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Infineon Technologies BSP60

Part No.:
BSP60
Manufacturer:
Infineon Technologies
Category:
Single Bipolar Transistors
Package:
TO-261-4, TO-261AA
Datasheet:
AetrixBSP60.pdf
Description:
TRANS PNP DARL 45V 1A SOT2234-21
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:33,700

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Product details

Overview

BSP60 from Infineon Technologies is a PNP silicon Darlington transistor designed for medium-power switching applications, featuring 45 V VCEO, 1 A continuous collector current, 1.5 W total power dissipation at TS ≤ 124 °C, and low 1.3 V VCE(sat) at IC = 500 mA / IB = 0.55 mA - used in automotive body control modules for relay and lamp driver stages.

For engineers reviewing the BSP60 datasheet, BSP60 pinout, BSP60 application, or BSP60 equivalent, key selection criteria include verified Darlington gain (hFE ≥ 1000 at IC = 150 mA), thermal resistance (RthJS ≤ 17 K/W), RoHS-compliant SOT223 package, and AEC-Q101 qualification for automotive-grade reliability.

Technical Context

The BSP60 implements a monolithic PNP Darlington pair with integrated base-emitter resistor network enabling direct TTL/CMOS-level drive. Its high DC current gain (hFE = 1000–2000) and low saturation voltage reduce base drive requirements and conduction losses in discrete load-switching circuits.

It operates with VCEO = 45 V, VCBO = 60 V, and VEBO = 5 V, supporting robust blocking capability in 12 V automotive systems. Switching performance is characterized by fT = 200 MHz (typ.) and defined turn-on/turn-off timing under pulsed conditions (tp < 300 µs, duty < 2%).

Key Specifications

ParameterValue and Actual Design Meaning
VCEO45 V - maximum safe collector-emitter voltage before breakdown in open-base configuration
IC (continuous)1 A - continuous collector current rating at TS ≤ 124 °C, defining steady-state load-handling capacity
VCE(sat)1.3 V max at IC = 500 mA / IB = 0.55 mA - low saturation voltage minimizes power loss in on-state switching
hFE1000 min at IC = 150 mA / VCE = 10 V - high Darlington current gain reduces required base drive current
RthJS≤ 17 K/W - junction-to-solder-point thermal resistance enables reliable heat transfer to PCB copper pour
fT200 MHz typ. at IC = 100 mA / VCE = 5 V - usable for moderate-speed switching up to ~100 kHz with margin

Pinout & Package

Package: SOT223 - surface-mount, thermally enhanced 4-pin plastic package with exposed emitter pad for improved heat dissipation and mechanical stability on PCB.

Pin/TerminalCircuit RoleDesign Meaning
1 (B)BaseControl input terminal; accepts TTL/CMOS-compatible drive due to internal Darlington structure
2 (C)CollectorMain current sink node; connected to load return path in high-side switch configurations
3 (E)EmitterPower output node; electrically tied to PCB thermal pad for low-impedance heat path
4 (C)Collector (redundant)Second collector connection for enhanced current handling and thermal distribution across package leads

Key Features

FeatureDesign Value
AEC-Q101 qualifiedValidated for automotive applications including temperature cycling, humidity, and mechanical shock per stress test standard
Pb-free (RoHS compliant)Meets EU Directive 2011/65/EU; no lead in solderable terminations or mold compound
Complementary NPN types availableBSP50–BSP52 series enable balanced push-pull or H-bridge designs without cross-manufacturer sourcing
Low VCE(sat) at high IC1.8 V max at IC = 1 A / IB = 1 mA - reduces conduction loss in 12 V lamp/relay drivers

Applications

Automotive Lamp DriverIndustrial Relay Interface

Use Scenario: Driving 12 V halogen or LED headlamp circuits in body control units with PWM dimming capability.

IC Role / Device Role / Timing Role: High-current PNP Darlington switch controlling lamp anode connection to battery rail.

Use Value: Delivers 1 A continuous current with <1.3 V drop, minimizing thermal rise and enabling compact heatsinkless layout.

Use Scenario: Isolating microcontroller GPIO from 24 V industrial relay coils in PLC I/O modules.

IC Role / Device Role / Timing Role: Medium-power interface transistor providing galvanic separation and current amplification.

Use Value: High hFE (≥1000) allows direct 3.3 V MCU drive without external base resistor network.

DC Motor Brake ControlPower Supply Enable Switch

Use Scenario: Shorting motor terminals during dynamic braking in 24 V brushed DC motor controllers.

