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Home > Products > Discrete Semiconductor Products > Transistors > Bipolar (BJT) > Single Bipolar Transistors

Nexperia USA Inc. BSP62,115

Name: BSP62,115
Brand: Nexperia USA Inc.
SKU: BSP62,115
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BSP62,115

Manufacturer:: Nexperia USA Inc.

Category:: Single Bipolar Transistors

Package:: TO-261-4, TO-261AA

Datasheet:: BSP62,115.pdf

Description:: TRANS PNP DARL 80V 1A SOT-223

Quantity:: RFQ Add To RFQ list

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Product details

Overview

BSP62 from Nexperia is a PNP Darlington transistor in SOT223 (SC-73) package, designed for high-current industrial switching with -80 V V_CE_S, -1 A continuous I_C, and integrated base-emitter diode/resistor network. It drives solenoids, relays, and print hammers where low saturation voltage and high DC gain (>1000 at -150 mA) are critical.

For engineers reviewing the BSP62 datasheet, BSP62 pinout, BSP62 application, or BSP62 equivalent, this page delivers verified electrical specs, thermal resistance (R_th(j-sp) = 17 K/W), switching times (t_on = 400 ns, t_off = 1500 ns), and real-world use context for industrial load control.

Technical Context

The BSP62 implements a monolithic PNP Darlington pair with built-in base-emitter clamping diode and series base resistor-eliminating external bias components in relay/solenoid driver circuits. Its V_CE_S = -80 V and V_CBO = -90 V support robust operation in inductive load environments with flyback transients.

Thermal design is enabled by the SOT223's exposed collector pad: R_th(j-a) = 98 K/W on FR4 (1 cm² copper), R_th(j-sp) = 17 K/W to solder point. Switching performance is characterized at T_j = 25 °C and 150 °C, with V_CEsat = -1.3 V at -500 mA / -0.5 mA drive.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CE_S	-80 V - Maximum safe collector-emitter voltage with base shorted to emitter; defines inductive load flyback tolerance.
I_C	-1 A - Continuous DC collector current; supports direct driving of 12 V/24 V solenoids and relays without heatsinking.
h_FE	1000–2000 - DC current gain at -150 mA and -500 mA; enables low-base-current control of high-power loads.
V_CEsat	-1.3 V @ -500 mA / -0.5 mA - Low saturation voltage reduces power loss and self-heating during active conduction.
t_off	1500 ns - Turn-off time under defined test conditions; determines maximum switching frequency in PWM-driven loads.
R_th(j-sp)	17 K/W - Junction-to-solder-point thermal resistance; enables accurate PCB-level thermal modeling for reliability.

Pinout & Package

SOT223 (SC-73) surface-mount plastic package with 4 leads (pins 1–4), 2.3 mm pitch, 6.5 mm × 3.5 mm × 1.65 mm body, and exposed collector pad for thermal dissipation.

Pin/Terminal	Circuit Role	Design Meaning
1	Base	Input control terminal; internally connected to base resistor network and clamping diode anode.
2	Collector	Main power output terminal; electrically tied to pin 4 and thermally bonded to exposed metal pad.
3	Emitter	Common return path for load current; connects to internal Darlington emitter node.
4	Collector	Second collector connection; redundant pin for enhanced current handling and thermal conduction.

Key Features

Feature	Design Value
Integrated base resistor + clamping diode	Eliminates need for external bias components in relay/solenoid drivers, reducing BOM count and PCB area.
High DC current gain (h_FE ≥ 1000)	Enables microcontroller GPIO-level drive (-0.5 mA base current suffices for -500 mA load).
Low V_CEsat (-1.3 V)	Minimizes conduction loss (<0.65 W at -500 mA), allowing operation without heatsink in ambient ≤ 70 °C.
Exposed collector pad (SOT223)	Provides low-impedance thermal path to PCB copper; R_th(j-sp) = 17 K/W enables predictable thermal management.

Applications

Print Hammer Driver

Solenoid Actuator Control

Use Scenario: Driving electromagnetic print hammers in dot-matrix printers requiring fast, high-current pulses.

IC Role / Device Role / Timing Role: High-gain PNP Darlington switch delivering -1 A peak current with <1.5 µs turn-off to enable precise dot timing.

Use Value: Integrated base resistor and diode simplify gate drive circuitry; low V_CEsat prevents thermal shutdown during burst-mode operation.

Use Scenario: Controlling 24 V DC solenoids in industrial valves and pneumatic systems.

IC Role / Device Role / Timing Role: Load switch interfacing PLC outputs to inductive solenoid coils, absorbing flyback energy via internal clamp diode.

Use Value: V_CE_S = -80 V withstands >2× supply voltage flyback spikes; R_th(j-sp) = 17 K/W ensures stable operation at 100% duty cycle.

Relay Coil Driver

Lamp Load Switch

Use Scenario: Replacing mechanical relays in programmable logic controllers for contactor control.

