Texas Instruments BQ296106DSGR
- Part No.:
- BQ296106DSGR
- Manufacturer:
- Texas Instruments
- Category:
- Battery Management
- Package:
- 8-WFDFN Exposed Pad
- Datasheet:
-
BQ296106DSGR.pdf
- Description:
- IC BATT PROT LI-ION 2-4CEL 8WSON
- Quantity:
- Payment:

- Shipping:

Inventory:1,537
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BQ296106DSGR from Texas Instruments is a high-accuracy, low-power overvoltage protector IC for 2–4 series Li-ion battery packs, featuring factory-programmed 4.45V OVP threshold, 6.5s fixed delay timer, ±10mV OVP accuracy, 3.3V regulated output (2mA max), and 8-pin WSON (2mm × 2mm) package. It monitors each cell independently and drives external FETs to blow fuses during overvoltage faults in notebook PC battery protection circuits.
For engineers reviewing the BQ296106DSGR datasheet, BQ296106DSGR pinout, BQ296106DSGR application, or BQ296106DSGR equivalent, this page delivers verified technical context, real-world timing behavior, regulator self-disable logic, leakage-critical cell-sense interface details, and validated alternative options for battery pack secondary protection design.
Technical Context
The BQ296106DSGR implements independent per-cell voltage monitoring using precision analog comparators referenced to a factory-trimmed 4.45V overvoltage threshold with 300mV hysteresis. Upon detection of any cell exceeding VOV, a non-adjustable 6.5s internal timer initiates before asserting the active-high OUT signal to trigger external fuse-blowing circuitry.
Its integrated 3.3V regulated supply delivers up to 2mA while incorporating self-disable functionality: if any sensed cell voltage drops below the factory-set 2.8V undervoltage threshold for 6s, REG automatically shuts down to prevent battery drain-re-enabling only after all cells exceed 2.8V + 300mV hysteresis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| OVP Threshold | Factory-programmed 4.45V ±10mV at 25°C; enables precise secondary overvoltage cutoff before cell degradation |
| OVP Delay Timer | Fixed 6.5s delay before OUT assertion; prevents false triggers from transient spikes while allowing safe charger response time |
| Regulated Output | 3.3V ±30mV at 500µA load; powers RTC or microcontroller sleep circuits without external LDO |
| Supply Current (REG on) | 4–8µA across –40°C to +110°C; minimizes quiescent drain during long-term battery storage |
| Cell Input Leakage | <100nA per Vx pin; preserves cell balance and avoids measurement error in high-impedance sensing networks |
| Operating Temp Range | –40°C to +110°C ambient; supports operation inside sealed battery packs under thermal stress |
| Package | 8-pin WSON (2.0mm × 2.0mm, 0.5mm pitch); enables compact placement adjacent to cell tabs in space-constrained battery modules |
Pinout & Package
8-pin WSON package (2.00mm × 2.00mm body, 0.5mm pitch), thermally enhanced with exposed pad connected to VSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power supply input | Unregulated input (3–20V); connects to top of battery stack; requires RC filter for noise immunity |
| VSS | Ground reference | IC ground and negative terminal of lowest cell; must be connected first during assembly to avoid REG damage |
| V1–V4 | Cell voltage sense inputs | Differential inputs for cells 1–4; each requires 1kΩ/0.1µF RC filter; unused pins shorted to adjacent lower pin |
| OUT | Overvoltage fault output | CMOS active-high signal; drives NMOS gate to short fuse to ground and blow protection circuit |
| REG | Regulated supply output | 3.3V output (0–2mA); requires 0.47µF ceramic capacitor to VSS; self-disables if any cell <2.8V for 6s |
Key Features
| Feature | Design Value |
|---|---|
| Per-cell overvoltage monitoring | Independent sensing of V1–VSS, V2–V1, V3–V2, V4–V3 enables accurate fault isolation in stacked configurations |
| Factory-programmed OVP | 4.45V threshold with ±10mV accuracy eliminates external resistor network and calibration overhead |
| Self-disabling regulated output | Automatic REG shutdown when any cell falls below 2.8V prevents deep discharge and extends pack shelf life |
| Ultra-low leakage inputs | <100nA per sense pin maintains cell voltage integrity and avoids imbalance in multi-cell systems |
| Customer Test Mode (CTM) | Accelerated 15ms OVP delay verification during production test without full 6.5s wait time |
Applications
| Notebook PC Battery Packs | Ultrabook Power Management |
|---|---|
Use Scenario: Secondary overvoltage protection in slim-profile Li-ion battery modules where primary protection resides in the fuel gauge IC. IC Role / Device Role / Timing Role: Standalone OVP monitor that asserts active-high OUT after 6.5s delay to trigger fuse-blowing FETs upon cell voltage >4.45V. Use Value: Prevents thermal runaway by cutting power path before cell voltage reaches dangerous levels, meeting UL 2054 requirements. |
Use Scenario: Regulated 3.3V supply for always-on RTC and wake-up controller in battery-backed suspend-to-RAM states. IC Role / Device Role / Timing Role: Dual-function device providing both fault signaling and stable bias for low-power peripherals during deep sleep. Use Value: Eliminates need for separate LDO, reducing BOM count and PCB area while maintaining 2mA drive capability. |
| Medical Portable Devices | UPS Battery Backup Systems |
Use Scenario: Safety-critical overvoltage cutoff in certified medical battery packs where failure modes must be rigorously controlled. IC Role / Device Role / Timing Role: Second-level hardware protector independent of firmware; uses analog comparator and fixed timer for deterministic response. Use Value: Meets IEC 62368-1 fault tolerance requirements via ±10mV OVP accuracy and 300mV hysteresis to prevent chatter. |
