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Texas Instruments BQ24750RHDT
- Part No.:
- BQ24750RHDT
- Manufacturer:
- Texas Instruments
- Category:
- Battery Chargers
- Package:
- 28-VFQFN Exposed Pad
- Datasheet:
-
BQ24750RHDT.pdf
- Description:
- IC BAT CHG MULTCHEM 2-4CL 28VQFN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
BQ24750RHDT from Texas Instruments is a host-controlled, synchronous buck battery charger IC with integrated system power selector and AC overpower protection. It supports 2–4-cell Li+ batteries, delivers up to 10 A charge current using external NMOS-NMOS switches, achieves ±0.5% charge voltage accuracy, and operates across 5–24 V AC/DC adapter input - enabling compact, high-efficiency notebook and ultra-mobile computer power management.
For engineers reviewing the BQ24750RHDT datasheet, BQ24750RHDT pinout, BQ24750RHDT application, or BQ24750RHDT equivalent, this page provides verified technical context on dynamic power management (DPM), ratiometric DAC/GPIO programming of voltage/current limits, ACOP latch-off behavior, thermal shutdown at 155°C, and QFN-28 (5×5 mm) package integration for space-constrained embedded charging systems.
Technical Context
The BQ24750RHDT implements a synchronous buck topology with integrated 6-V gate drivers for high-side (HIDRV) and low-side (LODRV) NMOS FETs, operating at 300 kHz (240–360 kHz typical) with 30 ns minimum dead time and >95% efficiency. Its DPM loop dynamically reduces charge current when adapter input power approaches the ACOP-programmed limit, using a 20× gain current-sense amplifier (IADAPT) referenced to ACP/ACN.
It features dual independent power-path control: ACDRV drives the AC-to-system P-channel FET (with reverse-conduction protection), while BATDRV controls the battery-to-system P-channel FET. Ratiometric programming via VDAC enables precise regulation of charge voltage (4–4.512 V/cell), charge current (up to 10 A with 10-mΩ sense resistor), and adapter current limit - all configurable by resistor dividers or host DAC/GPIO.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 5–24 V - supports universal AC/DC adapters used in notebooks and portable medical devices. |
| Charge Voltage Accuracy | ±0.5% - ensures safe, precise Li+ cell termination without overvoltage stress. |
| Charge Current Accuracy | ±3% - maintains consistent battery capacity delivery under varying thermal conditions. |
| Adapter Current Sense Accuracy | ±3% - enables reliable DPM response to prevent AC adapter overload during simultaneous system + battery load. |
| Switching Frequency | 300 kHz typical - balances efficiency, EMI, and inductor size for portable applications. |
| Off-State Quiescent Current | 10 µA max - minimizes battery drain during system sleep or storage. |
| Thermal Shutdown Threshold | 155°C - protects internal circuitry and external FETs from thermal runaway. |
Pinout & Package
Package: 28-pin QFN (5 mm × 5 mm, RHD suffix), exposed PowerPad thermally and electrically connected to AGND/PGND star point.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CHGEN (1) | Active-low charge enable input | Direct hardware control to disable charging; logic low enables full charge cycle. |
| ACN / ACP (2–3) | Differential adapter current sense inputs | Connect across 10-mΩ shunt; feed 20× gain IADAPT amplifier for DPM feedback. |
| ACDRV (4) | AC-to-system switch driver output | Drives gate of P-channel ACFET; latches off if ACOP voltage exceeds 2 V. |
| ACDET (5) | Adapter presence detection threshold input | Resistor divider sets rising threshold at 2.4 V; enables bias when >0.6 V. |
| ACSET (6) | Ratiometric adapter current limit setpoint | Voltage ratio vs. VDAC programs DPM current limit; supports DAC or resistor programming. |
| ACOP (7) | AC overpower time-constant capacitor input | External ceramic cap sets duration before ACOP latch triggers at 2 V. |
| TS (8) | NTC thermistor sense input | Monitors battery temperature via resistor divider to VREF; enables hot/cold cutoff at 28.7–35.1% of VREF. |
| AGND (9) | Analog ground reference | Star-connected only at PowerPad; separates sensitive analog signals from high-current PGND. |
| VREF (10) | 3.3-V precision reference output | Stable 3.3 V ±1% supply for ratiometric programming and external ADC references. |
| VDAC (11) | Ratiometric programming reference input | Host-supplied or internal reference; defines scaling factor for VADJ, SRSET, ACSET voltages. |
| VADJ (12) | Ratiometric charge voltage setpoint | Voltage ratio vs. VDAC sets final charge voltage (e.g., 4.2 V/cell when tied to REGN). |
| ACGOOD (13) | Open-drain adapter present indicator | Pulled low when ACDET > 2.4 V; 10-ms delay ensures stable adapter detection. |
| BATDRV (14) | Battery-to-system switch driver output | Drives gate of P-channel BATFET; isolates battery from system when disabled. |
| IADAPT (15) | Adapter current sense amplifier output | 20× amplified (VACP – VACN); used directly by host MCU for real-time DPM monitoring. |
| SRSET (16) | Ratiometric charge current setpoint | Voltage ratio vs. VDAC sets charge current limit (e.g., 100 mV = 10 A with 10-mΩ sense). |
| BAT (17) | Battery remote sense positive input | Kelvin connection to pack+ terminal; eliminates PCB trace IR drop from regulation loop. |
| SRN / SRP (18–19) | Differential charge current sense inputs | Connect across 10-mΩ shunt; feed internal regulation loop for precise constant-current control. |
