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Home > Products > Discrete Semiconductor Products > Transistors > Bipolar (BJT) > Single Bipolar Transistors

Infineon Technologies BSP 52 E6327

Name: BSP 52 E6327
Brand: Infineon Technologies
SKU: BSP 52 E6327
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BSP 52 E6327

Manufacturer:: Infineon Technologies

Category:: Single Bipolar Transistors

Package:: TO-261-4, TO-261AA

Datasheet:: BSP 52 E6327.pdf

Description:: TRANS NPN DARL 80V 1A SOT223-4

Quantity:: RFQ Add To RFQ list

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Product details

Overview

BSP52 E6327 from Infineon Technologies is an NPN silicon Darlington transistor in SOT-223 package, designed for high-current switching with 80 V V_CEO, 1 A continuous collector current, and low 1.8 V V_CE(sat) at 1 A/1 mA drive-used in automotive lighting control and industrial relay drivers.

For engineers reviewing the BSP52 E6327 datasheet, BSP52 E6327 pinout, BSP52 E6327 application, or BSP52 E6327 equivalent, key selection criteria include V_CEO rating, h_FE ≥1000 at 150 mA, thermal resistance R_thJS ≤17 K/W, and AEC-Q101 qualification for automotive-grade reliability.

Technical Context

This Darlington pair integrates two NPN transistors in cascade to achieve high DC current gain (h_FE = 1000–2000) while maintaining low saturation voltage. It operates with base-emitter turn-on at ~1.9–2.2 V and supports pulse currents up to 2 A (t_p ≤10 ms).

Designed for linear and switching operation at T_A = 25°C, it delivers f_T = 200 MHz at I_C = 100 mA, V_CE = 5 V, and exhibits t_on = 400 ns / t_off = 1500 ns under standardized 500 mA switching conditions.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CEO	80 V - maximum safe collector-emitter voltage before breakdown in open-base configuration
I_C (continuous)	1 A - continuous collector current rating at T_S ≤124°C, defining steady-state load capacity
V_CE(sat)	1.8 V @ I_C=1 A, I_B=1 mA - low saturation voltage enabling <1.8 W conduction loss at full load
h_FE	1000–2000 @ I_C=150 mA, V_CE=10 V - high DC gain reduces required base drive current
R_thJS	≤17 K/W - junction-to-soldering-point thermal resistance, critical for PCB copper pad thermal design
f_T	200 MHz @ I_C=100 mA, V_CE=5 V - usable bandwidth for medium-speed digital switching
AEC-Q101	Qualified - certified for automotive electronic systems per stress-test standard for discrete semiconductors

Pinout & Package

SOT-223 package: 4-pin surface-mount outline with exposed thermal pad (Pin 4), standardized footprint per Infineon EHP00661 layout. Pin 1 = Base, Pin 2 = Collector, Pin 3 = Emitter, Pin 4 = Collector (redundant, tied internally to Pin 2 for enhanced thermal and current handling).

Pin/Terminal	Circuit Role	Design Meaning
Pin 1	Base	Control input; requires ~1 mA drive for 1 A output, enabling logic-level interfacing via current-limiting resistor
Pin 2	Collector	Main power output node; electrically connected to Pin 4 for parallel current path and improved thermal dissipation
Pin 3	Emitter	Reference terminal; tied to system ground or load return in low-side switch configurations
Pin 4	Collector (thermal)	Dedicated thermal and current-carrying extension of Pin 2; must be soldered to large copper pour for R_thJS compliance

Key Features

Feature	Design Value
High h_FE Darlington architecture	Enables single-stage amplification from microcontroller GPIO without external pre-driver stage
Low V_CE(sat) at full load	Reduces power loss to ≤1.8 W at 1 A, easing thermal management in enclosed automotive modules
AEC-Q101 qualification	Validated for temperature cycling, HTRB, and ESD per automotive reliability requirements
SOT-223 with thermal pad (Pin 4)	Supports >1.5 W continuous dissipation when mounted on ≥100 mm² 2-oz copper area
Complementary PNP pairing	Direct replacement compatibility with BSP62 for push-pull or H-bridge output stages

Applications

Automotive LED Headlamp Driver

Industrial PLC Output Stage

Use Scenario: Switching 12 V/700 mA LED arrays in adaptive front-lighting systems with PWM dimming.

IC Role / Device Role / Timing Role: Low-side power switch controlled by MCU PWM signal; handles repetitive 1 kHz switching with t_on/t_off < 2 µs.

Use Value: V_CE(sat) ≤1.8 V ensures <1.3 W conduction loss, eliminating need for heatsink in compact headlamp housing.

Use Scenario: Driving 24 V solenoid valves and indicator lamps in programmable logic controller output modules.

IC Role / Device Role / Timing Role: High-current interface between isolated digital outputs and inductive loads; clamped with external flyback diode.

Use Value: 80 V V_CEO safely absorbs 24 V supply transients and inductive kickback up to 60 V.

DC Motor Speed Control

Power Supply Enable Switch

Use Scenario: Enabling/disabling brushed DC motors (12 V, 800 mA) in HVAC actuators using enable signals from body control module.