Use Scenario: Overvoltage supervision during AC charger recovery in off-grid UPS systems with 3-series or 4-series Li-ion banks. IC Role / Device Role / Timing Role: Monitors individual cell voltages during bulk charge phase and disables charging path if any cell exceeds 4.45V. Use Value: Enables safe recharging after grid outage without requiring host MCU intervention or complex communication protocols. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar overvoltage protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BQ296113DSGR | 3.0s OVP delay, 4.35V threshold, same 3.3V REG output and WSON-8 package | Suitable for faster-response systems where 6.5s delay is excessive, e.g., high-current fast-charging designs | Select when shorter fault-clearing latency is required without changing layout or regulator interface |
| BQ296202DSGR | Same 4.45V OVP and 6.5s delay, but 3.3V REG with tighter 3.087–3.213V tolerance (vs. BQ2961's 3.234–3.366V) | Better suited for noise-sensitive RTC loads requiring tighter regulation; shares identical pinout and footprint | Choose for improved output stability in EMI-prone environments, with no PCB changes needed |
Compared with BQ296106DSGR, BQ296113DSGR reduces OVP response latency by 3.5s for aggressive charge termination, while BQ296202DSGR improves REG output tolerance by ±63mV-critical for precision oscillator biasing-without altering mechanical or electrical integration.
Availability
BQ296106DSGR is available at Aetrix Electronics and suitable for notebook PC battery packs, ultrabook power management subsystems, and medical portable device secondary protection requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for BQ296106DSGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies with decades of battery safety IC expertise.
The BQ296xxx family was designed specifically for secondary overvoltage protection in multi-cell Li-ion battery packs, delivering factory-trimmed accuracy, ultra-low quiescent current, and integrated regulated supply to simplify pack-level safety architecture.
FAQ
What is the exact overvoltage protection threshold and accuracy of the BQ296106DSGR?
The BQ296106DSGR has a factory-programmed overvoltage threshold of 4.45V with ±10mV accuracy at 25°C and ±54mV accuracy across –40°C to +110°C. This tight tolerance ensures reliable secondary protection without external calibration, directly preventing cell overcharge in 3- and 4-series Li-ion configurations.
How does the BQ296106DSGR regulate its 3.3V output and what is its maximum load capacity?
The BQ296106DSGR provides a 3.3V regulated output capable of delivering up to 2mA continuous current. It includes short-circuit current limiting (4mA typical) and requires a 0.47µF ceramic capacitor on the REG pin for stability. The output self-disables if any monitored cell voltage falls below 2.8V for 6 seconds.
What is the purpose and timing behavior of the fixed 6.5-second delay in the BQ296106DSGR?
The BQ296106DSGR uses a fixed 6.5-second internal delay between overvoltage detection and assertion of the active-high OUT signal. This prevents nuisance tripping from transient voltage spikes while allowing time for charger control loop intervention-ensuring robust, deterministic fault response in battery pack safety systems.
Can the BQ296106DSGR be used in 2-cell, 3-cell, and 4-cell battery configurations?
Yes, the BQ296106DSGR supports 2-, 3-, and 4-series Li-ion battery stacks. Sense pins V1–V4 are configured sequentially from bottom to top of the stack; unused higher-order pins (e.g., V4 in a 2-cell pack) are shorted to the adjacent lower pin (V3), and the device ignores unconnected differential inputs below 0.5V.
What is the recommended PCB layout practice for the VSS connection on the BQ296106DSGR?
Texas Instruments mandates connecting the VSS pin first during battery cell attachment or PCB testing. Failure to do so risks damaging the REG pin due to uncontrolled capacitor discharge. If VSS-first connection cannot be guaranteed, a 5Ω series resistor must be placed in the REG capacitor path to limit inrush current and protect the IC.
BQ296106DSGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-WFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Battery Protection
- Battery Chemistry:
- Lithium Ion
- Number of Cells:
- 2 ~ 4
- Fault Protection:
- Over Voltage
- Interface:
- -
- Operating Temperature:
- -40°C ~ 110°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (2x2)
BQ296106DSGR FAQ
1.How can I place an order for BQ296106DSGR through Aetrix?
Please submit a Request for Quotation (RFQ) for BQ296106DSGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BQ296106DSGR reliable?
The price and inventory of BQ296106DSGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BQ296106DSGR is usually 5 days.
3.What payment methods are accepted for BQ296106DSGR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BQ296106DSGR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BQ296106DSGR?
BQ296106DSGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BQ296106DSGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BQ296106DSGR?
For technical support, including BQ296106DSGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BQ296106DSGR requirements.
6.How does Aetrix verify that BQ296106DSGR is sourced from the original manufacturer or authorized distributors?
All BQ296106DSGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BQ296106DSGR meets industry standards.
7.What is the process for return or replacement of BQ296106DSGR?
All BQ296106DSGR units undergo pre-shipment inspection (PSI). If there is an issue with BQ296106DSGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BQ296106DSGR part is unused and in its original packaging.
Return procedure for BQ296106DSGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BQ296106DSGR Tags

-
BQ29700DSER
Texas Instruments

-
S-8241ABKMC-GBKT2G
ABLIC Inc.

-
S-8241ABPMC-GBPT2G
ABLIC Inc.

-
BQ27427YZFR
Texas Instruments

-
BQ27426YZFR
Texas Instruments

-
STC3117IJT
STMicroelectronics

-
STC3115IJT
STMicroelectronics

-
BQ76925RGER
Texas Instruments

-
NPM1100-QDAA-R
Nordic Semiconductor ASA

-
BQ27441DRZR-G1A
Texas Instruments

-
STC3115AIQT
STMicroelectronics

-
S-8252AAL-M6T1U
ABLIC Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