| CELLS (20) | Cell count selection input | Logic low = 3 cells, high = 4 cells, floating = 2 cells - configures voltage regulation range. |
| DPMDET (21) | Open-drain DPM active indicator | Pulled low when DPM loop is actively reducing charge current; 10-ms debounce. |
| PGND (22) | Power ground return | High-current return path for buck converter, FET sources, and input/output capacitors. |
| LODRV (23) | PWM low-side NMOS driver output | Drives gate of synchronous rectifier; paired with HIDRV and BTST bootstrap circuit. |
| REGN (24) | 6-V regulated supply for gate drivers | Provides 6 V ±5% for LODRV; feeds BTST via Schottky diode for HIDRV bootstrap. |
| PH (25) | Phase node connection | Connects to junction of low-side drain, high-side source, and inductor; critical for BTST bootstrap timing. |
| HIDRV (26) | PWM high-side NMOS driver output | Drives gate of upper FET; requires BTST bootstrap capacitor and REGN-fed Schottky. |
| BTST (27) | Bootstrap capacitor connection | 0.1-µF ceramic cap between BTST and PH enables high-side drive above PVCC rail. |
| PVCC (28) | Primary power supply input | Connected to common-source node of ACFET and reverse-blocking FET; powers internal logic and drivers. |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Power Management (DPM) | Reduces battery charge current in real time when adapter input power reaches programmed ACOP limit - prevents adapter overload during peak system + battery load. |
| AC Overpower Protection (ACOP) | Latches off ACDRV when ACOP pin voltage exceeds 2.05 V, triggered by sustained input power exceeding time-constant-set threshold - protects ACFET from thermal failure. |
| Ratiometric Programming Interface | VADJ, SRSET, and ACSET pins scale linearly to VDAC reference - enables precise, temperature-stable voltage/current regulation using either resistors or host DAC outputs. |
| Integrated Dual Power Path Control | Independent ACDRV and BATDRV drivers manage AC-to-system and battery-to-system FETs with break-before-make timing - ensures no shoot-through and seamless power source handoff. |
| High-Accuracy Sensing Architecture | 20× gain IADAPT amplifier and ±0.5% VBAT regulation with Kelvin BAT sensing - delivers repeatable charge termination and accurate system power budgeting. |
Applications
| Notebook Computer Power Management | Ultra-Mobile PC Battery Charging |
|---|---|
Use Scenario: Dual-input (AC adapter + battery) power system in thin-and-light notebooks requiring seamless source handoff and thermal-safe fast charging. IC Role / Device Role / Timing Role: Primary battery charger and system power selector; manages 3-cell Li+ packs at up to 10 A while regulating adapter input power via DPM. Use Value: Enables 95%+ conversion efficiency and ±0.5% voltage accuracy to extend runtime and prevent cell overvoltage - critical for UL62368-1 compliance. |
Use Scenario: Compact UMPC with limited PCB area, requiring minimal external components for multi-chemistry support and adapter current limiting. IC Role / Device Role / Timing Role: Host-controlled charger with GPIO/DAC programmability; supports Li+, NiMH, and lead-acid chemistries via ratiometric VADJ/SRSET configuration. Use Value: Reduces BOM count by integrating compensation, soft-start, and 6-V gate drivers - eliminates need for external op-amps or discrete FET drivers. |
| Portable Medical Diagnostic Equipment | Battery Bay Charger Systems |
Use Scenario: Portable ultrasound or blood analyzer with battery backup, requiring precise charge termination and thermal qualification before charging. IC Role / Device Role / Timing Role: Safety-critical charger with TS thermistor interface, 155°C thermal shutdown, and ±2% input current sense accuracy for DPM reliability. Use Value: Ensures battery qualification within safe temperature window (e.g., 0–45°C) and prevents overheating during field use - meets IEC 60601-1 leakage and thermal requirements. |
Use Scenario: Hot-swappable battery bay in industrial handhelds, where battery must be charged independently while system remains powered from AC. IC Role / Device Role / Timing Role: System power selector with independent BATDRV/ACDRV control; isolates battery during charging while powering system from adapter. Use Value: Supports concurrent system operation and battery charging without voltage droop or source contention - eliminates need for external OR-ing controllers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar battery charger with system power selection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BQ24725ARHDT | Lower 6-A max charge current; no ACOP latch; 200-kHz fixed frequency; lacks TS thermistor input. | Suitable for cost-sensitive 2-cell notebooks without thermal qualification or overpower latching. | Select when ACOP latching and 4-cell support are not required; lower thermal design margin needed. |
| BQ24780SRHDT | Supports 1–4 cells; adds SMBus interface; includes integrated 12-bit ADC for telemetry; 350-kHz switching. | Required for host firmware-based charge profile adaptation and real-time telemetry in premium mobile platforms. | Choose when digital control, battery health monitoring, or dynamic profile updates are mandatory. |
Compared with BQ24750RHDT, BQ24725ARHDT offers reduced feature set and lower current capability but lower cost, while BQ24780SRHDT adds digital interface and telemetry at higher complexity - BQ24750RHDT remains optimal for analog-programmed, latch-protected, high-current 3–4-cell notebook charging.