IC Role / Device Role / Timing Role: Low-saturation switch placed between motor windings and ground to dissipate kinetic energy as heat.

Use Value: RthJS ≤ 17 K/W supports transient 2 A peak current (tp ≤ 10 ms) without junction overheating.

Use Scenario: Enabling/disabling auxiliary 5 V or 3.3 V LDO outputs in multi-rail embedded power systems.

IC Role / Device Role / Timing Role: High-side enable switch controlling input to downstream regulators via collector-emitter path.

Use Value: VCEO = 45 V provides 2× margin over 24 V supply rails, ensuring long-term reliability under load dump transients.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP Darlington switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
BCP53VCEO = 45 V, IC = 1 A, but hFE min = 250 (not Darlington); higher VCE(sat) (~0.7 V at 500 mA)Requires external base resistor and higher drive current; unsuitable for direct logic-level driveSelect only if lower saturation voltage is not critical and base drive capability is sufficient
BSP52NPN complement; identical package, pinout, and ratings except polarity; VCEO = 45 V, IC = 1 A, hFE ≥ 1000Used in low-side switching; requires inverted control signal and different biasing topologyChoose for complementary push-pull or H-bridge designs where both polarities are needed

Compared with BCP53, BSP60 delivers 4× higher current gain and logic-compatible drive, while versus BSP52 it provides native high-side switching capability without level-shifting circuitry - critical for automotive load grounding architectures.

Availability

BSP60 is available at Aetrix Electronics and suitable for automotive body electronics, industrial relay interfaces, and DC motor control applications requiring stable component supply, AEC-Q101 compliance, and RoHS-conforming packaging.

Supply support for BSP60 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and discrete power devices, with global manufacturing and quality certification infrastructure.

The BSP60 belongs to Infineon's bipolar transistor portfolio targeting automotive and industrial discrete switching, engineered specifically for high-reliability, medium-current load control with minimal external components.

FAQ

What is the maximum allowable junction temperature for BSP60?

The absolute maximum junction temperature (Tj) is 150 °C, as specified in the Absolute Maximum Ratings table. Operation beyond this limit risks permanent degradation of the Darlington structure and reduced long-term reliability, especially under sustained high-current or elevated ambient conditions.

Can BSP60 be used in linear amplifier mode?

No - BSP60 is optimized and characterized exclusively for switching operation. Its Darlington architecture exhibits poor linearity, high thermal sensitivity, and undefined small-signal parameters; use only in saturated on/off states per datasheet switching test conditions.

Is the SOT223 package lead-free and compatible with standard reflow profiles?

Yes - BSP60 uses a Pb-free (RoHS-compliant) SOT223 package qualified for standard lead-free reflow soldering (J-STD-020D), with peak temperature tolerance up to 260 °C for 30 seconds and thermal profile compatibility verified per Infineon's application note AN077.

How does BSP60 handle load dump transients in automotive 12 V systems?

BSP60 withstands load dump events up to 45 V (VCEO rating) with margin, but requires external clamping (e.g., TVS diode) for full ISO 7637-2 Pulse 5a compliance. Its AEC-Q101 qualification confirms robustness against repetitive surge stress when properly protected in system design.

BSP60 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
TO-261-4, TO-261AA
Packaging:
Bulk
Product Status:
Active
Transistor Type:
PNP - Darlington
Current - Collector (Ic) (Max):
1 A
Voltage - Collector Emitter Breakdown (Max):
45 V
Vce Saturation (Max) @ Ib, Ic:
1.8V @ 1mA, 1A
Current - Collector Cutoff (Max):
10µA
DC Current Gain (hFE) (Min) @ Ic, Vce:
2000 @ 500mA, 10V
Power - Max:
1.5 W
Frequency - Transition:
200MHz
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-SOT223-4-21

BSP60 FAQ

1.How can I place an order for BSP60 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSP60 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSP60 reliable?

The price and inventory of BSP60 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP60 is usually 5 days.

3.What payment methods are accepted for BSP60?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP60 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSP60?

BSP60 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSP60 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSP60?

For technical support, including BSP60 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP60 requirements.

6.How does Aetrix verify that BSP60 is sourced from the original manufacturer or authorized distributors?

All BSP60 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP60 meets industry standards.

7.What is the process for return or replacement of BSP60?

All BSP60 units undergo pre-shipment inspection (PSI). If there is an issue with BSP60, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSP60 part is unused and in its original packaging.

Return procedure for BSP60:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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