Infineon Technologies BSP52H6327XTSA1

Overview

BSP52H6327XTSA1 from Infineon Technologies is an NPN silicon Darlington transistor in SOT-223 package, designed for high-current switching applications with V_CEO = 80 V, I_C = 1 A, and low V_CE(sat) = 1.8 V at I_C = 1 A / I_B = 1 mA. It delivers h_FE ≥ 1000 at I_C = 150 mA and supports automotive-grade reliability per AEC-Q101.

For engineers reviewing the BSP52H6327XTSA1 datasheet, BSP52H6327XTSA1 pinout, BSP52H6327XTSA1 application, or BSP52H6327XTSA1 equivalent, key selection criteria include its Darlington gain structure, thermal resistance (R_thJS ≤ 17 K/W), saturation voltage performance under load, and SOT-223 power-handling capability for board-level relay drivers and motor control stages.

Technical Context

This Darlington pair integrates two cascaded NPN transistors to achieve high DC current gain (h_FE up to 2000) while maintaining single-package simplicity. Its internal configuration enables low base drive requirements - only 1 mA base current suffices to switch 1 A collector load.

The device operates with V_CEO = 80 V and V_CBO = 90 V, supporting robust voltage margin in inductive load switching. Thermal design is facilitated by R_thJS ≤ 17 K/W and P_tot = 1.5 W at T_S ≤ 124 °C, enabling direct PCB copper pad heatsinking without external heatsinks in many medium-power applications.

Key Specifications

Pinout & Package

SOT-223 package with 4-pin configuration: Pin 1 = Base (B), Pin 2 = Collector (C), Pin 3 = Emitter (E), Pin 4 = Collector (C). The dual-collector pin (Pins 2 & 4) provides enhanced thermal and current-carrying capability via parallel internal connection.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN Darlington transistor applications.

Compared with BCP52TA and ZTX1051A, BSP52H6327XTSA1 uniquely balances AEC-Q101 compliance, SOT-223 board space efficiency, and 80 V/1 A capability - making it optimal for space-constrained automotive and industrial switching where qualification and thermal integration are jointly critical.

Availability

BSP52H6327XTSA1 is available at Aetrix Electronics and suitable for automotive door lock actuators, industrial PLC output stages, DC motor speed control circuits, and LED signage power switches requiring stable component supply across production lifecycles.

Supply support for BSP52H6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.

The BSP50–BSP52 series belongs to Infineon's high-reliability discrete transistor portfolio, engineered specifically for AEC-Q101-compliant medium-power switching in automotive body electronics and industrial automation.

FAQ

What is the maximum safe operating temperature for BSP52H6327XTSA1?

The junction temperature must not exceed 150 °C, and the soldering point temperature must remain ≤124 °C to maintain rated P_tot = 1.5 W. Derating begins linearly above 124 °C, reaching zero power at 150 °C. PCB copper area and airflow directly impact achievable ambient operating temperature.

Does BSP52H6327XTSA1 require a base resistor, and how is its value calculated?

Yes - a series base resistor is mandatory to limit I_B and prevent damage. For I_C = 1 A and h_FE = 1000, minimum I_B = 1 mA. With V_BE(sat) ≈ 2.0 V and 3.3 V GPIO drive, R_B = (3.3 − 2.0) V / 1 mA = 1.3 kΩ; 1.2 kΩ is standard. Higher values reduce gain margin but improve safety.

Can BSP52H6327XTSA1 be used in high-frequency switching applications above 100 kHz?

No - although f_T = 200 MHz, its t_off = 1500 ns limits practical PWM frequency to ≤50 kHz for efficient operation. At higher frequencies, energy loss during turn-off dominates, increasing die temperature and risking thermal runaway without active cooling.

Is the SOT-223 package lead-free and RoHS-compliant?

Yes - BSP52H6327XTSA1 uses Pb-free terminations and complies with EU RoHS Directive 2011/65/EU and JEDEC JS709. The package marking "H6327" denotes halogen-free, lead-free, and green-compliant manufacturing per Infineon's material declarations.