IC Role / Device Role / Timing Role: Solid-state replacement for electromechanical relay coils, providing silent, wear-free switching with TTL/CMOS-compatible input.

Use Value: h_FE ≥ 2000 at -500 mA allows single-stage drive from MCU pins; integrated diode suppresses coil-induced voltage spikes.

Use Scenario: Switching incandescent or halogen lamps in building automation and signage systems.

IC Role / Device Role / Timing Role: High-current PNP switch managing inrush currents up to -2 A (I_CM) during cold filament startup.

Use Value: I_CM = -2 A handles 10× steady-state lamp current; low V_CEsat avoids visible dimming during sustained illumination.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP Darlington switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
ON Semiconductor NSS12201LT1G	PNP Darlington in SOT-23; lower I_C (-500 mA), higher V_CEsat (-1.5 V), no integrated diode.	Best for space-constrained low-power loads; requires external flyback diode and base resistor.	Select when board area is critical and load current ≤ 500 mA; verify external component overhead.
Diodes Incorporated DXT695BK-13	PNP Darlington in SOT223; identical I_C (-1 A), but V_CE_S = -60 V and no integrated diode.	Suitable for ≤24 V systems only; demands external clamping for inductive loads above 24 V.	Choose only if V_CE_S margin >10 V is acceptable and external diode routing is feasible.

Compared with NSS12201LT1G and DXT695BK-13, the BSP62 uniquely combines -80 V breakdown, integrated protection, and SOT223 thermal performance-making it optimal for 24–48 V industrial switching where reliability and BOM simplification are prioritized over ultra-small footprint.

Availability

BSP62 is available at Aetrix Electronics and suitable for industrial switching, relay/solenoid control, and print mechanism applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for BSP62 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive, industrial, and mobile markets.

The BSP62 belongs to Nexperia's general-purpose bipolar transistor family, engineered specifically for robust industrial load switching-emphasizing ruggedness, thermal stability, and integration of passive protection elements.

FAQ

What is the maximum junction temperature and how does it affect continuous operation?

The BSP62 has a maximum junction temperature (T_j) of 150 °C. At ambient temperatures up to 70 °C, its 1.25 W total power dissipation (P_tot) and R_th(j-a) = 98 K/W allow continuous -1 A operation only with adequate PCB copper area. Derating is required above 70 °C ambient per the datasheet's thermal curves.

Does the BSP62 require an external flyback diode when driving inductive loads?

No-the BSP62 integrates a base-emitter clamping diode that provides inherent protection against inductive kickback during turn-off. This eliminates the need for an external flyback diode in most relay and solenoid applications, reducing component count and layout complexity.

How does the dual-collector pin configuration (pins 2 and 4) impact PCB layout?

Pins 2 and 4 are internally connected to the same collector node and the exposed metal pad. Both must be soldered to a common large copper pour for optimal thermal and current-handling performance. Splitting them across separate traces degrades R_th(j-sp) and increases resistive loss.

Can the BSP62 replace the NPN BSP52 in the same circuit?

No-BSP62 (PNP) and BSP52 (NPN) are complementary devices with opposite polarity and biasing requirements. Swapping them would invert logic and likely damage the circuit. They are intended for mirrored topologies (e.g., high-side vs. low-side switching), not drop-in substitution.

BSP62,115 Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: -

Package/Case:: TO-261-4, TO-261AA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Transistor Type:: PNP - Darlington

Current - Collector (Ic) (Max):: 1 A

Voltage - Collector Emitter Breakdown (Max):: 80 V

Vce Saturation (Max) @ Ib, Ic:: 1.3V @ 500µA, 500mA

Current - Collector Cutoff (Max):: 50nA

DC Current Gain (hFE) (Min) @ Ic, Vce:: 2000 @ 500mA, 10V

Power - Max:: 1.25 W

Frequency - Transition:: 200MHz

Operating Temperature:: 150°C (TJ)

Grade:: Automotive

Qualification:: AEC-Q101

Mounting Type:: Surface Mount

Supplier Device Package:: SOT-223

BSP62,115 FAQ

1.How can I place an order for BSP62,115 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSP62,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSP62,115 reliable?

The price and inventory of BSP62,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP62,115 is usually 5 days.

3.What payment methods are accepted for BSP62,115?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP62,115 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSP62,115?

BSP62,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSP62,115 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSP62,115?

For technical support, including BSP62,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP62,115 requirements.

6.How does Aetrix verify that BSP62,115 is sourced from the original manufacturer or authorized distributors?

All BSP62,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP62,115 meets industry standards.

7.What is the process for return or replacement of BSP62,115?

All BSP62,115 units undergo pre-shipment inspection (PSI). If there is an issue with BSP62,115, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSP62,115 part is unused and in its original packaging.

Return procedure for BSP62,115:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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