
Use Scenario: Wearable device with tight space constraints needing minimal-component, high-reliability charging architecture. IC Role / Device Role / Timing Role: Integrated FET-based power path manager handling input-to-battery routing, OVP response (<256 ms), and thermal cutoff (150 °C). Use Value: Reduces component count vs. discrete FET + protection IC solutions; 2 mm × 2 mm package fits ultra-compact PCB layouts. |
Use Scenario: System where host processor dynamically adjusts charge parameters and requires protected auxiliary power rail. IC Role / Device Role / Timing Role: Gate-driven protection IC accepting GATDRV commands while delivering regulated CHGIN and monitoring battery health. Use Value: Enables host-level charge algorithm control while offloading critical safety functions (OVP/OCP/thermal) to dedicated hardware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar charger protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BQ24350DSGT | Omits LDO-mode CHGIN regulation; CHGIN pin is unregulated open-drain output. | Requires external LDO or regulator for host controller supply; suitable only when host has independent 5 V rail. | Select BQ24350DSGT only if CHGIN regulation is unnecessary and board space allows external regulation. |
| BQ24380DSGR | Higher input OVP threshold (16 V), supports 2-cell Li-ion (8.4 V), adds I2C interface and status flags. | Designed for multi-cell or programmable systems; not drop-in compatible due to different pinout and control protocol. | Choose BQ24380DSGR when upgrading to 2-cell packs or requiring digital configuration and fault reporting. |
Compared with BQ24351DSGT, BQ24350DSGT removes LDO functionality but retains identical protection thresholds and package, while BQ24380DSGR expands voltage range and adds digital control at the cost of increased complexity and non-interchangeable pin assignment.
Availability
BQ24351DSGT is available at Aetrix Electronics and suitable for mobile phone charging front-ends, low-power handheld device protection, and single-cell Li-ion power path management requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for BQ24351DSGT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in battery management and protection ICs.
The bq243xx family was designed specifically for Li-ion charger front-end protection in space-constrained portable electronics, integrating FET, OVP, OCP, battery OVP, and LDO-mode regulation into a single 2 mm × 2 mm package.
FAQ
What protection functions does the BQ24351DSGT provide?
The BQ24351DSGT provides input over-voltage protection (10.5 V), input over-current protection (1.2 A), battery over-voltage protection (4.35 V), thermal shutdown (150 °C), and output short-circuit protection. It also features soft-start and soft-stop to suppress inrush currents and voltage spikes. All protections are hardware-based and operate independently of host control, ensuring fail-safe operation even if the host system is unresponsive.
How does the LDO-mode operation of the BQ24351DSGT work?
The BQ24351DSGT regulates its CHGIN pin to 6.38 V when ACIN exceeds VO(REG) plus the RDS(on) drop of the internal FET - functioning as a low-dropout linear regulator. This provides a stable, protected power rail for the host charger controller regardless of ACIN variation between 5 V and 15 V. The LDO mode is automatic and requires no external components beyond the mandatory 1 µF CHGIN bypass capacitor.
Can the BQ24351DSGT replace a discrete protection FET and diode?
Yes - the BQ24351DSGT integrates a P-channel FET and replaces both the external reverse-blocking diode and discrete protection FET in typical Li-ion charger front-ends. Its sleep mode (VSENTRY/VSEXIT thresholds) emulates diode behavior automatically, eliminating forward voltage drop and associated power loss. No PCB layout changes are needed to adopt this integration, provided the 2 mm × 2 mm WSON footprint is accommodated.
What is the role of the VBAT pin on the BQ24351DSGT?
The VBAT pin on the BQ24351DSGT senses battery voltage for battery over-voltage protection. It must be connected to the battery pack positive terminal through a resistor (RBAT = 100–470 kΩ) to limit fault current in case of internal IC failure. If battery OVP is not required, the VBAT pin must be tied directly to GND - leaving it floating is prohibited per TI design guidelines.
Is the BQ24351DSGT RoHS compliant and what is its MSL rating?
Yes, the BQ24351DSGT is RoHS compliant with NIPDAUAG lead finish and carries a JEDEC MSL Level-2 rating (260 °C peak reflow, 1-year floor life). Its WSON-8 (DSG) package uses a moisture-sensitive plastic body requiring proper dry-pack handling and bake-before-reflow if exposed beyond floor life limits. Full compliance documentation is available in TI's official packaging addendum for BQ24351DSGT.
BQ24351DSGT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-WFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Battery Protection
- Battery Chemistry:
- Lithium Ion
- Number of Cells:
- -
- Fault Protection:
- Over Current, Over Temperature, Over/Under Voltage, Short Circuit
- Interface:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (2x2)
BQ24351DSGT FAQ
1.How can I place an order for BQ24351DSGT through Aetrix?
Please submit a Request for Quotation (RFQ) for BQ24351DSGT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BQ24351DSGT reliable?
The price and inventory of BQ24351DSGT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BQ24351DSGT is usually 5 days.
3.What payment methods are accepted for BQ24351DSGT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BQ24351DSGT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BQ24351DSGT?
BQ24351DSGT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BQ24351DSGT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BQ24351DSGT?
For technical support, including BQ24351DSGT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BQ24351DSGT requirements.
6.How does Aetrix verify that BQ24351DSGT is sourced from the original manufacturer or authorized distributors?
All BQ24351DSGT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BQ24351DSGT meets industry standards.
7.What is the process for return or replacement of BQ24351DSGT?
All BQ24351DSGT units undergo pre-shipment inspection (PSI). If there is an issue with BQ24351DSGT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BQ24351DSGT part is unused and in its original packaging.
Return procedure for BQ24351DSGT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BQ24351DSGT Tags

-
BQ29700DSER
Texas Instruments

-
S-8241ABKMC-GBKT2G
ABLIC Inc.

-
S-8241ABPMC-GBPT2G
ABLIC Inc.

-
BQ27427YZFR
Texas Instruments

-
BQ27426YZFR
Texas Instruments

-
STC3117IJT
STMicroelectronics

-
STC3115IJT
STMicroelectronics

-
BQ76925RGER
Texas Instruments

-
NPM1100-QDAA-R
Nordic Semiconductor ASA

-
BQ27441DRZR-G1A
Texas Instruments

-
STC3115AIQT
STMicroelectronics

-
S-8252AAL-M6T1U
ABLIC Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