Availability
BQ24750RHDT is available at Aetrix Electronics and suitable for notebook computers, ultra-mobile PCs, portable medical diagnostics equipment, and battery bay chargers requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for BQ24750RHDT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies with over 50 years of innovation in energy-efficient electronics.
The BQ24750RHDT belongs to TI's bq247xx family of host-controlled multi-chemistry battery chargers, designed specifically for space-constrained, high-efficiency portable computing and medical devices requiring integrated power-path selection and robust safety features.
FAQ
What is the maximum supported battery cell count for the BQ24750RHDT?
The BQ24750RHDT supports 2-, 3-, or 4-cell Li+ battery configurations. Cell count is selected via the CELLS pin: logic low programs 3 cells, logic high programs 4 cells, and floating selects 2 cells. The device regulates charge voltage from 8 V to 18.048 V accordingly, maintaining ±0.5% accuracy across the full range. This flexibility allows single-BOM designs for multiple product SKUs.
How does the AC Overpower Protection (ACOP) feature work in the BQ24750RHDT?
The BQ24750RHDT implements ACOP by monitoring the voltage on the ACOP pin, which is charged by an internal current source proportional to (VPVCC − VACP). When ACOP voltage exceeds 2.05 V, ACDRV latches off to disconnect the AC adapter from the system. The latch resets only upon toggling ACDET or triggering PVCC UVLO - ensuring persistent protection until fault condition clears. An external capacitor on ACOP sets the time constant before latch activation.
Can the BQ24750RHDT be programmed using only resistors, without a host microcontroller?
Yes, the BQ24750RHDT supports fully resistor-based programming. VADJ, SRSET, and ACSET pins accept voltage dividers referenced to VREF (3.3 V) or VDAC to set charge voltage, charge current, and adapter current limit respectively. For example, connecting VADJ to REGN (6 V) configures default 4.2 V/cell; using 432 kΩ and 66.5 kΩ resistors achieves 4.35 V/cell. No host MCU or DAC is required for basic operation.
What is the purpose of the PH and BTST pins on the BQ24750RHDT?
The PH pin connects to the phase node (junction of low-side drain, high-side source, and inductor), while BTST connects to the bootstrap capacitor (0.1 µF) between BTST and PH. Together with REGN and a Schottky diode, they enable high-side NMOS gate drive above the PVCC rail. This bootstrap architecture allows efficient synchronous buck operation without requiring a floating supply - critical for >95% efficiency at 300 kHz.
Does the BQ24750RHDT include thermal protection, and what is its trip point?
Yes, the BQ24750RHDT includes integrated thermal shutdown protection that activates at 155°C (rising threshold) with 20°C hysteresis. When junction temperature exceeds this limit, all switching and gate drivers disable immediately to prevent damage. The device resumes normal operation only after temperature falls below 135°C. This protection is independent of external components and is validated across process/voltage corners per TI's production test flow.
BQ24750RHDT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 28-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Battery Chemistry:
- Multi-Chemistry
- Number of Cells:
- 2 ~ 4
- Current - Charging:
- Constant - Programmable
- Programmable Features:
- -
- Fault Protection:
- Over Current, Over Voltage
- Charge Current - Max:
- 10A
- Battery Pack Voltage:
- 18.048V (Max)
- Voltage - Supply (Max):
- 24V
- Interface:
- -
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-VQFN (5x5)
BQ24750RHDT FAQ
1.How can I place an order for BQ24750RHDT through Aetrix?
Please submit a Request for Quotation (RFQ) for BQ24750RHDT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BQ24750RHDT reliable?
The price and inventory of BQ24750RHDT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BQ24750RHDT is usually 5 days.
3.What payment methods are accepted for BQ24750RHDT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BQ24750RHDT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BQ24750RHDT?
BQ24750RHDT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BQ24750RHDT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BQ24750RHDT?
For technical support, including BQ24750RHDT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BQ24750RHDT requirements.
6.How does Aetrix verify that BQ24750RHDT is sourced from the original manufacturer or authorized distributors?
All BQ24750RHDT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BQ24750RHDT meets industry standards.
7.What is the process for return or replacement of BQ24750RHDT?
All BQ24750RHDT units undergo pre-shipment inspection (PSI). If there is an issue with BQ24750RHDT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BQ24750RHDT part is unused and in its original packaging.
Return procedure for BQ24750RHDT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BQ24750RHDT Tags
-
BQ21040DBVR
Texas Instruments
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MCP73812T-420I/OT
Microchip Technology
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MCP73831T-2ACI/OT
Microchip Technology
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MCP73831T-2ATI/OT
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MCP73831T-5ACI/OT
Microchip Technology
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MCP73832T-2ACI/MC
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