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onsemi BSP50

Part No.:
BSP50
Manufacturer:
onsemi
Category:
Single Bipolar Transistors
Package:
TO-261-4, TO-261AA
Datasheet:
AetrixBSP50.pdf
Description:
TRANS NPN DARL 45V 0.8A SOT223-4
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,207

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Product details

Overview

BSP50 from ON Semiconductor is an NPN Darlington transistor designed for high-current switching applications requiring extremely high DC current gain (hFE ≥ 1000 at IC = 150 mA, VCE = 10 V) with continuous collector current up to 800 mA, VCEO = 45 V, and SOT-223 package thermal resistance of 125°C/W - used in industrial relay drivers and solid-state output modules.

For engineers reviewing the BSP50 datasheet, pinout, applications, or equivalent options, key selection criteria include verified Darlington saturation performance (VCE(sat) = 1.3 V at IC = 500 mA/IB = 0.5 mA), junction temperature range (–55°C to +150°C), and SOT-223 thermal dissipation capability under sustained load conditions.

Technical Context

The BSP50 implements a monolithic NPN Darlington pair structure optimized for high-current gain at medium collector currents (up to 500 mA), with base-emitter and collector-base breakdown voltages rated at 5 V and 60 V respectively. Its design targets low-input-drive switching where minimal base current must control substantial load current.

Thermal performance is defined by RθJA = 125°C/W in the SOT-223 package, and absolute maximum ratings specify TJ(max) = 150°C with derating above 25°C. The device is not intended for linear amplification but for saturated-switching operation with validated VBE(sat) = 1.9 V at IC = 500 mA/IB = 0.5 mA.

Key Specifications

ParameterValue and Actual Design Meaning
Device TypeNPN Darlington transistor - two cascaded NPN transistors on single die for ultra-high hFE
VCER45 V - maximum collector-emitter voltage with open base; defines safe off-state blocking in relay/solenoid drive
hFE (Min)1000 at IC = 150 mA, VCE = 10 V - enables <1 mA base drive to switch 500+ mA loads
VCE(sat)1.3 V at IC = 500 mA, IB = 0.5 mA - low saturation voltage reduces power loss in high-duty-cycle switching
RθJA125°C/W - limits usable continuous power to ~800 mW at TA = 25°C without heatsink
TJ Range–55°C to +150°C - supports operation in industrial enclosures and automotive under-hood environments

Pinout & Package

SOT-223 surface-mount package with exposed thermal pad (pin 4), standardized footprint for PCB thermal relief and mechanical stability in high-power switching layouts.

Pin/TerminalCircuit RoleDesign Meaning
1BaseInput control terminal; requires current-limited drive due to Darlington input impedance
2CollectorMain high-side current path; connected to load supply rail in common-emitter configuration
3EmitterPower return node; tied to ground or low-side switch; carries full load current
4Thermal Pad / Collector TabElectrically connected to collector; must be soldered to copper pour for thermal management

Key Features

FeatureDesign Value
Ultra-High DC Current GainhFE ≥ 1000 at 150 mA ensures microcontroller GPIO-level drive capability without external pre-driver
Low Saturation VoltageVCE(sat) = 1.3 V at 500 mA minimizes conduction loss and self-heating in 24 V industrial control outputs
SOT-223 Thermal PerformanceRθJA = 125°C/W enables >700 mW dissipation with standard 1-in² 2-oz copper, eliminating need for TO-220 heatsinks
Robust Breakdown RatingsVCBO = 60 V and VEBO = 5 V support reliable operation in noisy 24 V PLC backplanes with transient coupling

Applications

Industrial Relay DriversPLC Output Modules

Use Scenario: Driving 24 V DC electromagnetic relays with coil currents up to 600 mA in programmable logic controller output stages.

IC Role / Device Role: High-gain saturated switch replacing discrete BJT pairs or optocoupler-output drivers.

Use Value: Eliminates need for external base resistors or driver transistors while maintaining <1.5 V dropout across load path.

Use Scenario: Solid-state replacement for mechanical relay outputs in DIN-rail mounted I/O modules handling solenoid valves and indicator lamps.

IC Role / Device Role: Final-stage load switch interfacing microcontroller GPIOs to field-side 24 V loads.

Use Value: Enables compact 16-channel per module density with validated thermal margin at 50% duty cycle.

DC Motor Start CircuitsHeater Control Outputs

Use Scenario: Momentary start-up current surge handling (≥500 mA peak) for small brushed DC motors in HVAC actuators.

IC Role / Device Role: Inrush-tolerant switching element placed between power rail and motor H-bridge enable line.

Use Value: Withstands 800 mA continuous rating and 150°C junction limit during 2-second startup bursts.

Use Scenario: On/off control of 12–24 V resistive heating elements (e.g., 30 W cartridge heaters) in process instrumentation.

IC Role / Device Role: Low-loss series pass switch in thermally constrained enclosures with ambient up to 70°C.

