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Texas Instruments BQ25960YBGR

Part No.:
BQ25960YBGR
Manufacturer:
Texas Instruments
Category:
Battery Chargers
Package:
36-XFBGA, DSBGA
Datasheet:
AetrixBQ25960YBGR.pdf
Description:
I2C CONTROLLED 1-CELL 8-A SWITCH
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,916

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Product details

Overview

BQ25960YBGR from Texas Instruments is an I²C-controlled, single-cell Li-ion switched-capacitor parallel battery charger delivering 8-A peak charging current with 98.1% peak efficiency. It implements dual-phase switched-cap architecture (2× input voltage, 2× output current), integrated 5-A bypass mode (21-mΩ RDS(on)), dual-input power mux control, and 16-bit ADC-based monitoring of voltage, current, and temperature. It enables high-efficiency fast charging in space-constrained smartphone and tablet platforms.

For engineers reviewing the BQ25960YBGR datasheet, BQ25960YBGR pinout, BQ25960YBGR application, or BQ25960YBGR equivalent, key selection criteria include its 8-A switched-cap charge capability, 5-A bypass mode performance, dual-input source arbitration, integrated protection thresholds (BUSOVP up to 12.75 V, BATOVP 3.49–4.76 V), and DSBGA-36 package compatibility with fine-pitch mobile PCB layouts.

Technical Context

The BQ25960YBGR uses a patented dual-phase switched-capacitor topology where each phase operates with synchronous flying-capacitor switching at 500 kHz, enabling input-to-battery voltage doubling and current halving across the adapter cable. Its architecture reduces required input capacitance and minimizes thermal stress on external components.

It integrates a dual-input power mux controller driving external N-FETs for source selection during fast charge or USB OTG/reverse TX mode, while supporting standalone single-input operation without external FETs. All protection functions-including BUSOCP, BATOCP, TSBAT_FLT, TSBUS_FLT, and TDIE_FLT-are independently configurable via I²C registers and trigger interrupt-driven host response.

Key Specifications

Parameter Value and Actual Design Meaning
Peak Efficiency98.1% - Enables minimal thermal dissipation at 8-A charge, critical for thin mobile enclosures.
Switched-Cap Charge Current8 A - Delivers full CC/CV charging cycle when paired with main charger (e.g., BQ2561x) for complete battery management.
Bypass Mode Current5 A - Supports backward-compatible 5-V adapter charging via internal 21-mΩ conduction path, eliminating need for external switch.
Input Voltage RangeUp to 12.75 V (switched-cap), 20 V (no external ACFET) - Accommodates USB PD 3.0 and proprietary fast-charge adapters.
ADC Resolution16-bit - Provides precise real-time monitoring of bus/battery voltage/current and dual temperature sensors (TSBAT/TSBUS) for closed-loop safety control.
Protection Threshold AccuracyBUSOVP ±50 mV, BATOVP ±44 mV, IBUSOCP ±153 mA - Ensures reliable fault detection under varying load and temperature conditions.
PackageDSBGA-36 (2.55 mm × 2.55 mm) - Optimized for ultra-compact smartphone motherboard integration with 0.4-mm pitch.

Pinout & Package

Package: 36-pin DSBGA (YBG), 2.55 mm × 2.55 mm body size, 0.4-mm ball pitch, bottom-side thermal pad.

Pin/Terminal Circuit Role Design Meaning
VAC1 / VAC2Dual-input adapter detection inputsEnable independent sourcing from two USB-C ports; support automatic priority selection and reverse TX mode via I²C control.
VBUS / VOUTMain power input/output railsVBUS accepts up to 20 V input; VOUT supplies regulated system power and battery charging path-decoupled by 22-µF ceramic capacitors.
BATP / BATN_SRPBattery voltage and current sensing terminalsHigh-accuracy differential sensing interface for battery voltage (±44 mV accuracy) and bidirectional current measurement using external 2-mΩ sense resistor.
CFH1 / CFH2 / CFL1 / CFL2Flying capacitor connectionsEach pair (CFH1/CFL1, CFH2/CFL2) forms one switched-cap phase; supports 1–3 × 22-µF ceramics per phase for ripple and efficiency optimization.
SCL / SDA / INTI²C interface and interrupt outputStandard 1.8-V I²C bus (up to 1 MHz) with open-drain INT for asynchronous fault reporting (e.g., BUSOVP, TDIE_FLT, TSBAT_FLT).
TSBAT_SYNCOUT / TSBUSTemperature sensor analog inputsAccept NTC-based voltage dividers to monitor battery pack and USB connector temperature with ±1.5% fault accuracy over 0–50% VREGN range.

