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Texas Instruments BQ4010MA-85

Part No.:
BQ4010MA-85
Manufacturer:
Texas Instruments
Category:
Memory
Package:
28-DIP Module (0.61", 15.49mm)
Datasheet:
AetrixBQ4010MA-85.pdf
Description:
IC NVSRAM 64KBIT PARALLEL 28DIP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,046

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Product details

Overview

BQ4010MA-85 from Texas Instruments is a nonvolatile 8 k × 8 (65,536-bit) SRAM with integrated lithium backup, 5 V operation, 85 ns access time, and automatic power-fail write-protection. It serves as a drop-in replacement for standard 28-pin DIP SRAMs in systems requiring data retention during power loss-such as industrial PLCs, medical data loggers, and utility metering.

For engineers reviewing the BQ4010MA-85 datasheet, BQ4010MA-85 pinout, BQ4010MA-85 application, or BQ4010MA-85 equivalent, key selection criteria include VPFD threshold (4.62 V), tCER recovery delay (120 ms max), 10-year data retention, and compatibility with industry-standard 64-Kb SRAM timing and address/data bus interfaces.

Technical Context

The BQ4010MA-85 integrates a CMOS SRAM core, power-fail detection circuitry monitoring VCC against VPFD = 4.62 V (typ), and an internal lithium coin cell. During valid VCC, it behaves identically to a standard 8-kword × 8-bit SRAM with CE/OE/WE control logic and full read/write timing compliance.

On VCC dropout below VPFD, it unconditionally enters write-protected mode: outputs go high-Z, inputs are ignored, and the lithium supply sustains memory contents. After VCC returns above VPFD, tCER enforces 120 ms of continued write-protection before resuming normal operation-ensuring processor stabilization.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 8 k × 8 (65,536 bits), organized as 8,192 words × 8 bits - matches standard 64-Kb SRAM footprint and addressing.
Access Time 85 ns maximum - supports 11.8 MHz bus operation with compatible timing margins for CE/OE-controlled reads.
Supply Voltage 4.75 V to 5.50 V - designed for 5 V ±5% systems; VPFD = 4.62 V (typ) ensures reliable power-fail detection within tolerance band.
Data Retention ≥10 years without external power - enabled by isolated lithium cell with <0.5% annual self-discharge pre-activation.
Power-Fail Response tWPT = 40–150 µs - guaranteed write-protection activation window after VCC crosses VPFD, preventing partial writes.
Recovery Delay tCER = 120 ms maximum - enforced write-protection hold time post-power-up to accommodate CPU reset and initialization.
Standby Current ISB1 = 1–2 µA (CE = VIH) - ultra-low quiescent draw enables long-term battery-backed retention without significant drain.

Pinout & Package

28-pin plastic dual-in-line package (PDIP), MA package type, 0.600-inch width, through-hole mounting. Pin 14 = VSS (ground), Pin 28 = VCC (5 V supply), with 13 address lines (A0–A12), 8 bidirectional data lines (DQ0–DQ7), and standard control inputs (CE, OE, WE).

Pin/Terminal Circuit Role Design Meaning
A0–A12 Address inputs 13-bit address bus supporting full 8,192-word decoding; compatible with standard microcontroller/microprocessor address mapping.
DQ0–DQ7 Data input/output 8-bit bidirectional data bus; high-impedance on deselect or write-protection to prevent bus contention.
CE Chip-enable input Active-low enable; controls device selection and initiates tACE timing for read/write access.
OE Output-enable input Active-low; gates output drivers only-does not affect write cycles or internal state.
WE Write-enable input Active-low; latches data on DQ bus into memory when CE is low; defines tWP and tDW timing windows.
VCC Supply voltage 5 V main power rail; monitored continuously for VPFD crossing to trigger backup switchover and write-protection.
VSS Ground Reference return path for all I/O and internal circuitry; must be low-impedance for stable SRAM operation.
NC No connect Pins 1 and 26 are unconnected; no internal bonding or function-must remain floating or grounded per layout best practice.

Key Features

Feature Design Value
Automatic write-protection Hardware-enforced disable of writes during power-up/down transitions-no firmware or external supervision required.
Integrated lithium backup Factory-sealed coin cell electrically isolated until first VCC application; eliminates external battery management circuitry.
Industry-standard pinout 28-pin DIP layout identical to 64-Kb SRAMs (e.g., HM62256, IS62C256), enabling direct PCB replacement without redesign.
Unlimited write cycles Standard SRAM endurance-no wear-out mechanism unlike EEPROM/Flash; supports real-time logging with continuous updates.
Zero external components Operates standalone with only VCC, VSS, and control/address/data signals-no regulators, diodes, or capacitors needed.

Applications

Industrial Data Logging Medical Device Memory Backup

Use Scenario: Continuous recording of sensor readings in programmable logic controllers during mains failure or scheduled shutdown.

IC Role / Device Role / Timing Role: Nonvolatile SRAM storing last-known operational state and timestamped measurements; retains data across 10+ year deployments.

Use Value: Eliminates need for external EEPROM write buffering or complex power-fail interrupt handling-data integrity guaranteed by hardware-level VPFD detection and tWPT response.

Use Scenario: Preserving calibration coefficients and patient session history in portable ECG monitors between battery swaps or charging cycles.

IC Role / Device Role / Timing Role: Battery-backed memory holding critical configuration and diagnostic logs; activated automatically on VCC dropout below 4.62 V.

Use Value: Ensures regulatory-compliant data persistence without software intervention-meets IEC 62304 requirements for safe state retention during power interruption.

Smart Utility Metering Avionics Configuration Storage

Use Scenario: Storing cumulative kWh/kVARh energy consumption and tamper-event timestamps in residential smart meters exposed to grid instability.