Use Value: Delivers stable 500 mA switching with <1.4 V total drop, reducing heater voltage error to <6% at 24 V nominal.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN Darlington transistor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ON Semiconductor NSS12500UHigher hFE (min 2000), lower VCE(sat) (0.9 V), SOT-363 package (lower power, no thermal pad)Optimized for low-current signal switching (<200 mA); unsuitable for 500+ mA loads due to 350 mW PD limitSelect NSS12500U only for space-constrained logic-level buffering; BSP50 remains preferred for industrial load switching.
Diodes Incorporated DZT5550Same SOT-223 package, comparable hFE (1000 min), but higher VCE(sat) (1.5 V) and lower TJ(max) (125°C)Limited to ambient ≤50°C in sealed enclosures; requires larger copper area to match BSP50 thermal marginChoose DZT5550 only if BSP50 is unavailable and thermal derating is acceptable; verify layout copper area per datasheet.

Compared with NSS12500U and DZT5550, the BSP50 uniquely balances high-current capability (800 mA), robust thermal design (125°C/W + exposed pad), and industrial-grade junction temperature (150°C), making it the only option qualified for sustained 500 mA switching in unventilated control cabinets.

Availability

BSP50 is available at Aetrix Electronics and suitable for industrial relay drivers, PLC output modules, and DC motor start circuits requiring stable component supply across multi-year production cycles.

Supply support for BSP50 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

ON Semiconductor is a global semiconductor manufacturer specializing in energy-efficient power management, analog, sensor, and logic solutions for automotive, industrial, and cloud infrastructure markets.

The BSP50 belongs to ON Semiconductor's legacy Fairchild bipolar transistor product line, engineered specifically for high-reliability industrial switching applications where Darlington gain and thermal resilience are critical.

FAQ

What is the maximum continuous collector current rating for the BSP50?

The BSP50 is rated for a continuous collector current (IC) of 800 mA at TA = 25°C. This rating assumes proper PCB thermal management using the SOT-223 thermal pad. At higher ambient temperatures or reduced copper area, derating applies per the 8.0 mW/°C specification. Always validate actual operating current in your thermal environment before final design sign-off for the BSP50.

Does the BSP50 have a built-in base-emitter resistor?

No, the BSP50 does not include any integrated base-emitter resistor. It is a bare Darlington transistor requiring external base current limiting - typically via a series resistor driven by a microcontroller GPIO or logic buffer. This allows flexible biasing for varying load currents and ensures precise control over turn-on speed and saturation depth for the BSP50.

Can the BSP50 be used in linear amplifier configurations?

The BSP50 is characterized and specified exclusively for saturated switching operation, not linear amplification. Its hFE variation, thermal instability under bias, and lack of small-signal parameters (e.g., fT, Cobo) in the datasheet confirm its optimization for on/off use. For analog gain stages, select purpose-built general-purpose BJTs - the BSP50 should only be applied as a switch in designs targeting the BSP50's published switching parameters.

What is the function of pin 4 on the BSP50 SOT-223 package?

Pin 4 on the BSP50 is the exposed thermal pad, electrically connected to the collector terminal. It must be soldered to a PCB copper pour for effective heat dissipation. Leaving pin 4 unconnected degrades thermal resistance by >40%, risking premature thermal shutdown or parametric shift. Always include thermal vias beneath pin 4 when routing the BSP50 into production PCBs.

How does the BSP50's VCE(sat) compare to standard single NPN transistors at 500 mA?

At IC = 500 mA, the BSP50 achieves VCE(sat) = 1.3 V - significantly lower than typical single NPN transistors (e.g., 2N2222: ~0.8 V at 150 mA, but >2.0 V at 500 mA due to gain collapse). This advantage stems from Darlington architecture sustaining high hFE at elevated current, enabling efficient high-current switching not achievable with conventional BJTs - a key differentiator for the BSP50 in industrial load control.

BSP50 Specifications

Product attributes
Attribute value
Manufacturer:
onsemi
Series:
-
Package/Case:
TO-261-4, TO-261AA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Transistor Type:
NPN - Darlington
Current - Collector (Ic) (Max):
800 mA
Voltage - Collector Emitter Breakdown (Max):
45 V
Vce Saturation (Max) @ Ib, Ic:
1.3V @ 500µA, 500mA
Current - Collector Cutoff (Max):
50nA
DC Current Gain (hFE) (Min) @ Ic, Vce:
2000 @ 500mA, 10V
Power - Max:
1 W
Frequency - Transition:
-
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SOT-223-4

BSP50 FAQ

1.How can I place an order for BSP50 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSP50 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSP50 reliable?

The price and inventory of BSP50 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP50 is usually 5 days.

3.What payment methods are accepted for BSP50?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP50 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSP50?

BSP50 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSP50 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSP50?

For technical support, including BSP50 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP50 requirements.

6.How does Aetrix verify that BSP50 is sourced from the original manufacturer or authorized distributors?

All BSP50 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP50 meets industry standards.

7.What is the process for return or replacement of BSP50?

All BSP50 units undergo pre-shipment inspection (PSI). If there is an issue with BSP50, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSP50 part is unused and in its original packaging.

Return procedure for BSP50:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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