IC Role / Device Role / Timing Role: High-side or low-side ON/OFF switch; operated in linear region only during startup surge limiting.

Use Value: h_FE ≥1000 allows direct drive from 3.3 V MCU with 10 kΩ base resistor, minimizing BOM count.

Use Scenario: Sequencing power rails in multi-voltage embedded systems (e.g., enabling 5 V subsystem after 3.3 V stabilization).

IC Role / Device Role / Timing Role: Controlled pass element in power-good signaling chain; biased in saturation for minimal dropout.

Use Value: R_thJS ≤17 K/W enables stable operation at 1 A with <30°C junction rise on standard 4-layer PCB.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN Darlington switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
ZTX1051A	V_CEO = 60 V (vs. 80 V); h_FE min = 750; SOT-89 package (no thermal pin)	Limited to ≤60 V systems; lower thermal performance due to no dedicated collector thermal pad	Select if board space is constrained and voltage margin >10 V suffices
BCP56-10	V_CEO = 80 V; h_FE = 250–630 (lower gain); TO-263 package with larger thermal pad	Requires higher base drive; superior thermal capability but larger footprint	Prefer for >1.5 A pulsed loads where R_thJA < 10 K/W is mandatory

Compared with ZTX1051A and BCP56-10, BSP52 E6327 uniquely balances 80 V rating, ≥1000 h_FE, and SOT-223 thermal pad integration-making it optimal for space-constrained automotive switches needing minimal base drive and verified AEC-Q101 compliance.

Availability

BSP52 E6327 is available at Aetrix Electronics and suitable for automotive lighting control, industrial PLC output stages, DC motor enable circuits, and power rail sequencing requiring stable component supply across production lifecycles.

Supply support for BSP52 E6327 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.

The BSP50–BSP52 series belongs to Infineon's AEC-Q101-qualified bipolar transistor portfolio, engineered specifically for robust, high-gain switching in automotive body electronics and industrial actuation systems.

FAQ

Is BSP52 E6327 suitable for PWM-driven LED dimming at 2 kHz?

Yes. With t_on = 400 ns and t_off = 1500 ns, BSP52 E6327 fully settles within 2 µs per edge-well below the 250 µs half-cycle period at 2 kHz. Its low V_CE(sat) minimizes heating during duty cycles >50%, and AEC-Q101 qualification ensures reliability under automotive thermal cycling.

What is the maximum allowable PCB copper area for thermal relief with BSP52 E6327?

Infineon specifies R_thJS ≤17 K/W with a minimum 100 mm² (10 mm × 10 mm) 2-ounce copper pour connected to Pin 4. Larger areas further reduce R_thJA, but diminishing returns set in beyond 250 mm². Thermal vias under the pad (≥6×0.3 mm) are recommended to inner-layer planes.

Can BSP52 E6327 replace BSP51 in an existing design?

Yes, with verification. BSP52 shares identical pinout, package, and thermal characteristics with BSP51 but offers higher V_CEO (80 V vs. 60 V) and V_CBO (90 V vs. 80 V). No layout change is needed; confirm system transients remain within BSP52's margin and that h_FE variation does not affect loop stability in linear applications.

Does BSP52 E6327 require a base resistor, and how is its value calculated?

Yes. For 1 A I_C, use I_B = I_C/h_FE(min) = 1 A/1000 = 1 mA. With V_BE(sat) ≈ 2.0 V and 3.3 V MCU drive, R_B = (3.3 V − 2.0 V)/1 mA = 1.3 kΩ (standard 1.2 kΩ or 1.5 kΩ). Ensure power rating ≥0.25 W for reliability under continuous operation.

BSP 52 E6327 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: -

Package/Case:: TO-261-4, TO-261AA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Transistor Type:: NPN - Darlington

Current - Collector (Ic) (Max):: 1 A

Voltage - Collector Emitter Breakdown (Max):: 80 V

Vce Saturation (Max) @ Ib, Ic:: 1.8V @ 1mA, 1A

Current - Collector Cutoff (Max):: 10µA

DC Current Gain (hFE) (Min) @ Ic, Vce:: 2000 @ 500mA, 10V

Power - Max:: 1.5 W

Frequency - Transition:: 200MHz

Operating Temperature:: 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-SOT223-4

BSP 52 E6327 FAQ

1.How can I place an order for BSP 52 E6327 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSP 52 E6327 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSP 52 E6327 reliable?

The price and inventory of BSP 52 E6327 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP 52 E6327 is usually 5 days.

3.What payment methods are accepted for BSP 52 E6327?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP 52 E6327 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSP 52 E6327?

BSP 52 E6327 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSP 52 E6327 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSP 52 E6327?

For technical support, including BSP 52 E6327 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP 52 E6327 requirements.

6.How does Aetrix verify that BSP 52 E6327 is sourced from the original manufacturer or authorized distributors?

All BSP 52 E6327 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP 52 E6327 meets industry standards.

7.What is the process for return or replacement of BSP 52 E6327?

All BSP 52 E6327 units undergo pre-shipment inspection (PSI). If there is an issue with BSP 52 E6327, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSP 52 E6327 part is unused and in its original packaging.

Return procedure for BSP 52 E6327:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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