IC Role / Device Role / Timing Role: Primary nonvolatile storage for billing-critical data; withstands >100,000 power cycles with guaranteed 10-year retention.

Use Value: Avoids flash endurance limitations and write-latency penalties-enables sub-second data capture during brownouts with zero data loss.

Use Scenario: Holding flight-control parameter sets and fault history in airborne navigation units where power interruptions occur during engine start or generator switching.

IC Role / Device Role / Timing Role: Mission-critical memory preserving avionics configuration across transient 5 V rail collapses; tCER = 120 ms prevents premature re-enabling.

Use Value: Meets DO-160 Section 16 surge/brownout requirements by maintaining memory state without external supervision or watchdog coordination.

Equivalent & Alternatives

The following parts are listed as comparable options for similar nonvolatile SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
STK11C88-85 Same 8 k × 8 density, 85 ns speed, and 28-pin DIP, but uses external battery and lacks integrated VPFD circuitry-requires discrete power-fail comparator and switch. Suitable for legacy designs with existing battery interface; not drop-in due to missing auto-write-protect and tCER timing. Select only if board already implements external backup control; BQ4010MA-85 reduces BOM count and improves reliability.
DS1230Y-120+ 5 V, 120 ns access, same 8 k × 8 organization, but VPFD = 4.25 V (lower threshold) and tCER = 200 ms-less aggressive power-fail response. Better suited for systems with wider 5 V tolerance (±10%) or slower processors needing longer stabilization time. Prefer BQ4010MA-85 for tighter 5 V ±5% rails and faster resume; DS1230Y-120+ fits looser specs or where longer tCER is acceptable.

Compared with STK11C88-85 and DS1230Y-120+, the BQ4010MA-85 delivers superior integration (no external battery circuitry), tighter VPFD matching for 5 V ±5% systems, and shorter tCER-reducing system boot latency while maintaining identical pinout and timing behavior.

Availability

BQ4010MA-85 is available at Aetrix Electronics and suitable for industrial data loggers, medical device memory backup, smart utility metering, and avionics configuration storage requiring stable component supply and long-term lifecycle support.

Supply support for BQ4010MA-85 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 50 years of innovation in high-reliability memory and interface solutions.

The BQ4010MA-85 belongs to TI's bq40xx nonvolatile SRAM family, engineered specifically for mission-critical data retention in industrial, medical, and infrastructure equipment where power continuity cannot be assumed.

FAQ

What is the guaranteed data retention period for the BQ4010MA-85?

The BQ4010MA-85 guarantees ≥10 years of data retention in the absence of external power, based on TI's characterization of the internal lithium cell's self-discharge rate (<0.5% per year pre-activation) and SRAM leakage performance at 25°C. This specification applies after the first application of VCC, which electrically connects the battery to the memory array.

Does the BQ4010MA-85 require external components to operate as a nonvolatile SRAM?

No, the BQ4010MA-85 requires no external components. Its integrated lithium cell, power-fail detection circuitry, and automatic switchover logic are fully self-contained. Only standard SRAM interface signals (VCC, VSS, A0–A12, DQ0–DQ7, CE, OE, WE) are needed-no external comparators, switches, or backup regulators are necessary.

How does the BQ4010MA-85 handle a power-fail event during an active write cycle?

If a write cycle is in progress when VCC falls below VPFD = 4.62 V (typ), the BQ4010MA-85 completes the current memory cycle before asserting write-protection. If completion exceeds tWPT (40–150 µs), write-protection activates immediately to prevent partial or corrupted data writes-ensuring atomicity of the last completed operation.

Is the BQ4010MA-85 pin-compatible with standard 64-Kb SRAMs like the HM62256?

Yes, the BQ4010MA-85 uses an industry-standard 28-pin DIP (MA package) with identical pinout, signal definitions, and timing parameters as the HM62256 and IS62C256. It supports the same address/data/control interface and operates transparently as a drop-in replacement-no PCB or firmware changes required.

What is the purpose of the tCER parameter in the BQ4010MA-85 datasheet?

tCER (Chip Enable Recovery time) is the 120 ms maximum delay after VCC rises above VPFD during which the BQ4010MA-85 remains in write-protected mode. This ensures the host processor has sufficient time to stabilize its clock, reset peripherals, and reinitialize memory controllers before normal SRAM access resumes-preventing spurious writes during boot.

BQ4010MA-85 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
28-DIP Module (0.61", 15.49mm)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
NVSRAM
Technology:
NVSRAM (Non-Volatile SRAM)
Memory Size:
64Kbit
Memory Organization:
8K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
85ns
Access Time:
85 ns
Voltage - Supply:
4.75V ~ 5.5V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
28-DIP Module (18.42x37.72)

BQ4010MA-85 FAQ

1.How can I place an order for BQ4010MA-85 through Aetrix?

Please submit a Request for Quotation (RFQ) for BQ4010MA-85 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BQ4010MA-85 reliable?

The price and inventory of BQ4010MA-85 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BQ4010MA-85 is usually 5 days.

3.What payment methods are accepted for BQ4010MA-85?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BQ4010MA-85 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BQ4010MA-85?

BQ4010MA-85 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BQ4010MA-85 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BQ4010MA-85?

For technical support, including BQ4010MA-85 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BQ4010MA-85 requirements.

6.How does Aetrix verify that BQ4010MA-85 is sourced from the original manufacturer or authorized distributors?

All BQ4010MA-85 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BQ4010MA-85 meets industry standards.

7.What is the process for return or replacement of BQ4010MA-85?

All BQ4010MA-85 units undergo pre-shipment inspection (PSI). If there is an issue with BQ4010MA-85, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BQ4010MA-85 part is unused and in its original packaging.

Return procedure for BQ4010MA-85:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

BQ4010MA-85 Tags

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