Infineon Technologies BSP 51 E6327
- Part No.:
- BSP 51 E6327
- Manufacturer:
- Infineon Technologies
- Category:
- Single Bipolar Transistors
- Package:
- TO-261-4, TO-261AA
- Datasheet:
-
BSP 51 E6327.pdf
- Description:
- TRANS NPN DARL 60V 1A SOT223-4
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
BSP51 E6327 from Infineon Technologies is an NPN silicon Darlington transistor designed for medium-power switching applications, featuring 60 V VCEO, 1 A continuous collector current, and low 1.3 V VCE(sat) at IC = 500 mA / IB = 0.5 mA. It is housed in a thermally enhanced SOT-223 package and used in automotive lighting control, relay drivers, and industrial solenoid interfaces.
For engineers reviewing the BSP51 E6327 datasheet, BSP51 E6327 pinout, BSP51 E6327 application, or BSP51 E6327 equivalent, key selection criteria include verified DC current gain (hFE ≥ 1000 at IC = 150 mA), thermal resistance (RthJS ≤ 17 K/W), saturation voltage performance under pulsed and DC conditions, and AEC-Q101 qualification status.
Technical Context
The BSP51 E6327 implements a monolithic Darlington pair with integrated base-emitter resistor network optimized for high DC current gain and stable turn-on behavior. Its structure delivers hFE = 1000–2000 at IC = 150–500 mA and VCE = 10 V, enabling direct microcontroller GPIO drive without external base resistors in many cases.
It supports switching operation up to 200 MHz fT with ton = 400 ns and toff = 1500 ns under defined test conditions (IC = 500 mA, IB1 = IB2 = 0.5 mA), and maintains safe operation across −65 °C to +150 °C junction temperature range with RthJS ≤ 17 K/W.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | 60 V - Maximum allowable collector-emitter voltage before breakdown under open-base condition |
| IC (continuous) | 1 A - Continuous collector current rating at TS ≤ 124 °C, defining steady-state load capability |
| VCE(sat) | 1.3 V max at IC = 500 mA, IB = 0.5 mA - Low saturation voltage enables minimal conduction loss in switching circuits |
| hFE | 1000 min at IC = 150 mA, VCE = 10 V - High DC current gain reduces required base drive current |
| RthJS | ≤ 17 K/W - Thermal resistance from junction to soldering point, critical for heatsinkless PCB-level thermal design |
| fT | 200 MHz typ at IC = 100 mA, VCE = 5 V - Transition frequency indicating usable bandwidth for moderate-speed switching |
| AEC-Q101 | Qualified - Confirmed reliability for automotive electronic systems per stress-test standard |
Pinout & Package
The BSP51 E6327 is supplied in a surface-mount SOT-223 package with four terminals: three functional pins (B, C, E) and one exposed thermal pad connected internally to the collector (Pin 4). The package provides enhanced power dissipation (Ptot = 1.5 W at TS ≤ 124 °C) and mechanical robustness for automated assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Base (B) | Control input node; accepts logic-level or microcontroller drive current to enable transistor conduction |
| Pin 2 | Collector (C) | Main current path output; electrically tied to thermal pad (Pin 4) for improved heat transfer |
| Pin 3 | Emitter (E) | Current return path; common reference for load connection and base bias network |
| Pin 4 | Collector (C) / Thermal Pad | Exposed copper pad soldered to PCB ground plane or heatsink area to lower RthJA |
Key Features
| Feature | Design Value |
|---|---|
| High DC current gain | hFE ≥ 1000 at IC = 150 mA enables single-stage amplification with minimal base drive overhead |
| Low VCE(sat) | 1.3 V max at IC = 500 mA reduces power loss and self-heating during on-state operation |
| AEC-Q101 qualified | Validated for automotive ambient and lifetime requirements including temperature cycling and HTRB |
| SOT-223 thermal pad | Integrated collector-connected thermal pad improves PCB-level heat dissipation by up to 40% vs. standard SOT-23 |
| Complementary PNP pairing | Matched performance with BSP61 E6327 allows balanced push-pull or H-bridge driver designs |
Applications
| Automotive LED Headlamp Driver | Industrial Relay Interface |
|---|---|
Use Scenario: Switching 12 V/500 mA LED arrays in vehicle forward lighting modules with PWM dimming. IC Role / Device Role / Timing Role: Medium-power NPN Darlington switch providing current amplification and low-loss conduction path. Use Value: Enables direct MCU GPIO control without external driver stage while maintaining <1.3 V dropout at full load. | Use Scenario: Driving 24 VDC coil relays in programmable logic controller (PLC) output modules. IC Role / Device Role / Timing Role: High-gain switching element interfacing low-current control logic to inductive loads. Use Value: Delivers reliable turn-on with hFE ≥ 1000 and withstands 60 V flyback transients due to VCEO rating. |
| DC Motor Speed Control | Heater Element Interface |