Key Features

Feature Design Value
Dual-phase switched-cap architectureReduces input cable current by 50% versus linear or buck chargers-enabling thinner cables and lower connector temperature rise in smartphones.
Integrated 5-A bypass modeEliminates need for external high-current switches; 21-mΩ RDS(on) ensures <105 mW conduction loss at 5 A, supporting legacy 5-V fast-charge compatibility.
Dual-input power mux controllerDrives external N-FETs for seamless source arbitration between two USB-C ports-enabling simultaneous charging + OTG or redundant input paths.
Programmable protection suiteConfigurable thresholds for BUSOVP/BUSOCP/BATOVP/BATOCP/TSBAT/TSBUS/TDIE with independent interrupt masking-enables adaptive safety policies per OEM use case.
16-bit integrated ADCMeasures 9 parameters (VBUS, IBUS, VBAT, IBAT, VOUT, TSBAT, TSBUS, TDIE, VAC1/2) with selectable sample rates (3–24 ms) and resolution (10–15 bits).

Applications

Smartphone Fast Charging Tablet Dual-Source Power Management

Use Scenario: High-power USB-C PD charging in sub-8mm-thin flagship smartphones with thermal constraints.

IC Role / Device Role / Timing Role: Parallel switched-cap charger co-operating with primary buck charger (e.g., BQ25619) to deliver 8-A CC phase while minimizing board-level heat generation.

Use Value: 98.1% peak efficiency and 50% reduced cable current enable full 0–100% charge in <25 minutes without exceeding 45°C surface temperature.

Use Scenario: Large-format tablets supporting simultaneous charging from dock + USB-C port while powering display and compute subsystems.

IC Role / Device Role / Timing Role: Dual-input power mux controller managing priority between AC adapter and portable power bank, with seamless handover during plug/unplug events.

Use Value: Integrated BUSUCP/BUSRCP detection prevents boost-back and enables <100-ms source switchover-ensuring uninterrupted system runtime during adapter transitions.

USB OTG Reverse Power Delivery Thermally Constrained Wearable Charging

Use Scenario: Smartphone acting as power source for peripherals (keyboard, SSD) via USB-C while maintaining battery health.

IC Role / Device Role / Timing Role: Reverse TX mode controller using internal power path FETs to regulate 5-V VBUS output from battery with current limiting and thermal foldback.

Use Value: Bypass-mode conduction path and programmable IBUSOCP allow safe 1.5-A reverse delivery with real-time TSBUS monitoring to prevent connector overheating.

Use Scenario: Compact AR glasses requiring rapid top-up charging without thermal throttling in sealed enclosure.

IC Role / Device Role / Timing Role: Primary switched-cap charger operating at 5-A with optimized CFLY count (2 × 22 µF) to balance efficiency (>97.2%) and footprint.

Use Value: DSBGA-36 package and integrated 16-bit ADC enable closed-loop thermal management-limiting junction temperature to ≤120°C even at 45°C ambient.

Equivalent & Alternatives

The following parts are listed as comparable options for similar switched-cap parallel battery charger applications.

Alternative Part Technical Difference Application Difference Selection Advice
BQ25970YFFR56-pin WQFN (9.5 mm² die), no bypass mode, higher 8-A recommendation but lacks 5-A direct-path capability.Targeted at newer platforms with dedicated 9-V/12-V PD adapters; requires external bypass switch for 5-V compatibility.Select when prioritizing higher integration density and dual-phase-only operation without legacy 5-V adapter support.
BQ25968YFFR56-pin WQFN (9.5 mm² die), same package footprint as BQ25970 but limited to 6-A max switched-cap current and no bypass mode.Suitable for mid-tier tablets where peak charge rate and thermal headroom are less aggressive than flagship smartphones.Choose when cost-sensitive designs require proven TI switched-cap architecture but do not need 8-A or bypass functionality.

Compared with BQ25960YBGR, BQ25970YFFR offers smaller die area and higher pin count but removes bypass mode-requiring external circuitry for 5-V adapter compatibility. BQ25968YFFR trades peak current and feature set for lower cost, making it appropriate only where 6-A charge and absence of bypass are acceptable design constraints.

Availability

BQ25960YBGR is available at Aetrix Electronics and suitable for smartphone fast charging, tablet dual-source power management, and USB OTG reverse power delivery requiring stable component supply, long-term lifecycle assurance, and automotive-grade traceability.

Supply support for BQ25960YBGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of leadership in battery management ICs for mobile and portable electronics.

The BQ25960YBGR belongs to TI's BQ25xxx switched-capacitor charger family, designed specifically to address thermal and efficiency bottlenecks in high-current smartphone/tablet charging systems while maintaining compatibility with existing USB-C infrastructure.

FAQ

What is the maximum supported input voltage for BQ25960YBGR in switched-cap mode?

The BQ25960YBGR supports up to 12.75 V input voltage in switched-cap mode, as specified in its BUSOVP_RANGE parameter. This allows compatibility with USB PD 3.0 extended power range (EPR) adapters and proprietary high-voltage fast-charge protocols. Operation above 12.75 V requires external ACFET protection per datasheet Section 7.1.

Does BQ25960YBGR support true 8-A charging continuously, and what thermal conditions apply?

Yes, BQ25960YBGR delivers continuous 8-A switched-cap charging with 98.1% peak efficiency, validated at VBAT = 4.0 V and TJ ≤ 120°C. Its DSBGA-36 package has RθJA = 54.8°C/W; sustained 8-A operation requires ≥2-layer PCB with thermal vias to inner ground plane and ≥2 cm² copper pour under the device per layout guidelines in Section 11.

How does the dual-input mux function work in BQ25960YBGR, and can it be used without external FETs?

The BQ25960YBGR's dual-input mux controller drives external N-FETs (ACFET1/RBFET1 and ACFET2/RBFET2) via ACDRV1/ACDRV2 pins for source arbitration. However, it also supports single-input operation: if only VAC1 is used, ACDRV2 is grounded and VAC2 tied to VBUS-eliminating need for external FETs while retaining full I²C configurability and protection.

What is the role of the 16-bit ADC in BQ25960YBGR, and which measurements does it support?

The integrated 16-bit ADC in BQ25960YBGR provides real-time, calibrated measurements of eight critical parameters: VAC1/VAC2, VVBUS, VVOUT, VBAT, IBUS, IBAT, TSBAT, TSBUS, and TDIE. It supports selectable conversion times (3–24 ms) and resolution (10–15 bits), enabling host MCU to implement dynamic charge profiling and thermal derating without external sensors.

Can BQ25960YBGR operate in standalone mode without I²C communication?

No-BQ25960YBGR requires I²C initialization to configure critical functions including charge enable, protection thresholds, ADC settings, and input source selection. While basic power-up occurs with default register values, safe and functional operation (including 8-A charging and bypass mode) mandates host I²C control per Section 8.4 of the datasheet.

BQ25960YBGR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
36-XFBGA, DSBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Battery Chemistry:
Lithium Ion
Number of Cells:
1
Current - Charging:
Constant - Programmable
Programmable Features:
Current, Timer
Fault Protection:
Over Current, Over Temperature, Over Voltage, Reverse Current
Charge Current - Max:
8A
Battery Pack Voltage:
4V
Voltage - Supply (Max):
12V
Interface:
I2C
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
36-DSBGA (2.63x2.46)

BQ25960YBGR FAQ

1.How can I place an order for BQ25960YBGR through Aetrix?

Please submit a Request for Quotation (RFQ) for BQ25960YBGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BQ25960YBGR reliable?

The price and inventory of BQ25960YBGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BQ25960YBGR is usually 5 days.

3.What payment methods are accepted for BQ25960YBGR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BQ25960YBGR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BQ25960YBGR?

BQ25960YBGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BQ25960YBGR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BQ25960YBGR?

For technical support, including BQ25960YBGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BQ25960YBGR requirements.

6.How does Aetrix verify that BQ25960YBGR is sourced from the original manufacturer or authorized distributors?

All BQ25960YBGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BQ25960YBGR meets industry standards.

7.What is the process for return or replacement of BQ25960YBGR?

All BQ25960YBGR units undergo pre-shipment inspection (PSI). If there is an issue with BQ25960YBGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BQ25960YBGR part is unused and in its original packaging.

Return procedure for BQ25960YBGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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