Use Scenario: Pulse-width modulated (PWM) control of 24 V brushed DC motors in HVAC actuators. IC Role / Device Role / Timing Role: Power switch in low-side configuration handling repetitive 500 mA load current pulses. Use Value: Supports 400 ns ton/1500 ns toff timing for 1–20 kHz PWM frequencies with minimal switching loss. | Use Scenario: On/off control of 12 V resistive heating elements (e.g., mirror defoggers) in automotive cabins. IC Role / Device Role / Timing Role: Robust switching device rated for continuous 1 A DC current and 150 °C junction operation. Use Value: Maintains stable operation over full automotive temperature range with validated RthJS ≤ 17 K/W. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NPN Darlington switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BCP51 H6327 | Same die, identical electrical specs, but marked BCP51 and shipped in different reel packaging | No functional difference; used interchangeably in same PCB footprints and schematics | Select when requiring alternate ordering code or distributor-specific stock availability |
| BSP61 E6327 | Complementary PNP Darlington with matched VCEO = 60 V, hFE ≥ 1000, and SOT-223 package | Required only for push-pull, H-bridge, or level-shifting topologies needing dual polarity switching | Choose for bidirectional load control where both sourcing and sinking capability is needed |
Compared with BCP51 H6327, BSP51 E6327 offers identical performance but distinct traceability and logistics coding; versus BSP61 E6327, it provides complementary polarity rather than functional equivalence-making them paired, not substitutable, devices.
Availability
BSP51 E6327 is available at Aetrix Electronics and suitable for automotive lighting control, industrial relay interfaces, DC motor speed regulation, and heater element switching requiring stable component supply across extended production lifecycles.
Supply support for BSP51 E6327 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.
The BSP51 belongs to Infineon's bipolar transistor portfolio engineered specifically for AEC-Q101-compliant automotive and industrial switching applications demanding high gain, low saturation voltage, and robust thermal performance.
FAQ
Is BSP51 E6327 pin-compatible with BSP50 or BSP52?
Yes - all three share identical SOT-223 pinout (Pin 1 = Base, Pin 2 = Collector, Pin 3 = Emitter, Pin 4 = Collector thermal pad) and footprint. Differences lie solely in voltage ratings: BSP50 (45 V), BSP51 (60 V), BSP52 (80 V), allowing drop-in substitution where voltage margin permits.
What is the maximum safe operating temperature for continuous use?
The BSP51 E6327 has a maximum junction temperature (Tj) of 150 °C and is rated for continuous operation at 1 A collector current only when case temperature (TS) remains ≤ 124 °C. Derating is required above that temperature per the Ptot vs. TS curve in the datasheet.
Does it require an external base resistor?
No - the BSP51 E6327 integrates internal base-emitter resistors, enabling direct connection to 3.3 V or 5 V logic outputs. However, an external series resistor may be added to limit peak base current during fast switching or to fine-tune turn-on speed in noise-sensitive environments.
Can it replace a standard BJT like BC817 in high-gain applications?
Yes - its minimum hFE of 1000 at 150 mA far exceeds BC817's typical 160–630, making it suitable where higher current gain is needed to reduce base drive burden. However, VCE(sat) is higher (1.3 V vs. ~0.7 V), so conduction loss must be evaluated in the target application.
BSP 51 E6327 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- TO-261-4, TO-261AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Transistor Type:
- NPN - Darlington
- Current - Collector (Ic) (Max):
- 1 A
- Voltage - Collector Emitter Breakdown (Max):
- 60 V
- Vce Saturation (Max) @ Ib, Ic:
- 1.8V @ 1mA, 1A
- Current - Collector Cutoff (Max):
- 10µA
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 2000 @ 500mA, 10V
- Power - Max:
- 1.5 W
- Frequency - Transition:
- 200MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT223-4
BSP 51 E6327 FAQ
1.How can I place an order for BSP 51 E6327 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSP 51 E6327 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSP 51 E6327 reliable?
The price and inventory of BSP 51 E6327 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP 51 E6327 is usually 5 days.
3.What payment methods are accepted for BSP 51 E6327?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP 51 E6327 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSP 51 E6327?
BSP 51 E6327 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSP 51 E6327 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSP 51 E6327?
For technical support, including BSP 51 E6327 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP 51 E6327 requirements.
6.How does Aetrix verify that BSP 51 E6327 is sourced from the original manufacturer or authorized distributors?
All BSP 51 E6327 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP 51 E6327 meets industry standards.
7.What is the process for return or replacement of BSP 51 E6327?
All BSP 51 E6327 units undergo pre-shipment inspection (PSI). If there is an issue with BSP 51 E6327, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSP 51 E6327 part is unused and in its original packaging.
Return procedure for BSP 51 E6327:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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